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MSP430F6766AIPZ

Texas Instruments

MSP430F6766AIPZ by Texas Instruments

MSP430F6766AIPZ by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 16384 RAM bytes. It features 6-Ch 10-Bit ADC channels, PWM channels, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$8.955

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 740 parts In-Stock

1+ parts

$8.955

100+ parts

$7.301

1k+ parts

$4.867

10k+ parts

-

740

$8.955

$7.301

$4.867

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 655 parts In-Stock

1+ parts

$8.507

100+ parts

-

1k+ parts

-

10k+ parts

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655

$8.507

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Vyrian

USA . 7,818 parts In-Stock

1+ parts

-

100+ parts

-

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7,818

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,178 parts In-Stock

1+ parts

$7.631

100+ parts

-

1k+ parts

-

10k+ parts

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2,178

$7.631

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Corphita

USA . 2,473 parts In-Stock

1+ parts

$8.060

100+ parts

-

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2,473

$8.060

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AZTECH Wire

Italy . 1,097 parts In-Stock

1+ parts

$11.370

100+ parts

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1,097

$11.370

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Microchip USA

USA . 2,384 parts In-Stock

1+ parts

$24.500

100+ parts

$24.150

1k+ parts

$23.970

10k+ parts

$23.800

2,384

$24.500

$24.150

$23.970

$23.800

Parana Technologies

USA . 1,146 parts In-Stock

1+ parts

$45.275

100+ parts

-

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1,146

$45.275

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DigiPath Technology Company

USA . 1,919 parts In-Stock

1+ parts

$49.854

100+ parts

-

1k+ parts

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10k+ parts

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1,919

$49.854

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ChromeModa Solutions

Germany . 3,224 parts In-Stock

1+ parts

$50.871

100+ parts

$41.714

1k+ parts

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10k+ parts

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3,224

$50.871

$41.714

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IDEA Electronic Components Group

UK . 1,061 parts In-Stock

1+ parts

$50.871

100+ parts

$48.327

1k+ parts

$45.784

10k+ parts

-

1,061

$50.871

$48.327

$45.784

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Overview

Experience the cutting-edge technology of the MSP430F6766AIPZ by Texas Instruments, a high-quality microprocessor circuit designed to revolutionize your electronic projects. With a wide range of peripherals including BOR, RTC, TIMER, and more, this versatile IC offers unmatched performance and reliability for industrial-grade applications. Benefit from its low profile and fine pitch package style, making it easy to integrate into your designs. Trust in Texas Instruments' reputation for excellence and take your projects to the next level with the MSP430F6766AIPZ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and cost-effectiveness.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for more versatile applications and greater power efficiency.

Bit Size: 16

A larger bit size allows for more complex operations and calculations to be performed.

ADC Channels: YES

Analog to digital converters enable the system to process real-world signals for more accurate data analysis.

Maximum Clock Frequency: 0.032768 MHz

Higher clock frequency allows for faster data processing and response times.

Temperature Grade: INDUSTRIAL

Industrial-grade components are designed to withstand harsh environmental conditions and ensure reliable performance.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Having a microprocessor circuit allows for more advanced control and processing capabilities in the system.

PWM Channels: YES

Pulse width modulation channels enable precise control of output signals for various applications.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Multiple connectivity options ensure compatibility with different communication protocols and devices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6766AIPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6766AIPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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