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PCI2050BIPDVG4

Texas Instruments

PCI2050BIPDVG4 by Texas Instruments

PCI2050BIPDVG4 by Texas Instruments is a Bus Controller with 32-bit Address and External Data Bus Width. It operates at 66 MHz clock frequency, suitable for PCI bus compatibility. The IC has a terminal pitch of 0.5 mm, GULL WING form, and is ideal for industrial temperature grade applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,003 parts In-Stock

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8,003

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Chip Stock

USA . 3,170 parts In-Stock

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3,170

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Digiode

USA . 514 parts In-Stock

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514

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ACDS - Activité Composants Distribution Service

France . 36 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 553 parts In-Stock

1+ parts

$5.278

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553

$5.278

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One Stop Electronics

USA . 900 parts In-Stock

1+ parts

$35.000

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900

$35.000

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Parana Technologies

USA . 655 parts In-Stock

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$46.579

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655

$46.579

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DigiPath Technology Company

USA . 1,586 parts In-Stock

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$51.289

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1,586

$51.289

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ChromeModa Solutions

Germany . 4,360 parts In-Stock

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$52.336

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$42.916

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$52.336

$42.916

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IDEA Electronic Components Group

UK . 1,070 parts In-Stock

1+ parts

$52.336

100+ parts

$49.719

1k+ parts

$47.102

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1,070

$52.336

$49.719

$47.102

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Corohmni

South Africa . 7 parts In-Stock

1+ parts

$73.274

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7

$73.274

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QUARKTWIN TECHNOLOGY LTD

USA . 10,542 parts In-Stock

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Microchip USA

USA . 2,607 parts In-Stock

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Corphita

USA . 642 parts In-Stock

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642

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Perfect Parts

USA . 81 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 36 parts In-Stock

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Glotronic Ltd.

UK . 29 parts In-Stock

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Overview

Elevate your system performance with the Texas Instruments PCI2050BIPDVG4 bus controller. Crafted with precision and expertise by a renowned manufacturer, this versatile component offers seamless integration and reliable operation for a wide range of applications. From industrial automation to embedded systems, this product delivers unmatched value and efficiency. Experience enhanced functionality and peace of mind knowing you have the best technology at your fingertips. Choose Texas Instruments for unparalleled quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for internal components and ensures durability for long-term use.

Surface Mount: YES

Allows for easy installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of power inputs, making the product compatible with various systems and configurations.

Address Bus Width: 32

Provides ample data transfer capabilities, ensuring efficient communication between components.

Package Shape: SQUARE

Helps in optimizing space utilization on the circuit board, allowing for a more compact and efficient design.

Power Supplies (V): 3.3,3.3/5

Offering multiple power supply options allows for flexibility in system design and compatibility with different power sources.

No. of Terminals: 208

Provides a sufficient number of connection points for integrating the bus controller into a complex system with multiple components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables easy integration into tight spaces on the board and facilitates a streamlined and compact overall system design.

Minimum Supply Voltage: 3 V

Ensures reliable operation even at lower power inputs, making the product versatile and adaptable to various power sources.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments, making the product suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, making it suitable for a wide range of operating environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, ensuring long-lasting and reliable connections.

Terminal Position: QUAD

Facilitates easy and secure mounting on the circuit board, ensuring stable connections during operation.

Maximum Seated Height: 1.6 mm

Low profile design helps in minimizing the overall height of the product, enabling space-efficient system integration.

Width: 28 mm

Compact width allows for efficient use of space on the circuit board, enabling a more streamlined and organized system layout.

External Data Bus Width: 32

Ensures high-speed data transfer between external devices, enhancing overall system performance.

Maximum Clock Frequency: 66 MHz

Supports high-speed data processing and communication, making the product suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

Optimized for easy and efficient soldering during assembly, ensuring reliable connections and long-term performance.

Peak Reflow Temperature °C: 260

Capable of withstanding high-temperature soldering processes, ensuring reliable and robust connections.

Length: 28 mm

Compact length allows for efficient use of space on the circuit board, enabling a more streamlined and organized system layout.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in harsh industrial environments, ensuring longevity and durability in demanding conditions.

Peripheral IC Type: BUS CONTROLLER, PCI

Specifically designed for bus control applications, ensuring compatibility and seamless integration with PCI systems.

Technology: CMOS

Uses CMOS technology for low power consumption and high performance, ensuring efficient operation and longer battery life.

Terminal Form: GULL WING

Gull wing terminals facilitate easy and secure mounting onto the circuit board, ensuring reliable connections and stable operation.

Nominal Supply Voltage: 3.3 V

Optimized for compatibility with standard 3.3V power supplies, ensuring consistent and reliable performance.

Bus Compatibility: PCI

Designed for seamless integration with PCI bus systems, ensuring compatibility and efficient data transfer.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on the circuit board, enabling efficient use of space and a compact design.

Technical Specifications

Bus Controllers PCI2050BIPDVG4 attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

66 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e4

Length:

28 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

208

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP208,1.2SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Trade Compliance

PCI2050BIPDVG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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