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LM3S9B95-IBZ80-C5

Texas Instruments

LM3S9B95-IBZ80-C5 by Texas Instruments

LM3S9B95-IBZ80-C5 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words, 98304 RAM bytes, and 65 I/O lines. It operates at a max clock frequency of 16.384 MHz and is suitable for industrial applications requiring a high-performance Cortex-M3 CPU family microcontroller with ADC and DMA channels.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,821 parts In-Stock

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Digiode

USA . 491 parts In-Stock

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AZTECH Wire

Italy . 895 parts In-Stock

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$7.854

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One Stop Electronics

USA . 296 parts In-Stock

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$32.000

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Parana Technologies

USA . 41 parts In-Stock

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$48.653

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ChromeModa Solutions

Germany . 4,322 parts In-Stock

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$54.666

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$44.826

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IDEA Electronic Components Group

UK . 1,967 parts In-Stock

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$54.666

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$51.933

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$49.199

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Advanced Electronics

New Zealand . 2,863 parts In-Stock

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$55.486

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$54.931

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$52.712

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QUARKTWIN TECHNOLOGY LTD

USA . 22,542 parts In-Stock

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Lixinc

USA . 13,816 parts In-Stock

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DigiPath Technology Company

USA . 2,219 parts In-Stock

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Corphita

USA . 332 parts In-Stock

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Microchip USA

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Kepictronics

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Overview

Unlock endless possibilities with the LM3S9B95-IBZ80-C5 microcontroller from Texas Instruments. Boasting top-notch quality and reliability, this powerful device is perfect for a wide range of applications. From IoT devices to industrial automation, this microcontroller offers unmatched performance and efficiency. Experience seamless operation and unparalleled functionality with the LM3S9B95-IBZ80-C5, making it the ultimate choice for your next project. Trust in Texas Instruments to deliver superior products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers durability and protection for the microcontroller, making it reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and secure installation of the microcontroller onto a PCB, saving space and enabling mass production.

Maximum Supply Voltage: 1.365 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, improving overall energy efficiency.

Package Shape: SQUARE

The square package shape provides uniformity and symmetry, making it easy to integrate the microcontroller into a design layout.

Bit Size: 32

With a 32-bit architecture, the microcontroller can process data and instructions more efficiently, leading to faster performance and higher productivity.

Power Supplies (V): 1.2,3.3

Support for multiple power supply options allows for flexibility in different applications and voltage requirements.

No. of Terminals: 108

Having a high number of terminals enables connectivity with various external components and peripherals, expanding the functionality of the microcontroller.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The advanced package style with grid array, low profile, and fine pitch design enhances signal integrity, reduces signal interference, and offers precise connections for high-speed data transmission.

Minimum Supply Voltage: 1.235 V

The low minimum supply voltage ensures stable operation even under fluctuating power conditions, enhancing the reliability of the microcontroller in diverse environments.

CPU Family: CORTEX-M3

The Cortex-M3 architecture provides high performance and efficiency, making the microcontroller suitable for a wide range of embedded applications requiring real-time processing capabilities.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the microcontroller to operate in extreme cold conditions, ensuring reliable performance in harsh environments.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to interface with analog sensors or devices, expanding its capability to measure and process analog signals.

DMA Channels: YES

DMA channels help in offloading data transfer tasks from the CPU, improving system performance and efficiency by allowing simultaneous data transfers without CPU intervention.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable connections for seamless integration.

ROM Words: 262144

The large ROM capacity allows for storing a vast amount of program code and data, enabling the microcontroller to support complex applications and firmware.

Maximum Seated Height: 1.5 mm

The low profile design with a maximum seated height of 1.5 mm allows for compact and slim PCB designs, saving space and enabling sleek product form factors.

Width: 10 mm

The compact width of 10 mm enables easy integration of the microcontroller into space-constrained designs, offering versatility in product development.

Maximum Clock Frequency: 16.384 MHz

The high clock frequency enables fast processing of instructions, improving system responsiveness and reducing latency for real-time applications.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in harsh industrial environments with varying temperature conditions, making the microcontroller suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with various built-in peripherals, it offers fast and efficient data processing, communication interfaces, and control capabilities for diverse applications.

RAM Bytes: 98304

With a large RAM capacity, the microcontroller can efficiently manage data storage, temporary variables, and stack operations, enhancing multitasking and data processing capabilities.

Technology: CMOS

CMOS technology provides low power consumption, high speed, and reliable operation, making the microcontroller energy-efficient and suitable for battery-powered and portable devices.

Terminal Form: BALL

The ball terminal form ensures secure and reliable connections on the PCB, offering mechanical stability and good thermal performance for robust and durable solder joints.

Nominal Supply Voltage: 1.3 V

The stable nominal supply voltage of 1.3 V ensures consistent and reliable operation of the microcontroller, reducing the risk of voltage fluctuations impacting performance.

PWM Channels: YES

The availability of PWM channels allows for precise control of analog signals, enabling the microcontroller to generate varying voltage levels and pulse widths for applications like motor control and LED brightness adjustment.

ROM Programmability: FLASH

Flash memory-based ROM programmability offers flexibility for firmware updates, code modifications, and data storage, allowing the microcontroller to adapt to evolving application requirements.

Terminal Pitch: 0.8 mm

The tight terminal pitch of 0.8 mm provides high-density connectivity on the PCB, enabling compact designs and efficient use of board space for integrating multiple components.

Moisture Sensitivity Level (MSL): 3

MSL rating of 3 indicates moderate sensitivity to moisture, requiring proper handling and storage to prevent moisture-related damage during assembly and operation.

Speed: 80 rpm

With a speed of 80 rpm, the microcontroller can efficiently process instructions and data at a consistent and reliable pace, ensuring smooth operation in various applications.

No. of I/O Lines: 65

The high number of I/O lines provides versatile connectivity options for interfacing with external devices, sensors, actuators, and peripherals, enabling the microcontroller to interact with the external world effectively.

Technical Specifications

Microcontrollers LM3S9B95-IBZ80-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

65

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S9B95-IBZ80-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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