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MSP430F67771IPZ

Texas Instruments

MSP430F67771IPZ by Texas Instruments

MSP430F67771IPZ by Texas Instruments is a 16-bit MCU with 262144 ROM words and 32 RAM words. Operating at -40 to 85 °C, it features ADC channels, I2C/SPI/UART compatibility, and consumes up to 11.75 mA current. Ideal for industrial applications requiring a low-profile, fine-pitch package design.

Median Price

$10.732

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,781 parts In-Stock

1+ parts

$8.245

100+ parts

$6.722

1k+ parts

$4.481

10k+ parts

-

1,781

$8.245

$6.722

$4.481

-

Mouser Electronics

USA . 1 parts In-Stock

1+ parts

$13.220

100+ parts

$7.500

1k+ parts

$7.190

10k+ parts

-

1

$13.220

$7.500

$7.190

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,554 parts In-Stock

1+ parts

$7.833

100+ parts

-

1k+ parts

-

10k+ parts

-

4,554

$7.833

-

-

-

Vyrian

USA . 7,045 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,045

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,456 parts In-Stock

1+ parts

$7.420

100+ parts

-

1k+ parts

-

10k+ parts

-

1,456

$7.420

-

-

-

Corohmni

South Africa . 2,891 parts In-Stock

1+ parts

$10.310

100+ parts

-

1k+ parts

-

10k+ parts

-

2,891

$10.310

-

-

-

Microchip USA

USA . 2,490 parts In-Stock

1+ parts

$22.560

100+ parts

$22.230

1k+ parts

$22.070

10k+ parts

$21.910

2,490

$22.560

$22.230

$22.070

$21.910

Parana Technologies

USA . 121 parts In-Stock

1+ parts

$73.983

100+ parts

-

1k+ parts

-

10k+ parts

-

121

$73.983

-

-

-

DigiPath Technology Company

USA . 855 parts In-Stock

1+ parts

$81.464

100+ parts

$74.947

1k+ parts

-

10k+ parts

-

855

$81.464

$74.947

-

-

ChromeModa Solutions

Germany . 3,060 parts In-Stock

1+ parts

$83.127

100+ parts

$68.164

1k+ parts

-

10k+ parts

-

3,060

$83.127

$68.164

-

-

IDEA Electronic Components Group

UK . 1,712 parts In-Stock

1+ parts

$83.127

100+ parts

$78.971

1k+ parts

$74.814

10k+ parts

-

1,712

$83.127

$78.971

$74.814

-

Component Stockers USA

USA . 941 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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941

-

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Overview

Unlock the power of innovation with the MSP430F67771IPZ from Texas Instruments. Designed with precision and expertise, this microprocessor circuit offers endless possibilities in various applications. With its cutting-edge technology and reliable performance, this device guarantees seamless operation and efficiency. Whether you're looking to enhance your IoT devices or streamline your industrial systems, the MSP430F67771IPZ provides the perfect solution. Trust Texas Instruments to deliver quality and excellence, bringing value and benefits to your projects like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product durable and resistant to damage, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, making it versatile for different applications.

Package Shape: SQUARE

The square shape makes the product compact and space-efficient, ideal for designs with limited board space.

Bit Size: 16

A 16-bit architecture allows for higher computational power and precision, making the product suitable for complex tasks and calculations.

Power Supplies (V): 2/3.3

Having multiple power supply options allows for flexibility in voltage selection, accommodating different system requirements.

No. of Terminals: 100

A high number of terminals provide numerous connection points, enabling connectivity with various external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact and low-profile design with fine pitch, enhancing the overall space efficiency and improving PCB layout.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage ensures efficient power consumption and compatibility with a wide range of voltage sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and maintain stable performance in challenging settings.

CPU Family: MSP430

Being part of the MSP430 family signifies reliability, quality, and advanced features, making this product a trusted choice for various applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function even in extreme cold environments, expanding its usability range.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections for optimal performance.

ADC Channels: YES

Having ADC channels allows for analog-to-digital conversion, enabling the product to interface with analog sensors and signals.

Terminal Position: QUAD

The quad terminal position facilitates easy soldering and mounting on the PCB, simplifying the assembly process.

ROM Words: 262144

The large ROM capacity of 262144 words allows for storing extensive program data and instructions, supporting complex applications and firmware updates.

Maximum Seated Height: 1.6 mm

With a low seated height, the product can fit into compact spaces and slim designs, enhancing the overall flexibility in product integration.

RAM Words: 32

Although not large, the 32-word RAM capacity provides temporary data storage for efficient processing and multitasking capabilities.

Width: 14 mm

The compact width of 14 mm allows for space-efficient PCB layouts and system designs, especially in constrained environments.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper solder reflow during assembly, reducing the risk of soldering defects.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C enables effective soldering and component attachment, ensuring robust connections and reliability.

Length: 14 mm

The compact length of 14 mm complements the width and package shape, contributing to a space-efficient and sleek design overall.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges indicates the product's reliability, durability, and suitability for harsh operating conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Featuring a microprocessor circuit as a peripheral IC type enhances the product's processing capabilities, offering advanced functionality and performance.

RAM Bytes: 32768

The RAM capacity of 32768 bytes allows for efficient data storage and manipulation during operation, supporting smooth and reliable system performance.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high reliability, and compatibility with modern digital systems, making the product energy-efficient and cost-effective.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and rework, providing a secure and reliable connection for stable electrical performance.

Maximum Supply Current: 11.75 mA

The moderate maximum supply current of 11.75 mA enables energy-efficient operation and compatibility with various power sources, enhancing system flexibility.

Nominal Supply Voltage: 3.3 V

Having a stable nominal supply voltage of 3.3 V ensures consistent and reliable power delivery, supporting proper functionality and performance.

ROM Programmability: FLASH

Utilizing flash ROM programmability offers flexibility for firmware updates and customization, allowing the product to adapt to changing requirements and advancements.

Bus Compatibility: I2C; SPI; UART

Supporting multiple bus interfaces like I2C, SPI, and UART enhances connectivity options and enables seamless communication with various external devices and peripherals.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density mounting and precise soldering, promoting efficient PCB layout and assembly.

Moisture Sensitivity Level (MSL): 3

With an MSL rating of 3, the product can withstand moderate exposure to moisture during storage and handling, ensuring proper functionality and reliability.

Speed: 25 rpm

The speed of 25 rpm denotes the product's processing capabilities and efficiency in handling tasks, making it suitable for applications requiring moderate computing performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67771IPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67771IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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