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LM3S9B95-IBZ80-C1

Texas Instruments

LM3S9B95-IBZ80-C1 by Texas Instruments

LM3S9B95-IBZ80-C1 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 98304 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring up to 65 I/O lines and PWM channels. With a temperature range from -40°C to 85°C, it offers ADC and DMA channels for efficient data processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,230 parts In-Stock

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7,230

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Digiode

USA . 2,236 parts In-Stock

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2,236

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Distributors (Availability)

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AZTECH Wire

Italy . 388 parts In-Stock

1+ parts

$7.639

100+ parts

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388

$7.639

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Ampacity Inc.

Singapore . 1,354 parts In-Stock

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$9.000

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1,354

$9.000

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Semicontronic

India . 740 parts In-Stock

1+ parts

$17.000

100+ parts

$16.575

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$16.490

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740

$17.000

$16.575

$16.490

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One Stop Electronics

USA . 426 parts In-Stock

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$22.000

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426

$22.000

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Parana Technologies

USA . 822 parts In-Stock

1+ parts

$70.777

100+ parts

$6,572.741

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$63.700

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822

$70.777

$6,572.741

$63.700

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DigiPath Technology Company

USA . 1,947 parts In-Stock

1+ parts

$77.934

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1,947

$77.934

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ChromeModa Solutions

Germany . 1,350 parts In-Stock

1+ parts

$79.525

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$65.210

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1,350

$79.525

$65.210

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IDEA Electronic Components Group

UK . 745 parts In-Stock

1+ parts

$79.525

100+ parts

$75.549

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$71.572

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745

$79.525

$75.549

$71.572

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Corphita

USA . 1,986 parts In-Stock

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1,986

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Corohmni

South Africa . 338 parts In-Stock

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338

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Microchip USA

USA . 132 parts In-Stock

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Overview

Unleash the power of innovation with the LM3S9B95-IBZ80-C1 by Texas Instruments. Crafted with precision and expertise, this microcontroller offers unparalleled performance for a wide range of applications. Whether you're in the automotive industry, consumer electronics, or industrial automation, this product delivers seamless integration and reliable operation. Elevate your projects with its advanced features and cutting-edge technology, providing value and efficiency like never before. Embrace the future of microcontrollers with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for portable applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of power sources.

Package Shape: SQUARE

The square package shape provides a compact footprint, ideal for space-constrained designs.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle complex calculations and data processing efficiently.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages allows for flexible voltage requirements, enhancing compatibility with different systems.

No. of Terminals: 108

Having a high number of terminals enables connectivity to various external components and peripherals for expanded functionality.

Package Style (Meter): GRID ARRAY

The grid array package style offers robust physical connections and improved thermal performance for reliable operation.

Minimum Supply Voltage: 3 V

The low minimum supply voltage helps in conserving power and extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in extreme cold environments without compromising functionality.

ADC Channels: YES

The presence of ADC channels enables analog data acquisition, making the microcontroller suitable for sensor interfacing and measurement applications.

DMA Channels: YES

Support for DMA channels enables efficient data transfer between memory and peripherals, enhancing overall system performance.

Terminal Position: BOTTOM

The bottom terminal position eases PCB layout and soldering processes, improving manufacturability.

ROM Words: 262144

Large ROM capacity allows for storing a significant amount of program code, data, and configuration settings.

Maximum Seated Height: 1.5 mm

The low maximum seated height facilitates compact device designs and minimizes overall product dimensions.

Width: 10 mm

The narrow width makes the microcontroller suitable for applications where space is limited.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency enables fast processing speed, making the microcontroller suitable for real-time applications.

Length: 10 mm

The short length contributes to a space-efficient design layout and allows for versatility in placement within a system.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments with fluctuating temperatures.

Peripheral IC Type: MICROCONTROLLER

Designed as a microcontroller, this product offers integrated peripherals and features tailored for embedded control applications.

RAM Bytes: 98304

The ample RAM capacity provides sufficient memory for data storage and manipulation, supporting multitasking and data-intensive operations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form simplifies soldering processes and enhances electrical connections for improved reliability.

Nominal Supply Voltage: 3.3 V

The stable nominal supply voltage ensures consistent and reliable performance under varying load conditions.

PWM Channels: YES

Support for PWM channels enables precise control of analog signals, essential for motor control and power regulation applications.

ROM Programmability: FLASH

Flash programmability allows for easy and quick updates to the program memory, facilitating firmware upgrades and customization.

Terminal Pitch: 0.8 mm

The small terminal pitch enhances signal integrity and reliability in high-density PCB layouts.

Speed: 80 rpm

With a speed of 80 RPM, the microcontroller can process instructions and data quickly, ensuring efficient operation.

No. of I/O Lines: 65

Having a high number of I/O lines enables versatile interfacing with external devices and peripherals, expanding connectivity options.

Technical Specifications

Microcontrollers LM3S9B95-IBZ80-C1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

Length:

10 mm

No. of I/O Lines:

65

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S9B95-IBZ80-C1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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