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LM3S9B92-IQC80-C5

Texas Instruments

LM3S9B92-IQC80-C5 by Texas Instruments

LM3S9B92-IQC80-C5 by Texas Instruments is a 32-bit microcontroller with Cortex-M3 CPU, 262144 ROM words, and 98304 RAM bytes. It operates at up to 16.384 MHz, suitable for industrial applications requiring high-speed processing and ADC/DMA capabilities in a compact package with low profile and fine pitch terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,805 parts In-Stock

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Digiode

USA . 2,246 parts In-Stock

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Chip Stock

USA . 361 parts In-Stock

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361

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Next Level Components, LLC

USA . 55 parts In-Stock

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Kiltronic GmbH

Germany . 2 parts In-Stock

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One Stop Electronics

USA . 703 parts In-Stock

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$1.000

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$1.000

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AZTECH Wire

Italy . 371 parts In-Stock

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$6.254

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Parana Technologies

USA . 1,046 parts In-Stock

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$13.592

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$14.094

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$13.592

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DigiPath Technology Company

USA . 618 parts In-Stock

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$14.967

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ChromeModa Solutions

Germany . 2,381 parts In-Stock

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$15.272

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$12.523

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$15.272

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IDEA Electronic Components Group

UK . 1,614 parts In-Stock

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$15.272

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$14.508

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$13.745

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Authorized Procurement Solutions

USA . 14,400 parts In-Stock

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Lixinc

USA . 10,824 parts In-Stock

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Perfect Parts

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S.R.D Solutions

India . 3,000 parts In-Stock

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Futuretech Components

Singapore . 2,000 parts In-Stock

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Kepictronics

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800

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Corphita

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Microchip USA

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A-Z Elektronik GmbH

Germany . 323 parts In-Stock

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Overview

Unlock the power of innovation with the LM3S9B92-IQC80-C5 microcontroller by Texas Instruments. This cutting-edge device, part of the Cortex-M3 CPU family, offers unparalleled performance and reliability for a wide range of applications. With advanced features such as ADC and DMA channels, PWM capabilities, and a high clock frequency, this microcontroller is designed to meet the demands of industrial-grade projects. Experience seamless integration and efficiency with Texas Instruments' top-quality manufacturing, making the LM3S9B92-IQC80-C5 the ideal choice for your next project. Elevate your designs and bring your ideas to life with this exceptional microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY is a durable and lightweight material, making the microcontroller easy to handle and suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy mounting on circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.365 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making it energy-efficient.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, optimizing the overall design layout.

Bit Size: 32

A 32-bit architecture provides higher processing capabilities and improved performance for demanding applications.

Power Supplies (V): 1.2, 3.3

The availability of multiple power supply voltages allows for versatility in design and compatibility with various systems.

No. of Terminals: 100

Having a high number of terminals enables seamless connectivity with other components, enhancing overall functionality.

Minimum Supply Voltage: 1.235 V

The low minimum supply voltage ensures stable operation even under low power conditions, improving reliability.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can function in demanding environmental conditions without performance degradation.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family offers high-performance computing capabilities, ideal for multitasking and real-time processing requirements.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, making it suitable for sensor interfacing and data acquisition applications.

DMA Channels: YES

DMA channels improve data transfer efficiency and reduce CPU workload, enhancing overall system performance.

ROM Words: 262144

With a large ROM capacity, this microcontroller can store a significant amount of program code and data, suitable for complex applications.

Terminal Position: QUAD

Quad terminal position simplifies the soldering and assembly process, reducing manufacturing time and costs.

Maximum Clock Frequency: 16.384 MHz

A high clock frequency allows for fast data processing and system response times, enhancing overall performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with RISC architecture, it offers efficient instruction execution and reduced power consumption, suitable for embedded applications.

RAM Bytes: 98304

The generous RAM capacity enables efficient data storage and manipulation, essential for multitasking and data-intensive applications.

Terminal Form: GULL WING

Gull wing terminal form enhances solder joint strength and reliability, crucial for robust connections in rugged environments.

PWM Channels: YES

Having PWM channels allows for precise control of connected devices such as motors and LEDs, enabling advanced system control.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in updating firmware and modifying the operating software, essential for product customization and updates.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates good resistance to moisture, ensuring long-term reliability in humid operating conditions.

No. of I/O Lines: 65

A high number of I/O lines provide ample connectivity options, facilitating interface with external sensors, actuators, and peripherals.

Technical Specifications

Microcontrollers LM3S9B92-IQC80-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

65

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9B92-IQC80-C5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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