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LMK04131SQE/NOPB

Texas Instruments

LMK04131SQE/NOPB by Texas Instruments

LMK04131SQE/NOPB by Texas Instruments is a 48-terminal chip carrier with matte tin finish. It operates in industrial temperature range (-40 to 85 °C) and supports SDH and SONET applications. With a nominal voltage of 3.3 V, it features two channels and is suitable for telecom circuits requiring ATM/SONET/SDH support.

Median Price

$9.900

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,960 parts In-Stock

1+ parts

$10.518

100+ parts

$9.187

1k+ parts

$6.336

10k+ parts

-

6,960

$10.518

$9.187

$6.336

-

Rochester

USA . 1,750 parts In-Stock

1+ parts

-

100+ parts

$7.920

1k+ parts

$7.090

10k+ parts

$6.670

1,750

-

$7.920

$7.090

$6.670

Verical

USA . 1,750 parts In-Stock

1+ parts

-

100+ parts

$9.900

1k+ parts

$8.863

10k+ parts

$8.338

1,750

-

$9.900

$8.863

$8.338

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 5,337 parts In-Stock

1+ parts

$8.360

100+ parts

-

1k+ parts

-

10k+ parts

-

5,337

$8.360

-

-

-

Vyrian

USA . 3,265 parts In-Stock

1+ parts

$8.800

100+ parts

-

1k+ parts

-

10k+ parts

-

3,265

$8.800

-

-

-

Anansix

USA . 1,566 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,566

-

-

-

-

SPM Sales

USA . 328 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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328

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,551 parts In-Stock

1+ parts

$5.465

100+ parts

-

1k+ parts

$6.190

10k+ parts

-

1,551

$5.465

-

$6.190

-

DigiPath Technology Company

USA . 1,832 parts In-Stock

1+ parts

$6.018

100+ parts

$5.537

1k+ parts

-

10k+ parts

-

1,832

$6.018

$5.537

-

-

ChromeModa Solutions

Germany . 4,086 parts In-Stock

1+ parts

$6.141

100+ parts

$5.036

1k+ parts

-

10k+ parts

-

4,086

$6.141

$5.036

-

-

IDEA Electronic Components Group

UK . 730 parts In-Stock

1+ parts

$6.141

100+ parts

-

1k+ parts

$5.527

10k+ parts

-

730

$6.141

-

$5.527

-

Corphita

USA . 2,887 parts In-Stock

1+ parts

$7.920

100+ parts

-

1k+ parts

-

10k+ parts

-

2,887

$7.920

-

-

-

Andel Nordic

Denmark . 649 parts In-Stock

1+ parts

$10.709

100+ parts

-

1k+ parts

$10.281

10k+ parts

$10.281

649

$10.709

-

$10.281

$10.281

Lixinc

USA . 16,077 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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16,077

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-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 9,127 parts In-Stock

1+ parts

-

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9,127

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-

-

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A-Z Elektronik GmbH

Germany . 6,515 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,515

-

-

-

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Alle Elektronik GmbH

Germany . 4,343 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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4,343

-

-

-

-

Authorized Procurement Solutions

USA . 2,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,700

-

-

-

-

Overview

Enhance your telecommunication systems with the LMK04131SQE/NOPB by Texas Instruments. Trusted for its exceptional quality and reliability, Texas Instruments delivers cutting-edge ATM/SONET/SDH Circuits that set new industry standards. Ideal for SDH and SONET applications, this product offers unmatched performance and durability. With a focus on precision engineering and advanced technology, this chip carrier with matte tin finish ensures optimal functionality in industrial environments. Trust Texas Instruments to elevate your network infrastructure with the LMK04131SQE/NOPB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and physical stress are a concern.

Surface Mount: YES

The surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and labor costs during production.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and performance in a wide range of environments, making it suitable for industrial applications.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is commonly used in telecom applications, providing compatibility and seamless integration into existing systems.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, the product can withstand moderate exposure to moisture during storage and assembly processes, ensuring long-term functionality and reliability.

Technical Specifications

ATM/SONET/SDH Circuits LMK04131SQE/NOPB attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Texas Instruments

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.28SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

LMK04131SQE/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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