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PCI2050BZHK

Texas Instruments

PCI2050BZHK by Texas Instruments

PCI2050BZHK by Texas Instruments is a PCI bus controller with 32-bit address and data bus width, operating at 66 MHz. It features a max supply voltage of 3.6 V and is suitable for commercial-grade applications requiring PCI bus compatibility. The package style includes a low-profile grid array with 257 terminals in a square shape, making it ideal for surface-mount designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,748 parts In-Stock

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4,748

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Vyrian

USA . 3,185 parts In-Stock

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3,185

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Cyclops Electronics Ltd

UK . 222 parts In-Stock

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222

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Bristol Electronics

USA . 4 parts In-Stock

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Dan-Mar Components

USA . 4 parts In-Stock

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4

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Distributors (Availability)

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AZTECH Wire

Italy . 423 parts In-Stock

1+ parts

$10.376

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423

$10.376

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One Stop Electronics

USA . 788 parts In-Stock

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$21.000

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788

$21.000

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Parana Technologies

USA . 492 parts In-Stock

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$57.042

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492

$57.042

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Corohmni

South Africa . 929 parts In-Stock

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$60.829

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929

$60.829

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DigiPath Technology Company

USA . 2,241 parts In-Stock

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$62.810

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$57.785

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$62.810

$57.785

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ChromeModa Solutions

Germany . 6,120 parts In-Stock

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$64.092

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$52.555

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$64.092

$52.555

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IDEA Electronic Components Group

UK . 2,330 parts In-Stock

1+ parts

$64.092

100+ parts

$60.887

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$57.683

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2,330

$64.092

$60.887

$57.683

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Kepictronics

USA . 6,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,542 parts In-Stock

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Corphita

USA . 3,557 parts In-Stock

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Lixinc

USA . 2,677 parts In-Stock

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Perfect Parts

USA . 179 parts In-Stock

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179

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Microchip USA

USA . 171 parts In-Stock

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171

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Overview

Unlock the power of seamless data transfer with the PCI2050BZHK by Texas Instruments. As a leader in the industry, Texas Instruments delivers unmatched quality and reliability in bus controllers. This versatile device is perfect for a wide range of applications, offering customers the value of fast and efficient data processing. Experience the benefits of high performance and precision engineering with the PCI2050BZHK, setting new standards in data control and management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Provides flexibility in terms of power supply options.

Address Bus Width: 32

Supports high-speed data transfer and efficient communication between components.

Package Shape: SQUARE

Square packages are compact and space-saving, ideal for modern electronic designs.

Power Supplies (V): 3.3,3.3/5

Offers multiple power supply options for various applications and compatibility.

No. of Terminals: 257

Sufficient number of terminals for connecting to other components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style ensures ease of integration and compatibility with modern circuit board designs.

Minimum Supply Voltage: 3 V

Provides a stable power supply for the optimal performance of the bus controller.

Maximum Operating Temperature: 70 °C

Operates efficiently within a wide temperature range, suitable for various environments.

Minimum Operating Temperature: 0 °C

Can withstand low temperatures without compromising performance.

Terminal Finish: TIN SILVER COPPER

Provides high conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Facilitates easy installation and connection in a circuit board setup.

Maximum Seated Height: 1.4 mm

Low profile design ensures compatibility with space-constrained applications.

Width: 16 mm

Compact width for efficient use of space within electronic devices.

External Data Bus Width: 32

Supports wide data bus width for high-speed data transfer capabilities.

Maximum Clock Frequency: 66 MHz

Capable of handling high clock frequencies for enhanced performance.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified duration, ensuring reliability during soldering processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for soldering processes.

Length: 16 mm

Compact length for space-efficient circuit board layouts.

Temperature Grade: COMMERCIAL

Suitable for commercial applications with standard temperature requirements.

Peripheral IC Type: BUS CONTROLLER, PCI

Designed specifically as a bus controller for PCI interfaces, ensuring compatibility and performance.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation.

Terminal Form: BALL

Ball terminals provide reliable connections and ease of installation.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance.

Bus Compatibility: PCI

Designed for PCI bus systems, ensuring seamless integration and compatibility.

Terminal Pitch: 0.8 mm

Fine terminal pitch for compact design and efficient PCB layout.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, suitable for standard manufacturing and handling processes.

Technical Specifications

Bus Controllers PCI2050BZHK attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

66 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B257

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

257

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA257,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

PCI2050BZHK Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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