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OMAP3530DCUSA

Texas Instruments

OMAP3530DCUSA by Texas Instruments

OMAP3530DCUSA by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 59 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.65 mm.

Median Price

$48.000

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2 parts In-Stock

1+ parts

-

100+ parts

$48.000

1k+ parts

$42.950

10k+ parts

$40.420

2

-

$48.000

$42.950

$40.420

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,588 parts In-Stock

1+ parts

$50.673

100+ parts

-

1k+ parts

-

10k+ parts

-

2,588

$50.673

-

-

-

Vyrian

USA . 3,040 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,040

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 328 parts In-Stock

1+ parts

$11.150

100+ parts

-

1k+ parts

-

10k+ parts

-

328

$11.150

-

-

-

Corphita

USA . 3,379 parts In-Stock

1+ parts

$48.006

100+ parts

-

1k+ parts

-

10k+ parts

-

3,379

$48.006

-

-

-

Parana Technologies

USA . 112 parts In-Stock

1+ parts

$51.812

100+ parts

-

1k+ parts

-

10k+ parts

-

112

$51.812

-

-

-

DigiPath Technology Company

USA . 10 parts In-Stock

1+ parts

$57.052

100+ parts

$52.488

1k+ parts

-

10k+ parts

-

10

$57.052

$52.488

-

-

ChromeModa Solutions

Germany . 6,409 parts In-Stock

1+ parts

$58.216

100+ parts

$47.737

1k+ parts

-

10k+ parts

-

6,409

$58.216

$47.737

-

-

IDEA Electronic Components Group

UK . 1,064 parts In-Stock

1+ parts

$58.216

100+ parts

$55.305

1k+ parts

$52.394

10k+ parts

-

1,064

$58.216

$55.305

$52.394

-

Kepictronics

USA . 5,320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,320

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Microchip USA

USA . 304 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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304

-

-

-

-

Futuretech Components

Singapore . 185 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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185

-

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-

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Overview

Unlock the power of cutting-edge technology with the OMAP3530DCUSA by Texas Instruments. As a leader in microprocessor innovation, Texas Instruments delivers top-quality products that push the boundaries of what's possible. The OMAP3530DCUSA is versatile and reliable, making it perfect for a wide range of applications. Experience seamless performance, efficient power management, and exceptional reliability with this state-of-the-art microprocessor. Trust Texas Instruments to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microprocessor, making it suitable for various applications.

Integrated Cache: YES

Having integrated cache helps in improving the performance of the microprocessor by reducing data access times.

Maximum Supply Voltage: 1.89 V

The high maximum supply voltage allows for flexibility in power supply options while ensuring stable operation.

Address Bus Width: 26

A wider address bus width allows for efficient data transfer and processing within the microprocessor.

Package Shape: SQUARE

The square package shape enables easy mounting and integration within electronic devices.

Bit Size: 32

A 32-bit architecture provides enhanced computational capabilities and performance for the microprocessor.

Power Supplies (V): 1.1,1.2,1.8,1.8/3

The multiple power supply options ensure compatibility with various voltage requirements in different systems.

No. of Terminals: 423

The large number of terminals allow for connectivity to a wide range of external components and interfaces.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package styles offer efficient heat dissipation and compact design for space-constrained applications.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures energy efficiency and stable performance under varying power conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes the microprocessor suitable for industrial applications with demanding thermal conditions.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the microprocessor to function reliably in harsh environments with extreme cold temperatures.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides corrosion resistance and ensures reliable electrical connections for consistent performance.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy soldering and assembly onto PCBs, enhancing manufacturing efficiency.

Maximum Seated Height: 1.4 mm

The low seated height enables a slim profile for the microprocessor, making it suitable for compact electronic devices.

Width: 16 mm

The compact width dimensions allow for easy integration and placement of the microprocessor in electronic assemblies.

Boundary Scan: YES

The boundary scan feature allows for efficient testing and debugging of the microprocessor during development and production stages.

External Data Bus Width: 16

The external data bus width of 16 bits enables rapid data transfer and processing capabilities for enhanced performance.

Maximum Clock Frequency: 59 MHz

The high maximum clock frequency ensures fast data processing and execution speeds for efficient operation.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time at peak temperature minimizes the risk of component damage during soldering processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the microprocessor's reliability during assembly processes.

Length: 16 mm

The compact length dimensions enable easy installation and placement of the microprocessor in electronic designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating ensures the microprocessor's reliability and performance in harsh operating environments.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC-based microprocessor design offers optimized performance and efficiency for various computing applications.

Technology: CMOS

The CMOS technology provides low power consumption and high-speed operation for energy-efficient performance.

Terminal Form: BALL

The ball terminal form offers reliable electrical connections and ease of soldering during assembly processes.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage ensures stable and efficient power delivery to the microprocessor for reliable operation.

Terminal Pitch: 0.65 mm

The fine terminal pitch allows for compact design and high-density integration of the microprocessor in electronic systems.

Format: FLOATING POINT

The floating-point format enables efficient computation of decimal numbers and complex calculations for enhanced performance.

Moisture Sensitivity Level (MSL): 4

The MSL rating of 4 indicates the level of protection against moisture damage, ensuring the longevity of the microprocessor.

Speed: 600 rpm

The high-speed capability of 600 rpm facilitates rapid data processing and execution for demanding computing tasks.

Low Power Mode: YES

The low power mode feature allows for efficient power management and energy-saving operation to extend battery life in portable devices.

Technical Specifications

Microprocessors OMAP3530DCUSA attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

59 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B423

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

423

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA423,24X24,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.2,1.8,1.8/3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Speed:

600 rpm

Sub-Category:

Graphics Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAP3530DCUSA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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