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LM3S9B81-IQC80-C5T

Texas Instruments

LM3S9B81-IQC80-C5T by Texas Instruments

LM3S9B81-IQC80-C5T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 98304 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring high-speed processing and multiple PWM channels. With a temperature range from -40 to 85°C, it offers robust performance in various environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,906 parts In-Stock

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Digiode

USA . 3,862 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 492 parts In-Stock

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$6.000

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492

$6.000

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Advanced Electronics

New Zealand . 1,200 parts In-Stock

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$11.741

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$11.624

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$11.154

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$11.741

$11.624

$11.154

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AZTECH Wire

Italy . 744 parts In-Stock

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$18.494

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Parana Technologies

USA . 2,160 parts In-Stock

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$61.885

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DigiPath Technology Company

USA . 787 parts In-Stock

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$68.143

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787

$68.143

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ChromeModa Solutions

Germany . 3,986 parts In-Stock

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$69.534

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$57.018

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$57.018

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IDEA Electronic Components Group

UK . 1,732 parts In-Stock

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$69.534

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$66.057

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$62.581

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$62.581

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Corphita

USA . 4,882 parts In-Stock

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Microchip USA

USA . 349 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S9B81-IQC80-C5T microcontroller by Texas Instruments. Crafted with precision and expertise, this cutting-edge device is designed to enhance your projects with unmatched performance and reliability. Ideal for a wide range of applications, this microcontroller offers seamless integration, efficient operation, and unparalleled versatility. Experience the power of innovation at your fingertips with the LM3S9B81-IQC80-C5T, where quality meets excellence, and possibilities are limitless.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Can handle a relatively high supply voltage, making it versatile for different applications.

Package Shape: SQUARE

Helps in efficient space utilization on the circuit board.

Bit Size: 32

Provides a good balance between processing power and efficiency.

Power Supplies (V): 1.2,3.3

Allows for flexibility in power requirements, accommodating a range of power supply voltages.

No. of Terminals: 100

Sufficient number of terminals for connecting various components on the circuit board.

Package Style (Meter): FLATPACK

Offers a compact and flat design for space-constrained applications.

Minimum Supply Voltage: 3 V

Can operate at low supply voltages, saving power.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions as well.

ADC Channels: YES

Includes Analog-to-Digital Converter channels for processing analog signals.

DMA Channels: YES

Supports Direct Memory Access channels for efficient data transfer.

Terminal Position: QUAD

Quad terminal position for stable connectivity.

ROM Words: 262144

Offers ample ROM memory for storing programs and data.

Maximum Seated Height: 1.6 mm

Low profile design for compact and slim applications.

Width: 14 mm

Compact width for efficient space utilization on the circuit board.

Maximum Clock Frequency: 16 MHz

Capable of high-speed processing for demanding tasks.

Maximum Time At Peak Reflow Temperature (s): 30

Resistant to high temperatures during reflow soldering process.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly.

Length: 14 mm

Compact length for space-efficient designs.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes Reduced Instruction Set Computing for efficient processing.

RAM Bytes: 98304

Generous amount of RAM for running multiple tasks simultaneously.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology for low power consumption.

Terminal Form: GULL WING

Gull wing terminal form for secure and reliable connections.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for consistent performance.

PWM Channels: YES

Supports Pulse Width Modulation channels for precise control over devices.

ROM Programmability: FLASH

Flash programmable ROM for easy and quick updates to firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact layout and efficient signal routing.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for standard handling precautions.

Speed: 80 rpm

Capable of processing data at a speed of 80 rotations per minute.

No. of I/O Lines: 65

Plenty of Input/Output lines for interfacing with external components.

Technical Specifications

Microcontrollers LM3S9B81-IQC80-C5T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

65

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9B81-IQC80-C5T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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