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LM3S9DN6-IQC80-A1

Texas Instruments

LM3S9DN6-IQC80-A1 by Texas Instruments

LM3S9DN6-IQC80-A1 by Texas Instruments is a 32-bit microcontroller with 72 I/O lines, 16.384 MHz clock frequency, and ADC/DMA channels. Ideal for industrial applications requiring a max supply voltage of 3.6V, operating temperature range from -45 to 85 °C, and PWM functionality.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,683 parts In-Stock

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Digiode

USA . 4,277 parts In-Stock

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One Stop Electronics

USA . 1,341 parts In-Stock

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$3.000

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$3.000

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AZTECH Wire

Italy . 330 parts In-Stock

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$19.455

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330

$19.455

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Parana Technologies

USA . 726 parts In-Stock

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$76.136

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726

$76.136

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ChromeModa Solutions

Germany . 2,797 parts In-Stock

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$85.546

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$70.148

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2,797

$85.546

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IDEA Electronic Components Group

UK . 538 parts In-Stock

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$85.546

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$81.269

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$76.991

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538

$85.546

$81.269

$76.991

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Corphita

USA . 2,074 parts In-Stock

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Microchip USA

USA . 375 parts In-Stock

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DigiPath Technology Company

USA . 140 parts In-Stock

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$77.128

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Overview

Unlock the power of innovative technology with the LM3S9DN6-IQC80-A1 microcontroller by Texas Instruments. Crafted with precision and expertise, this cutting-edge device offers unmatched performance and reliability for a wide range of applications. Whether you're looking to enhance your IoT project or streamline your industrial automation system, the LM3S9DN6-IQC80-A1 delivers exceptional value, efficiency, and versatility. Trust in Texas Instruments to elevate your designs to new heights with this top-of-the-line microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

The surface mount capability allows for easy and quick integration onto a PCB, saving space and facilitating mass production.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power supply options for different applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, especially in tight layouts.

Bit Size: 32

The 32-bit architecture enables high-performance computing and processing tasks, suitable for complex applications.

No. of Terminals: 100

The large number of terminals offers versatile connectivity options for interfacing with other devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style allows for compact and space-saving PCB designs, particularly in small form factor devices.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, enhancing versatility in usage.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes the product suitable for industrial environments with extended temperature ranges.

Minimum Operating Temperature: -45 °C

The low minimum operating temperature allows for reliable performance even in harsh cold conditions, making it versatile for various environments.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, essential for interfacing with sensors and capturing real-world data.

DMA Channels: YES

The availability of DMA channels facilitates efficient data transfer and processing, enhancing overall system performance.

Terminal Position: QUAD

The quad terminal position offers flexibility in PCB layout and routing, optimizing space utilization and signal integrity.

Maximum Seated Height: 1.6 mm

The low maximum seated height minimizes the profile of the package, suitable for slim and compact device designs.

Width: 14 mm

The compact width dimension allows for flexibility in PCB placement and integration, ideal for space-constrained applications.

Maximum Clock Frequency: 16.384 MHz

The high maximum clock frequency provides fast processing speed, enabling quick response times and high-performance computing.

Length: 14 mm

The compact length dimension contributes to efficient PCB space utilization, especially in constrained layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments with wide temperature variations, suitable for robust applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller and RISC architecture offer optimized performance for embedded systems, enabling efficient and responsive operation.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and robust mechanical connection, ensuring reliable electrical contact in demanding conditions.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage offers a stable power input for consistent performance, avoiding voltage fluctuations that could impact functionality.

PWM Channels: YES

The availability of PWM channels enables precise control of analog components, useful for applications requiring varied signal modulation.

ROM Programmability: FLASH

The flash ROM programmability allows for flexible firmware updates and customization, enhancing the product's adaptability to changing requirements.

Terminal Pitch: 0.5 mm

The fine terminal pitch provides high density interconnections, allowing for more terminals in a compact space and efficient signal routing.

Speed: 80 rpm

The high speed capability of 80 rpm ensures quick processing and response times, suitable for time-critical applications.

No. of I/O Lines: 72

The ample number of I/O lines offers versatile connectivity options for interfacing with external devices and peripherals, enhancing the product's functionality.

Technical Specifications

Microcontrollers LM3S9DN6-IQC80-A1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

72

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-45 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9DN6-IQC80-A1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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