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LM3S9B90-IQC80-C3T

Texas Instruments

LM3S9B90-IQC80-C3T by Texas Instruments

LM3S9B90-IQC80-C3T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 98304 RAM bytes. It operates in industrial temperatures (-40 to 85 °C) and features ADC, DMA, and PWM channels for various applications requiring high-speed processing. With a compact square package style (14x14 mm), it is suitable for space-constrained designs that demand reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,390 parts In-Stock

1+ parts

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4,390

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Vyrian

USA . 2,666 parts In-Stock

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2,666

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Chip Stock

USA . 2,600 parts In-Stock

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2,600

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,648 parts In-Stock

1+ parts

$7.000

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-

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1,648

$7.000

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AZTECH Wire

Italy . 414 parts In-Stock

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$8.389

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414

$8.389

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Parana Technologies

USA . 926 parts In-Stock

1+ parts

$29.018

100+ parts

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$54.420

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926

$29.018

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$54.420

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DigiPath Technology Company

USA . 1,391 parts In-Stock

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$31.953

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1,391

$31.953

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ChromeModa Solutions

Germany . 3,177 parts In-Stock

1+ parts

$32.605

100+ parts

$26.736

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3,177

$32.605

$26.736

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IDEA Electronic Components Group

UK . 2,331 parts In-Stock

1+ parts

$32.605

100+ parts

$30.975

1k+ parts

$29.344

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2,331

$32.605

$30.975

$29.344

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Corphita

USA . 3,243 parts In-Stock

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3,243

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Microchip USA

USA . 172 parts In-Stock

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172

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Overview

Discover the cutting-edge LM3S9B90-IQC80-C3T microcontroller by Texas Instruments, setting the standard for quality and reliability in the industry. With a wide range of applications, this innovative device offers unparalleled value and benefits to customers seeking high performance and efficiency. Trust in Texas Instruments' reputation for excellence and invest in the future with the LM3S9B90-IQC80-C3T microcontroller. Unlock endless possibilities and elevate your projects to new heights with this state-of-the-art technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 1.32 V

Operates effectively within this voltage range, ensuring stable performance.

Package Shape: SQUARE

Square shape allows for compact and efficient PCB layout.

Bit Size: 32

This allows for high-speed processing and efficient data handling.

Power Supplies (V): 1.2,3.3

Supports multiple voltage options for flexibility in different applications.

No. of Terminals: 100

Provides ample connectivity options for peripheral devices.

Package Style (Meter): FLATPACK

Flatpack design saves space and enhances thermal management.

Minimum Supply Voltage: 1.08 V

Allows for operation at low power levels, saving energy.

Maximum Operating Temperature: 85 °C

Withstands high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Operates in extreme cold conditions, expanding usability.

ADC Channels: YES

Analog-to-digital converter allows for capturing and processing analog signals.

DMA Channels: YES

Direct memory access channels improve data transfer efficiency.

Terminal Position: QUAD

Quad terminal position provides stable connections and secure PCB mounting.

ROM Words: 262144

Large ROM capacity for storing program codes and data.

Maximum Seated Height: 1.6 mm

Low seated height for compact device designs.

Width: 14 mm

Compact width for space-constrained applications.

Maximum Clock Frequency: 0.032 MHz

High clock frequency for fast operation and real-time processing.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for soldering process.

Peak Reflow Temperature °C: 260

Solders easily at high temperatures for reliable connections.

Length: 14 mm

Compact length for space-saving designs.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient processing capabilities for microcontroller applications.

RAM Bytes: 98304

Large RAM size for data processing and temporary storage.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals for reliable soldering and secure connections.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage for consistent performance.

PWM Channels: YES

Pulse-width modulation channels for controlling analog devices.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updating of firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB layouts.

Moisture Sensitivity Level (MSL): 3

MSL level indicates the sensitivity to moisture during storage and assembly.

Speed: 80 rpm

Operates at a speed of 80 rotations per minute for specific applications.

No. of I/O Lines: 60

Provides a sufficient number of input/output lines for interfacing with external devices.

Technical Specifications

Microcontrollers LM3S9B90-IQC80-C3T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9B90-IQC80-C3T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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