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PCI2050BZWT

Texas Instruments

PCI2050BZWT by Texas Instruments

PCI2050BZWT by Texas Instruments is a 257-terminal bus controller with 32-bit address and data bus width. It operates at a max clock frequency of 66 MHz, making it suitable for PCI bus compatibility applications. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.8 mm.

Median Price

$22.582

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,048 parts In-Stock

1+ parts

$17.423

100+ parts

$15.219

1k+ parts

$10.496

10k+ parts

-

3,048

$17.423

$15.219

$10.496

-

Mouser Electronics

USA . 409 parts In-Stock

1+ parts

$27.740

100+ parts

$17.300

1k+ parts

$17.060

10k+ parts

-

409

$27.740

$17.300

$17.060

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,033 parts In-Stock

1+ parts

$16.552

100+ parts

-

1k+ parts

-

10k+ parts

-

3,033

$16.552

-

-

-

Vyrian

USA . 5,612 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,612

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,665 parts In-Stock

1+ parts

$15.681

100+ parts

-

1k+ parts

-

10k+ parts

-

1,665

$15.681

-

-

-

Corohmni

South Africa . 3,132 parts In-Stock

1+ parts

$15.719

100+ parts

-

1k+ parts

-

10k+ parts

-

3,132

$15.719

-

-

-

Parana Technologies

USA . 1,123 parts In-Stock

1+ parts

$21.807

100+ parts

-

1k+ parts

$22.281

10k+ parts

-

1,123

$21.807

-

$22.281

-

DigiPath Technology Company

USA . 1,625 parts In-Stock

1+ parts

$24.012

100+ parts

-

1k+ parts

-

10k+ parts

-

1,625

$24.012

-

-

-

IDEA Electronic Components Group

UK . 2,238 parts In-Stock

1+ parts

$24.502

100+ parts

$23.277

1k+ parts

$22.052

10k+ parts

-

2,238

$24.502

$23.277

$22.052

-

ChromeModa Solutions

Germany . 1,763 parts In-Stock

1+ parts

$24.502

100+ parts

$20.092

1k+ parts

-

10k+ parts

-

1,763

$24.502

$20.092

-

-

Overview

Unlock seamless data transfer and enhanced system performance with the Texas Instruments PCI2050BZWT Bus Controller. Manufactured by industry leader Texas Instruments, this high-quality product offers superior reliability and compatibility with PCI bus systems. Ideal for applications requiring fast and efficient data processing, this compact device boasts a range of features that ensure optimal performance and ease of integration. Upgrade your system today and experience the benefits of precision engineering and cutting-edge technology with the PCI2050BZWT by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications.

Surface Mount: YES

The surface mount capability allows for easy and quick installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for efficient power management and operation within a safe voltage range.

Address Bus Width: 32

With a wide address bus width of 32, the bus controller can support a large amount of memory and address space, enabling smooth data transfer.

Package Shape: SQUARE

The square package shape provides a compact and uniform design, making it easy to integrate into circuit layouts and save space.

No. of Terminals: 257

The high number of terminals enables connectivity with multiple components, facilitating efficient data transfer and communication within the system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers enhanced signal integrity, thermal performance, and reliability in high-speed applications.

Minimum Supply Voltage: 3 V

The lower minimum supply voltage ensures compatibility with a wide range of power sources while maintaining stable operation.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish provides excellent conductivity, corrosion resistance, and solderability for reliable connections.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy access and soldering during assembly, improving the overall efficiency of the installation process.

Maximum Seated Height: 1.4 mm

The low maximum seated height minimizes the overall profile of the product, allowing for compact designs and installations in space-constrained environments.

Width: 16 mm

The moderate width of 16 mm provides a balance between space-saving and ease of handling, making the product versatile for various applications.

External Data Bus Width: 32

The wide external data bus width of 32 ensures high-speed data transfer and efficient communication with peripheral devices, enhancing overall system performance.

Maximum Clock Frequency: 66 MHz

The high maximum clock frequency of 66 MHz allows for rapid data processing and smooth operation in demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds reduces the risk of thermal stress and soldering defects during assembly, ensuring product reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C enables efficient soldering and bonding of the components, ensuring strong connections and long-term reliability.

Length: 16 mm

The moderate length of 16 mm provides a balanced form factor for easy integration into circuit layouts and compatibility with standard board sizes.

Peripheral IC Type: BUS CONTROLLER, PCI

The peripheral IC type as a bus controller for PCI ensures seamless integration with PCI-compatible systems and peripherals, enhancing system compatibility and interoperability.

Technology: CMOS

The CMOS technology offers low power consumption, high-speed performance, and compatibility with various digital systems, making the product energy-efficient and versatile.

Terminal Form: BALL

The ball terminal form provides reliable connections and easy soldering, ensuring robust electrical connections and long-term durability.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V ensures stable and efficient operation with standard power sources, optimizing performance and reliability.

Bus Compatibility: PCI

The bus compatibility with PCI ensures seamless communication and data transfer with PCI-based devices, enhancing system flexibility and expandability.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm allows for high-density mounting and compact designs without sacrificing connectivity and signal integrity.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates the product's resistance to moisture-induced damage during storage, handling, and assembly, ensuring long-term reliability.

Technical Specifications

Bus Controllers PCI2050BZWT attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

66 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B257

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

257

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA257,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

PCI2050BZWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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