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PCI2050BPPM

Texas Instruments

PCI2050BPPM by Texas Instruments

BUS CONTROLLER, PCI; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

Median Price

$14.640

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 8,728 parts In-Stock

1+ parts

-

100+ parts

$14.640

1k+ parts

-

10k+ parts

-

8,728

-

$14.640

-

-

Rochester

USA . 8,416 parts In-Stock

1+ parts

-

100+ parts

$12.670

1k+ parts

$11.340

10k+ parts

$10.670

8,416

-

$12.670

$11.340

$10.670

Verical

USA . 5,800 parts In-Stock

1+ parts

-

100+ parts

$15.838

1k+ parts

$14.175

10k+ parts

$13.338

5,800

-

$15.838

$14.175

$13.338

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,518 parts In-Stock

1+ parts

$13.376

100+ parts

-

1k+ parts

-

10k+ parts

-

3,518

$13.376

-

-

-

Vyrian

USA . 3,595 parts In-Stock

1+ parts

$14.080

100+ parts

-

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-

10k+ parts

-

3,595

$14.080

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-

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DigiKey Marketplace

USA . 8,728 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,728

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-

-

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ACDS - Activité Composants Distribution Service

France . 1,010 parts In-Stock

1+ parts

-

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1,010

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-

-

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Bristol Electronics

USA . 50 parts In-Stock

1+ parts

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50

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Electronics Depot

USA . 42 parts In-Stock

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42

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Prism Electronics

USA . 29 parts In-Stock

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29

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,909 parts In-Stock

1+ parts

$12.672

100+ parts

-

1k+ parts

-

10k+ parts

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4,909

$12.672

-

-

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Corohmni

South Africa . 4,868 parts In-Stock

1+ parts

$19.600

100+ parts

-

1k+ parts

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10k+ parts

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4,868

$19.600

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Parana Technologies

USA . 2,217 parts In-Stock

1+ parts

$75.581

100+ parts

-

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10k+ parts

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2,217

$75.581

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DigiPath Technology Company

USA . 2,259 parts In-Stock

1+ parts

$83.224

100+ parts

$76.566

1k+ parts

-

10k+ parts

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2,259

$83.224

$76.566

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IDEA Electronic Components Group

UK . 2,177 parts In-Stock

1+ parts

$84.922

100+ parts

$80.676

1k+ parts

$76.430

10k+ parts

-

2,177

$84.922

$80.676

$76.430

-

ChromeModa Solutions

Germany . 498 parts In-Stock

1+ parts

$84.922

100+ parts

$69.636

1k+ parts

-

10k+ parts

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498

$84.922

$69.636

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A-Z Elektronik GmbH

Germany . 6,680 parts In-Stock

1+ parts

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6,680

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-

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

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3,000

-

-

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Cyclops Electronics Ltd (Excess)

UK . 1,010 parts In-Stock

1+ parts

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1,010

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-

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Glotronic Ltd.

UK . 808 parts In-Stock

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808

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Microchip USA

USA . 123 parts In-Stock

1+ parts

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123

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

-

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Authorized Procurement Solutions

USA . 10 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10

-

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Technical Specifications

Bus Controllers PCI2050BPPM attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

66 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e4

Length:

28 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

208

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP208,1.2SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

4.1 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Trade Compliance

PCI2050BPPM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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