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MSP430F67651IPEU

Texas Instruments

MSP430F67651IPEU by Texas Instruments

MSP430F67651IPEU by Texas Instruments is a 16-bit microprocessor with 128 terminals, operating at temperatures from -40 to 85°C. It features 131072 ROM words, 16384 RAM bytes, and supports I2C, SPI, and UART bus compatibility. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$7.347

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 758 parts In-Stock

1+ parts

$7.347

100+ parts

$5.990

1k+ parts

$3.993

10k+ parts

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758

$7.347

$5.990

$3.993

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,989 parts In-Stock

1+ parts

$6.980

100+ parts

-

1k+ parts

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1,989

$6.980

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Vyrian

USA . 6,318 parts In-Stock

1+ parts

-

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6,318

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,560 parts In-Stock

1+ parts

$6.612

100+ parts

-

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-

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4,560

$6.612

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Corohmni

South Africa . 566 parts In-Stock

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$8.128

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566

$8.128

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AZTECH Wire

Italy . 414 parts In-Stock

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$11.470

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414

$11.470

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Microchip USA

USA . 1,991 parts In-Stock

1+ parts

$23.150

100+ parts

$22.820

1k+ parts

$22.650

10k+ parts

$22.490

1,991

$23.150

$22.820

$22.650

$22.490

Parana Technologies

USA . 793 parts In-Stock

1+ parts

$35.503

100+ parts

$3,296.991

1k+ parts

$31.953

10k+ parts

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793

$35.503

$3,296.991

$31.953

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DigiPath Technology Company

USA . 239 parts In-Stock

1+ parts

$39.093

100+ parts

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239

$39.093

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ChromeModa Solutions

Germany . 1,735 parts In-Stock

1+ parts

$39.891

100+ parts

$32.711

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1,735

$39.891

$32.711

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IDEA Electronic Components Group

UK . 1,008 parts In-Stock

1+ parts

$39.891

100+ parts

$37.896

1k+ parts

$35.902

10k+ parts

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1,008

$39.891

$37.896

$35.902

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Component Stockers USA

USA . 707 parts In-Stock

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707

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Overview

Unlock the potential of your electronic designs with the MSP430F67651IPEU by Texas Instruments, a high-quality microprocessor circuit that offers unparalleled performance and reliability. With its advanced technology and versatile applications in various industries, this product provides customers with exceptional value and benefits. Whether you're looking to optimize power consumption, enhance system control, or improve overall efficiency, the MSP430F67651IPEU delivers unmatched advantages that will take your projects to the next level. Choose Texas Instruments for cutting-edge solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the integrated circuit, ensuring a longer lifespan for the product.

Maximum Supply Voltage: 3.6 V

Supports a higher voltage range, making it versatile and compatible with a wide range of electrical systems.

Bit Size: 16

16-bit architecture allows for faster processing and more efficient data handling.

Power Supplies (V): 2/3.3

Supports dual voltage power supplies, providing flexibility in power management.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

Flatpack design with low profile and fine pitch terminals allows for efficient space-saving integration on PCBs.

CPU Family: MSP430

The MSP430 CPU family is known for low power consumption and high performance, making it an ideal choice for battery-powered devices.

ADC Channels: YES

Integrated analog-to-digital converters enable the uP to interface with analog sensors and signals.

ROM Words: 131072

Large ROM capacity allows for storing a significant amount of program data and code.

RAM Words: 16

Sufficient RAM capacity for temporary data storage and efficient program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall system reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67651IPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67651IPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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