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ONET9901PARGT

Texas Instruments

ONET9901PARGT by Texas Instruments

ONET9901PARGT by Texas Instruments is a telecom IC for SDH and SONET applications. It operates at 3.3V with 16 terminals in a square chip carrier package, suitable for ATM/SONET/SDH circuits. With a temperature range of 0-85°C, it offers high performance in telecommunications systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,772 parts In-Stock

1+ parts

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6,772

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Digiode

USA . 1,998 parts In-Stock

1+ parts

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1,998

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 774 parts In-Stock

1+ parts

$11.299

100+ parts

-

1k+ parts

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774

$11.299

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Parana Technologies

USA . 222 parts In-Stock

1+ parts

$12.385

100+ parts

-

1k+ parts

$12.824

10k+ parts

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222

$12.385

-

$12.824

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DigiPath Technology Company

USA . 938 parts In-Stock

1+ parts

$13.638

100+ parts

-

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938

$13.638

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ChromeModa Solutions

Germany . 3,692 parts In-Stock

1+ parts

$13.916

100+ parts

$11.411

1k+ parts

-

10k+ parts

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3,692

$13.916

$11.411

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IDEA Electronic Components Group

UK . 1,081 parts In-Stock

1+ parts

$13.916

100+ parts

$13.220

1k+ parts

$12.524

10k+ parts

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1,081

$13.916

$13.220

$12.524

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One Stop Electronics

USA . 925 parts In-Stock

1+ parts

$319.000

100+ parts

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925

$319.000

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Corphita

USA . 520 parts In-Stock

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520

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Overview

Elevate your telecommunications with the ONET9901PARGT by Texas Instruments. Designed for SDH and SONET applications, this high-quality ATM/SONET/SDH circuit offers unrivaled performance and reliability. With a compact square package shape and no lead terminal form, this surface mount IC is easy to integrate into your designs. Experience the benefits of its 3.3V power supply and quad terminal position, all while enjoying the value and advantages that Texas Instruments brings to every product they manufacture. Upgrade your telecom systems today with the ONET9901PARGT.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy installation onto PCBs, saving time and effort during manufacturing processes.

Package Shape: SQUARE

Square package shape typically provides better thermal performance and more efficient use of PCB space.

Power Supplies (V): 3.3

Operates at a standard voltage level of 3.3V, ensuring compatibility with existing systems and power sources.

No. of Terminals: 16

Offers a sufficient number of terminals for connecting various components and peripherals, enhancing flexibility in circuit design.

Package Style (Meter): CHIP CARRIER

Chip carrier package style is known for its compact size and excellent thermal properties, optimizing space efficiency and heat dissipation.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures without compromising performance, suitable for demanding environments.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature conditions, ensuring reliability and functionality in various operating environments.

Terminal Position: QUAD

Quad terminal position allows for easy connection and secure attachment to the PCB, improving overall reliability and durability.

Applications: SDH; SONET

Designed specifically for SDH and SONET applications, ensuring compatibility and optimal performance in telecommunications networks.

Terminal Form: NO LEAD

Lead-free terminal form reduces environmental impact and complies with RoHS regulations, promoting sustainability and safety.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

Specialized for ATM, SONET, and SDH circuits, providing essential support functions for reliable and efficient data transmission in telecom networks.

Nominal Supply Voltage: 3.3 V

Operates at a consistent supply voltage of 3.3V, ensuring stable performance and compatibility with standard power sources.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density mounting and precise connections, enhancing overall circuit performance and reliability.

Technical Specifications

ATM/SONET/SDH Circuits ONET9901PARGT attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-XQCC-N16

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

ATM/SONET/SDH ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

ONET9901PARGT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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