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LM3S9B95-IQC80-C1T

Texas Instruments

LM3S9B95-IQC80-C1T by Texas Instruments

LM3S9B95-IQC80-C1T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 98304 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring high-speed processing and multiple ADC/DMA channels. With a compact square package style and low seated height of 1.6 mm, it offers efficient integration in space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,020 parts In-Stock

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7,020

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Digiode

USA . 3,501 parts In-Stock

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3,501

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Distributors (Availability)

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AZTECH Wire

Italy . 477 parts In-Stock

1+ parts

$19.052

100+ parts

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477

$19.052

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One Stop Electronics

USA . 523 parts In-Stock

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$27.000

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523

$27.000

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Parana Technologies

USA . 2,046 parts In-Stock

1+ parts

$39.153

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2,046

$39.153

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DigiPath Technology Company

USA . 2,180 parts In-Stock

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$43.112

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2,180

$43.112

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IDEA Electronic Components Group

UK . 959 parts In-Stock

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$43.992

100+ parts

$41.792

1k+ parts

$39.593

10k+ parts

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959

$43.992

$41.792

$39.593

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ChromeModa Solutions

Germany . 164 parts In-Stock

1+ parts

$43.992

100+ parts

$36.073

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164

$43.992

$36.073

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Corphita

USA . 3,967 parts In-Stock

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3,967

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Microchip USA

USA . 346 parts In-Stock

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Overview

Unleash the power of innovation with the LM3S9B95-IQC80-C1T by Texas Instruments. This cutting-edge microcontroller boasts unmatched quality and reliability, ensuring seamless performance in a variety of applications. From industrial automation to consumer electronics, this versatile device offers customers unparalleled value and benefits. With its advanced features and high-speed operation, the LM3S9B95-IQC80-C1T is the ideal choice for those seeking top-notch performance and efficiency. Elevate your projects to new heights with this exceptional microcontroller from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, making it versatile for different power supply requirements.

Bit Size: 32

Offers a good balance between performance and resources, suitable for a wide range of applications.

Power Supplies (V): 1.2,3.3

Supports multiple power supply options, providing flexibility in design and compatibility with various voltage sources.

No. of Terminals: 100

Provides plenty of I/O options for connecting to external components, expanding the functionality of the microcontroller.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments, making it suitable for industrial applications where heat may be a concern.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature environments, ensuring reliability in extreme conditions.

ADC Channels: YES

Allows the microcontroller to convert analog signals to digital, enabling it to interface with sensors and other analog devices.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer, improving overall system performance.

ROM Words: 262144

Large ROM size for storing program code and data, suitable for complex applications with extensive memory requirements.

Maximum Seated Height: 1.6 mm

Low profile design for space-constrained applications, saving valuable PCB real estate.

Width: 14 mm

Compact form factor for small-scale designs, ideal for applications with size restrictions.

Maximum Clock Frequency: 16 MHz

High clock frequency for fast processing speeds, capable of handling demanding computational tasks.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliability and longevity in rugged conditions.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for microcontroller applications, offering a wide range of integrated features and peripherals for diverse functionalities.

RAM Bytes: 98304

Generous RAM size for data storage and processing, enabling multitasking and efficient operation of the microcontroller.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity, enhancing energy efficiency and reliability of the microcontroller.

Terminal Form: GULL WING

Gull wing terminals for easy soldering and reliable connections, simplifying assembly and ensuring robust electrical contact.

PWM Channels: YES

Supports Pulse Width Modulation for precise control of output signals, suitable for applications requiring variable speed or intensity control.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the microcontroller, enabling quick updates and modifications to the firmware.

Terminal Pitch: 0.5 mm

Narrow terminal pitch for high-density mounting, enabling compact PCB layouts and integration in space-constrained designs.

Speed: 80 rpm

Capability to handle processing speeds of up to 80 rotations per minute, suitable for applications requiring real-time data processing or control.

No. of I/O Lines: 65

Sufficient number of I/O lines for interfacing with external devices, sensors, and peripherals, allowing for versatile connectivity options.

Technical Specifications

Microcontrollers LM3S9B95-IQC80-C1T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

65

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9B95-IQC80-C1T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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