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LM3S9B95-IQC80-C3

Texas Instruments

LM3S9B95-IQC80-C3 by Texas Instruments

LM3S9B95-IQC80-C3 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 98304 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring ADC and DMA channels, with a temperature range from -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,771 parts In-Stock

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Digiode

USA . 4,538 parts In-Stock

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4,538

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Distributors (Availability)

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One Stop Electronics

USA . 469 parts In-Stock

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$10.000

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469

$10.000

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Parana Technologies

USA . 2,134 parts In-Stock

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$17.242

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$17.458

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2,134

$17.242

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$17.458

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AZTECH Wire

Italy . 827 parts In-Stock

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$17.876

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827

$17.876

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DigiPath Technology Company

USA . 938 parts In-Stock

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$18.986

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938

$18.986

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ChromeModa Solutions

Germany . 4,216 parts In-Stock

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$19.373

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$15.886

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4,216

$19.373

$15.886

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IDEA Electronic Components Group

UK . 11 parts In-Stock

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$19.373

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$18.404

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$17.436

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11

$19.373

$18.404

$17.436

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Corphita

USA . 1,066 parts In-Stock

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Microchip USA

USA . 383 parts In-Stock

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Overview

Unleash the power of innovation with the LM3S9B95-IQC80-C3 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality microcontrollers that are versatile and reliable. Ideal for a wide range of applications, this product offers customers unparalleled value and benefits. Whether you're looking to enhance your automation systems or develop cutting-edge IoT devices, the LM3S9B95-IQC80-C3 is sure to exceed your expectations. Elevate your projects with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards, saving space and streamlining the manufacturing process.

Maximum Supply Voltage: 1.32 V

Can operate within a wide voltage range, providing flexibility in different applications.

Bit Size: 32

Offers a high processing capability, suitable for handling complex tasks and algorithms efficiently.

Power Supplies (V): 1.2,3.3

Supports multiple power supply options, making it versatile for various system requirements.

No. of Terminals: 100

Provides ample connectivity options for interfacing with other components and peripherals.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with wide temperature ranges, ensuring stability and performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing (RISC) architecture for efficient execution of instructions, resulting in high performance.

RAM Bytes: 98304

Offers a substantial amount of random access memory for data storage and processing, enabling the device to handle complex computations.

Technology: CMOS

Based on Complementary Metal-Oxide-Semiconductor technology, providing low power consumption and high noise immunity for reliable operation.

Technical Specifications

Microcontrollers LM3S9B95-IQC80-C3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

65

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9B95-IQC80-C3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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