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MSP430F67791IPEU

Texas Instruments

MSP430F67791IPEU by Texas Instruments

MSP430F67791IPEU by Texas Instruments is a 16-bit microprocessor with 128 terminals, operating at -40 to 85°C. It features 32 RAM words, 524288 ROM words, and supports I2C, SPI, UART buses. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$16.830

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,163 parts In-Stock

1+ parts

$12.976

100+ parts

$11.335

1k+ parts

$7.817

10k+ parts

-

1,163

$12.976

$11.335

$7.817

-

DigiKey

USA . 144 parts In-Stock

1+ parts

$16.830

100+ parts

$11.732

1k+ parts

$11.343

10k+ parts

-

144

$16.830

$11.732

$11.343

-

Mouser Electronics

USA . 62 parts In-Stock

1+ parts

$16.830

100+ parts

$11.340

1k+ parts

$10.840

10k+ parts

-

62

$16.830

$11.340

$10.840

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,934 parts In-Stock

1+ parts

$11.077

100+ parts

-

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-

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4,934

$11.077

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$13.602

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-

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-

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150

$13.602

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Vyrian

USA . 4,528 parts In-Stock

1+ parts

-

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4,528

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,415 parts In-Stock

1+ parts

$10.494

100+ parts

-

1k+ parts

-

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1,415

$10.494

-

-

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Ampacity Inc.

Singapore . 376 parts In-Stock

1+ parts

$11.030

100+ parts

-

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-

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376

$11.030

-

-

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Semicontronic

India . 248 parts In-Stock

1+ parts

$11.030

100+ parts

$10.754

1k+ parts

$10.699

10k+ parts

-

248

$11.030

$10.754

$10.699

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Continental Prestige Electronics

USA . 2,830 parts In-Stock

1+ parts

$13.602

100+ parts

-

1k+ parts

-

10k+ parts

$13.330

2,830

$13.602

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-

$13.330

Netroflash

USA . 50 parts In-Stock

1+ parts

$13.602

100+ parts

-

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50

$13.602

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Corohmni

South Africa . 294 parts In-Stock

1+ parts

$13.602

100+ parts

-

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294

$13.602

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Parana Technologies

USA . 1,033 parts In-Stock

1+ parts

$31.296

100+ parts

-

1k+ parts

$76.843

10k+ parts

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1,033

$31.296

-

$76.843

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Microchip USA

USA . 1,609 parts In-Stock

1+ parts

$32.650

100+ parts

$32.180

1k+ parts

$31.950

10k+ parts

$31.720

1,609

$32.650

$32.180

$31.950

$31.720

DigiPath Technology Company

USA . 1,793 parts In-Stock

1+ parts

$34.461

100+ parts

-

1k+ parts

-

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1,793

$34.461

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ChromeModa Solutions

Germany . 2,881 parts In-Stock

1+ parts

$35.164

100+ parts

$28.834

1k+ parts

-

10k+ parts

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2,881

$35.164

$28.834

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IDEA Electronic Components Group

UK . 1,463 parts In-Stock

1+ parts

$35.164

100+ parts

$33.406

1k+ parts

$31.648

10k+ parts

-

1,463

$35.164

$33.406

$31.648

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Lixinc

USA . 8,565 parts In-Stock

1+ parts

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8,565

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Argo Parts USA

USA . 2,064 parts In-Stock

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2,064

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Overview

Discover the innovative MSP430F67791IPEU by Texas Instruments, a reliable and high-quality microprocessor circuit designed for a wide range of applications. With a robust package body material and impressive technical specifications, this product offers unmatched performance and efficiency. Whether you are working on IoT projects, industrial automation, or consumer electronics, this versatile microprocessor provides the power and flexibility you need to bring your ideas to life. Trust in Texas Instruments' reputation for excellence and invest in the MSP430F67791IPEU for superior results that will exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and can withstand various environmental conditions.

Surface Mount: YES

Easy to integrate onto a circuit board, saving space and allowing for efficient assembly.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs without risk of damage, providing versatility in power supply options.

Package Shape: RECTANGULAR

Optimal shape for compact placement on a PCB, maximizing space efficiency.

Bit Size: 16

Higher bit size allows for more complex operations and precision in computing tasks.

Power Supplies (V): 2/3.3

Compatible with multiple power supply voltages, providing flexibility in system design.

No. of Terminals: 128

Sufficient number of terminals for connecting to other components, enabling effective communication within a system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Streamlined and compact package style for efficient PCB layout and space-saving designs.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage for energy-efficient operation, ideal for battery-powered applications.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without performance degradation, suitable for industrial applications.

CPU Family: MSP430

Part of a reliable and established CPU family known for high performance and efficiency in embedded systems.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely cold temperatures, making it suitable for a wide range of operating environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides good conductivity and corrosion resistance, ensuring long-term reliability in connections.

ADC Channels: YES

Integrated Analog-to-Digital Converter channels for sensor interfacing and data conversion capabilities.

Terminal Position: QUAD

Terminal position optimized for easy soldering and secure connections in a quad configuration.

ROM Words: 524288

Large ROM size for storing program instructions and data, allowing for versatile application programming.

Maximum Seated Height: 1.6 mm

Low-profile design for space-constrained applications and reduced overall system height.

RAM Words: 32

Sufficient RAM storage for temporary data processing and efficient multitasking capabilities.

Width: 14 mm

Compact width dimension for easy integration into tight spaces on a PCB.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand higher reflow temperatures for efficient soldering processes during assembly.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Advanced peripheral IC type that enhances the functionality and performance of the microprocessor in various applications.

RAM Bytes: 32768

Generous amount of RAM storage for data handling and processing operations, ensuring smooth performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall system efficiency.

Terminal Form: GULL WING

Gull wing terminals for secure mechanical and electrical connections, suitable for automated soldering processes.

Maximum Supply Current: 11.75 mA

Low supply current consumption for energy-efficient operation and extended battery life.

Nominal Supply Voltage: 3.3 V

Stable and standard nominal supply voltage for consistent performance and compatibility with various systems.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to the embedded software in the microprocessor.

Bus Compatibility: I2C; SPI; UART

Support for multiple bus interfaces (I2C, SPI, UART) for seamless communication with various external devices and peripherals.

Terminal Pitch: 0.5 mm

Fine terminal pitch for precise soldering and compact PCB layout, enabling high-density mounting solutions.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates good moisture resistance for reliable performance in humid environments.

Speed: 25 rpm

Operates at a speed of 25 rpm, suitable for processing tasks and real-time data handling in applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67791IPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

32

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67791IPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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