Loading...

LM3S9B92-IBZ80-C5T

Texas Instruments

LM3S9B92-IBZ80-C5T by Texas Instruments

LM3S9B92-IBZ80-C5T by Texas Instruments is a 32-bit Cortex-M3 microcontroller with 262144 ROM words and 98304 RAM bytes. It operates at a max clock frequency of 16.384 MHz, making it ideal for industrial applications requiring high-speed processing and efficient memory management. With features like ADC and DMA channels, this microcontroller offers versatile functionality for various embedded systems projects.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,070 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,070

-

-

-

-

Digiode

USA . 1,613 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,613

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 414 parts In-Stock

1+ parts

$7.937

100+ parts

-

1k+ parts

-

10k+ parts

-

414

$7.937

-

-

-

One Stop Electronics

USA . 169 parts In-Stock

1+ parts

$8.000

100+ parts

-

1k+ parts

-

10k+ parts

-

169

$8.000

-

-

-

Parana Technologies

USA . 598 parts In-Stock

1+ parts

$31.967

100+ parts

-

1k+ parts

$93.066

10k+ parts

-

598

$31.967

-

$93.066

-

DigiPath Technology Company

USA . 2,168 parts In-Stock

1+ parts

$35.200

100+ parts

-

1k+ parts

-

10k+ parts

-

2,168

$35.200

-

-

-

ChromeModa Solutions

Germany . 5,570 parts In-Stock

1+ parts

$35.918

100+ parts

$29.453

1k+ parts

-

10k+ parts

-

5,570

$35.918

$29.453

-

-

IDEA Electronic Components Group

UK . 437 parts In-Stock

1+ parts

$35.918

100+ parts

$34.122

1k+ parts

$32.326

10k+ parts

-

437

$35.918

$34.122

$32.326

-

Corphita

USA . 4,288 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,288

-

-

-

-

Microchip USA

USA . 450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

450

-

-

-

-

Overview

Unlock the power of innovation with the LM3S9B92-IBZ80-C5T microcontroller by Texas Instruments. As a leader in microcontroller technology, Texas Instruments guarantees top-notch quality and reliability. This versatile microcontroller is perfect for a wide range of applications, offering customers unmatched value and benefits. Whether you're working on IoT devices, consumer electronics, or industrial automation, this microcontroller's advanced features and high performance will take your projects to the next level. Trust Texas Instruments to deliver cutting-edge solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easier integration onto PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 1.365 V

The maximum supply voltage allows for efficient power management and ensures safe operation of the microcontroller.

Package Shape: SQUARE

The square shape makes the microcontroller easy to handle and integrate into compact electronic devices.

Bit Size: 32

A 32-bit architecture provides enhanced processing capabilities and efficiency for handling complex tasks.

Power Supplies (V): 1.2,3.3

Support for multiple power supply options offers flexibility in design and compatibility with various voltage requirements.

No. of Terminals: 108

A higher number of terminals enable connectivity to a wide range of external devices and peripherals for expanded functionality.

Minimum Supply Voltage: 1.235 V

The minimum supply voltage ensures stable operation and power efficiency, extending the operational lifespan of the microcontroller.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes the microcontroller suitable for industrial applications in challenging environments.

CPU Family: CORTEX-M3

The Cortex-M3 architecture offers efficient performance for a variety of applications, making the microcontroller versatile and reliable.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows the microcontroller to be used in extreme cold conditions without compromising performance.

ADC Channels: YES

Built-in ADC channels enable analog signal processing, expanding the functionality and versatility of the microcontroller.

DMA Channels: YES

Support for DMA channels enhances data transfer speeds and efficiency, improving overall system performance.

ROM Words: 262144

A large ROM capacity allows for extensive program storage, enabling the microcontroller to handle complex algorithms and applications.

Width: 10 mm

The compact width of the microcontroller saves space on the PCB and allows for more efficient product design and layout.

Maximum Clock Frequency: 16.384 MHz

A high clock frequency provides fast processing speeds and quick response times for handling real-time applications.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial temperature ranges, the microcontroller is reliable and durable for harsh environmental conditions.

RAM Bytes: 98304

A large RAM capacity allows for efficient data storage and processing, enhancing the performance of the microcontroller for multitasking applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

PWM Channels: YES

Built-in PWM channels support precision control of output signals, making the microcontroller ideal for applications requiring accurate pulse-width modulation.

ROM Programmability: FLASH

Flash programmability allows for easy firmware updates and modifications, ensuring the microcontroller can adapt to changing requirements.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller can withstand moderate exposure to moisture during assembly and operation.

No. of I/O Lines: 65

A high number of I/O lines support versatile connectivity and enable interfacing with a variety of external devices and peripherals.

Technical Specifications

Microcontrollers LM3S9B92-IBZ80-C5T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

65

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S9B92-IBZ80-C5T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20