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MSP430F6775AIPEU

Texas Instruments

MSP430F6775AIPEU by Texas Instruments

MSP430F6775AIPEU by Texas Instruments is a 16-bit microprocessor with 128 terminals, operating at up to 0.032768 MHz. It features 6-Ch 10-Bit ADCs, 3 DMA channels, and peripherals like BOR and RTC. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$10.597

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,803 parts In-Stock

1+ parts

$8.644

100+ parts

$7.047

1k+ parts

$4.698

10k+ parts

-

1,803

$8.644

$7.047

$4.698

-

Mouser Electronics

USA . 6 parts In-Stock

1+ parts

$12.550

100+ parts

$6.930

1k+ parts

-

10k+ parts

$6.600

6

$12.550

$6.930

-

$6.600

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 973 parts In-Stock

1+ parts

$8.212

100+ parts

-

1k+ parts

-

10k+ parts

-

973

$8.212

-

-

-

Vyrian

USA . 8,548 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,548

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,328 parts In-Stock

1+ parts

$7.780

100+ parts

-

1k+ parts

-

10k+ parts

-

3,328

$7.780

-

-

-

Microchip USA

USA . 2,222 parts In-Stock

1+ parts

$31.610

100+ parts

$31.160

1k+ parts

$30.930

10k+ parts

$30.710

2,222

$31.610

$31.160

$30.930

$30.710

Parana Technologies

USA . 21 parts In-Stock

1+ parts

$70.355

100+ parts

-

1k+ parts

-

10k+ parts

-

21

$70.355

-

-

-

Corohmni

South Africa . 4,967 parts In-Stock

1+ parts

$73.162

100+ parts

-

1k+ parts

-

10k+ parts

-

4,967

$73.162

-

-

-

DigiPath Technology Company

USA . 1,523 parts In-Stock

1+ parts

$77.470

100+ parts

$71.272

1k+ parts

-

10k+ parts

-

1,523

$77.470

$71.272

-

-

IDEA Electronic Components Group

UK . 1,754 parts In-Stock

1+ parts

$79.051

100+ parts

$75.098

1k+ parts

$71.146

10k+ parts

-

1,754

$79.051

$75.098

$71.146

-

ChromeModa Solutions

Germany . 840 parts In-Stock

1+ parts

$79.051

100+ parts

$64.822

1k+ parts

-

10k+ parts

-

840

$79.051

$64.822

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 27,360 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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27,360

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-

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Component Stockers USA

USA . 853 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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853

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments MSP430F6775AIPEU microprocessor circuit. Designed for industrial-grade applications, this high-quality product offers unparalleled performance and reliability. With features like multiple ADC channels, DMA capabilities, and a variety of peripherals, the MSP430F6775AIPEU is perfect for a wide range of functions. Whether you're working on IoT devices, consumer electronics, or industrial automation, this microprocessor will streamline your development process and deliver exceptional results. Trust Texas Instruments to provide the innovative solutions you need to succeed in today's fast-paced world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and lightweight, ideal for portable electronic devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power options for the product.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the circuit board.

Bit Size: 16

The 16-bit architecture provides enhanced performance and processing capabilities.

No. of Terminals: 128

The high number of terminals allows for connectivity to various external components and peripherals.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage ensures efficient power consumption of the product.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in industrial environments.

CPU Family: MSP430

The MSP430 family of CPUs is known for its low power consumption and high performance, making it suitable for battery-operated devices.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function in extreme environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections.

ADC Channels: YES

The analog to digital converter channels allow for accurate measurement and data acquisition from external sensors.

DMA Channels: YES

The direct memory access channels enable efficient data transfer without CPU intervention, improving overall performance.

ROM Words: 131072

The large ROM capacity allows for storing a significant amount of program data for complex applications.

RAM Words: 16

The RAM capacity provides temporary storage for data and variables during program execution.

Peripherals: BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

The various peripherals offer additional functionality and features to the product, enhancing its versatility.

Maximum Clock Frequency: 0.032768 MHz

The high clock frequency allows for fast and efficient processing of instructions.

Terminal Position: QUAD

The quad terminal position simplifies the assembly process and ensures proper alignment on the circuit board.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in harsh environmental conditions.

Analog To Digital Convertors: 6-Ch 10-Bit

The multiple ADC channels with 10-bit resolution enable accurate analog signal conversion.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage provides a stable power source for the product's operation.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

The various connectivity options allow for communication with different external devices and systems.

RAM Bytes: 16384

The large RAM capacity enables efficient data storage and manipulation during program execution.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, enhancing the product's efficiency.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering during assembly.

ROM Programmability: FLASH

The flash programmable ROM allows for easy and quick reprogramming of the device's memory.

Bus Compatibility: I2C; SPI; UART

The bus compatibility with I2C, SPI, and UART interfaces ensures seamless integration with a wide range of devices and systems.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level indicates the product's resistance to moisture-related damage during storage and handling.

Speed: 25 rpm

The high speed capability allows for fast data processing and communication within the system.

On Chip Program ROM Width: 8

The on-chip program ROM width of 8 bits provides sufficient storage capacity for program instructions.

No. of I/O Lines: 90

The high number of I/O lines allows for versatile connectivity and interface options with external devices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6775AIPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6775AIPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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