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PCI2040PGEG4

Texas Instruments

PCI2040PGEG4 by Texas Instruments

PCI2040PGEG4 by Texas Instruments is a 144-terminal bus controller with 32-bit address and external data bus width. It operates at up to 33 MHz, supporting PCI bus compatibility and achieving a max data transfer rate of 20 MBps. This low-profile, fine-pitch device is ideal for commercial applications requiring high-speed data processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,645 parts In-Stock

1+ parts

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8,645

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Chip Stock

USA . 2,770 parts In-Stock

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2,770

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Digiode

USA . 1,988 parts In-Stock

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1,988

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,349 parts In-Stock

1+ parts

$10.000

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-

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1,349

$10.000

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AZTECH Wire

Italy . 854 parts In-Stock

1+ parts

$18.956

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854

$18.956

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Parana Technologies

USA . 138 parts In-Stock

1+ parts

$27.631

100+ parts

-

1k+ parts

$38.229

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138

$27.631

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$38.229

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DigiPath Technology Company

USA . 2,015 parts In-Stock

1+ parts

$30.425

100+ parts

$27.991

1k+ parts

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2,015

$30.425

$27.991

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ChromeModa Solutions

Germany . 1,825 parts In-Stock

1+ parts

$31.046

100+ parts

$25.458

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1,825

$31.046

$25.458

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IDEA Electronic Components Group

UK . 502 parts In-Stock

1+ parts

$31.046

100+ parts

$29.494

1k+ parts

$27.941

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502

$31.046

$29.494

$27.941

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Corohmni

South Africa . 232 parts In-Stock

1+ parts

$53.925

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232

$53.925

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Corphita

USA . 2,489 parts In-Stock

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2,489

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Overview

Enhance your electronic devices with the high-quality PCI2040PGEG4 bus controller by Texas Instruments. Trusted for their superior manufacturing, Texas Instruments delivers reliable solutions for a wide range of applications. This versatile product offers seamless data transfer, efficient performance, and easy integration into various systems. Experience the value and benefits of this advanced technology, providing you with a competitive edge in the market. Upgrade your devices today with the PCI2040PGEG4 and enjoy unmatched reliability and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material helps in keeping the overall weight of the product low, making it suitable for portable or lightweight applications.

Maximum Supply Voltage: 3.6 V

Allows for a higher voltage input, providing flexibility in power supply options for the device.

Address Bus Width: 32

A wide address bus width allows for efficient data transmission and processing, enhancing the performance of the bus controller.

No. of Terminals: 144

Having a high number of terminals enables seamless connectivity with other components or peripherals, increasing the versatility of the product.

Maximum Data Transfer Rate: 20 MBps

With a high maximum data transfer rate, this bus controller can handle large volumes of data quickly and efficiently.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature ranges, this product is suitable for a wide range of general-purpose applications.

Bus Compatibility: PCI

Designed to work with the PCI bus standard, ensuring compatibility with a wide range of computer systems and devices.

Technical Specifications

Bus Controllers PCI2040PGEG4 attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

33 MHz

Maximum Data Transfer Rate:

20 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

PCI2040PGEG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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