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ONET2804TLPY

Texas Instruments

ONET2804TLPY by Texas Instruments

ONET2804TLPY by Texas Instruments is an ATM/SONET/SDH circuit with 76 terminals, operating b/w -40 to 100°C. It supports a supply voltage of 3.3V and has a max current draw of 36mA. Ideal for industrial telecom applications due to its compact rectangular shape and surface-mount design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,554 parts In-Stock

1+ parts

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8,554

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Digiode

USA . 4,881 parts In-Stock

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4,881

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 302 parts In-Stock

1+ parts

$9.928

100+ parts

-

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302

$9.928

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Parana Technologies

USA . 367 parts In-Stock

1+ parts

$15.653

100+ parts

-

1k+ parts

$16.023

10k+ parts

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367

$15.653

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$16.023

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ChromeModa Solutions

Germany . 2,040 parts In-Stock

1+ parts

$17.588

100+ parts

$14.422

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2,040

$17.588

$14.422

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IDEA Electronic Components Group

UK . 1,547 parts In-Stock

1+ parts

$17.588

100+ parts

$16.709

1k+ parts

$15.829

10k+ parts

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1,547

$17.588

$16.709

$15.829

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Microchip USA

USA . 2,888 parts In-Stock

1+ parts

$41.330

100+ parts

$40.740

1k+ parts

$40.440

10k+ parts

$40.140

2,888

$41.330

$40.740

$40.440

$40.140

One Stop Electronics

USA . 1,638 parts In-Stock

1+ parts

$175.000

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1,638

$175.000

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Semicontronic

India . 1,199 parts In-Stock

1+ parts

$551.000

100+ parts

$537.225

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$534.470

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1,199

$551.000

$537.225

$534.470

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Corphita

USA . 3,807 parts In-Stock

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3,807

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DigiPath Technology Company

USA . 474 parts In-Stock

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100+ parts

$15.857

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474

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$15.857

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Corohmni

South Africa . 425 parts In-Stock

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425

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Overview

Enhance your network infrastructure with the ONET2804TLPY by Texas Instruments, a top-tier manufacturer in the industry. This ATM/SONET/SDH circuit offers exceptional quality and reliability, making it perfect for a wide range of applications. With a compact rectangular package shape and no lead terminal form, this product maximizes efficiency without sacrificing performance. Experience the value and benefits of seamless connectivity and optimal data transmission with the ONET2804TLPY. Elevate your network capabilities today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy assembly and reduces the overall size of the product, making it suitable for compact designs.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of board space and easy integration into circuit designs.

No. of Terminals: 76

With a high number of terminals, this product can support complex circuit configurations and functionalities.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliability and stable performance even under harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively in a wide range of temperature environments.

Width: 1.45 mm

The small width of the product enables it to be used in tight spaces and compact electronic devices.

Length: 3.25 mm

The compact length of the product further contributes to its space-saving design and suitability for small electronic applications.

Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT

Being designed specifically for ATM, SONET, and SDH circuits, this product ensures optimal performance and compatibility in telecom applications.

Nominal Supply Voltage: 3.3 V

The 3.3 V nominal supply voltage allows for compatibility with a wide range of electronic systems and power sources.

Technical Specifications

ATM/SONET/SDH Circuits ONET2804TLPY attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Additional Features:

Data rate is 28 Gbps

JESD-30 Code:

R-XUUC-N

Length:

3.25 mm

No. of Functions:

1

No. of Terminals:

76

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Supply Current:

36 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.45 mm

Trade Compliance

ONET2804TLPY Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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