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MSP430F67681IPEU

Texas Instruments

MSP430F67681IPEU by Texas Instruments

MSP430F67681IPEU by Texas Instruments is a 16-bit microprocessor with 128 terminals, operating at -40 to 85°C. It features 524288 ROM words, 16384 RAM bytes, and supports I2C, SPI, UART buses. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$11.544

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 758 parts In-Stock

1+ parts

$11.544

100+ parts

$10.083

1k+ parts

$6.954

10k+ parts

-

758

$11.544

$10.083

$6.954

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,229 parts In-Stock

1+ parts

$10.967

100+ parts

-

1k+ parts

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2,229

$10.967

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Vyrian

USA . 3,283 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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3,283

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,030 parts In-Stock

1+ parts

$10.390

100+ parts

-

1k+ parts

-

10k+ parts

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2,030

$10.390

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-

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Corohmni

South Africa . 644 parts In-Stock

1+ parts

$13.171

100+ parts

-

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644

$13.171

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AZTECH Wire

Italy . 896 parts In-Stock

1+ parts

$14.960

100+ parts

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896

$14.960

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Parana Technologies

USA . 1,995 parts In-Stock

1+ parts

$33.189

100+ parts

-

1k+ parts

$120.523

10k+ parts

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1,995

$33.189

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$120.523

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Microchip USA

USA . 2,796 parts In-Stock

1+ parts

$36.380

100+ parts

$35.860

1k+ parts

$35.600

10k+ parts

$35.340

2,796

$36.380

$35.860

$35.600

$35.340

DigiPath Technology Company

USA . 491 parts In-Stock

1+ parts

$36.545

100+ parts

$33.622

1k+ parts

-

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491

$36.545

$33.622

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ChromeModa Solutions

Germany . 4,534 parts In-Stock

1+ parts

$37.291

100+ parts

$30.579

1k+ parts

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4,534

$37.291

$30.579

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IDEA Electronic Components Group

UK . 515 parts In-Stock

1+ parts

$37.291

100+ parts

$35.426

1k+ parts

$33.562

10k+ parts

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515

$37.291

$35.426

$33.562

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Component Stockers USA

USA . 567 parts In-Stock

1+ parts

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100+ parts

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567

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Overview

Unlock the full potential of your electronics with the Texas Instruments MSP430F67681IPEU microprocessor circuit. Designed for industrial-grade applications, this high-quality MCU offers unmatched performance and reliability. With its 16-bit architecture, low power consumption, and flexible bus compatibility, this versatile device is perfect for a wide range of functions. Experience the value and innovation that Texas Instruments brings to the table with the MSP430F67681IPEU. Elevate your projects to new heights with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the product, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount capability enhances ease of installation and reduces PCB space requirements, making it a convenient choice for circuit design.

Maximum Supply Voltage: 3.6 V

Ability to handle a maximum supply voltage of 3.6V allows for flexibility in power supply configurations and compatibility with a wide range of applications.

Package Shape: RECTANGULAR

Rectangular package shape facilitates easy integration into circuit layouts and ensures efficient use of space on the PCB.

Bit Size: 16

16-bit processing capability enables higher precision and performance in data processing, suitable for various computational tasks.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages (2V and 3.3V) offers versatility in power management and compatibility with different power sources.

No. of Terminals: 128

A high number of terminals provides ample connectivity options for peripheral devices and external components, enhancing the product's functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style ensures efficient thermal performance, space-saving design, and ease of PCB assembly.

Minimum Supply Voltage: 1.8 V

Ability to operate at a minimum supply voltage of 1.8V allows for energy-efficient operation and extends the product's applicability in low-power scenarios.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand elevated temperatures, making it suitable for industrial and automotive applications.

CPU Family: MSP430

Being part of the MSP430 CPU family ensures compatibility with existing MSP430-based systems and provides access to a wide range of support resources and development tools.

Minimum Operating Temperature: -40 °C

The product's ability to operate at a minimum temperature of -40°C ensures reliable performance in cold environments or extreme temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish offers enhanced conductivity, corrosion resistance, and solderability for reliable electrical connections.

ADC Channels: YES

Integrated ADC channels enable analog signal conversion directly on the chip, simplifying the design and improving the product's capabilities in sensing and data acquisition.

Terminal Position: QUAD

Quad terminal position layout facilitates easy PCB routing and assembly, reducing the risk of signal interference and ensuring optimal signal integrity.

ROM Words: 524288

Large ROM capacity of 524,288 words provides ample space for program storage, allowing for complex firmware implementations and data storage.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6mm allows for slim and compact device designs, making it suitable for space-constrained applications.

RAM Words: 16

While having a limited RAM capacity of 16 words, it is sufficient for temporary data storage and buffer operations in various applications.

Width: 14 mm

Compact width of 14mm allows for efficient space utilization on the PCB, enabling dense integration of components and reducing overall system footprint.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable solder joints during the assembly process.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures proper solder melting and joint formation during the PCB assembly process, leading to robust connections.

Length: 20 mm

Moderate length of 20mm offers a balanced form factor for easy integration into various PCB layouts without compromising on overall system dimensions.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certification ensures reliable operation in harsh environments and extended temperature ranges, making it suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Integrated microprocessor circuitry enhances the product's processing capabilities and enables standalone operation or interfacing with external devices for versatile functionality.

RAM Bytes: 16384

With a RAM capacity of 16,384 bytes, the product offers sufficient memory for data storage and dynamic operations, supporting diverse application requirements.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with various digital logic circuits, enhancing the product's performance and efficiency.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and robust mechanical connections, enhancing the product's reliability and long-term durability.

Maximum Supply Current: 11.75 mA

Limited maximum supply current of 11.75mA ensures efficient power usage and reduces energy consumption, making it suitable for battery-powered applications.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V provides stable power delivery for consistent performance and ensures compatibility with standard power sources.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and flexible memory management, enabling customization and adaptation to changing system requirements.

Bus Compatibility: I2C; SPI; UART

Support for multiple bus interfaces (I2C, SPI, UART) enables seamless communication with various external devices, expanding the product's connectivity options.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and precise PCB layout, optimizing signal routing and enhancing overall system performance.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates the product's resistance to moisture-related issues during storage and handling, ensuring long-term reliability in varied environments.

Speed: 25 rpm

Operation at a speed of 25 rpm provides quick response times and efficient data processing capabilities, suitable for real-time applications and high-performance tasks.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67681IPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67681IPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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