Loading...

LM3S9790-IBZ80-C1

Texas Instruments

LM3S9790-IBZ80-C1 by Texas Instruments

Texas Instruments LM3S9790-IBZ80-C1 is a 32-bit microcontroller with 131072 ROM words, 65536 RAM bytes, and 60 I/O lines. It operates at a max clock frequency of 16 MHz and has PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

$9.740

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 237 parts In-Stock

1+ parts

-

100+ parts

$8.440

1k+ parts

$7.550

10k+ parts

$7.100

237

-

$8.440

$7.550

$7.100

DigiKey

USA . 237 parts In-Stock

1+ parts

-

100+ parts

$9.740

1k+ parts

-

10k+ parts

-

237

-

$9.740

-

-

Verical

USA . 237 parts In-Stock

1+ parts

-

100+ parts

$10.550

1k+ parts

$9.438

10k+ parts

$8.875

237

-

$10.550

$9.438

$8.875

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,116 parts In-Stock

1+ parts

$8.902

100+ parts

-

1k+ parts

-

10k+ parts

-

2,116

$8.902

-

-

-

Vyrian

USA . 3,655 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,655

-

-

-

-

DigiKey Marketplace

USA . 237 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

237

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,330 parts In-Stock

1+ parts

$8.433

100+ parts

-

1k+ parts

-

10k+ parts

-

2,330

$8.433

-

-

-

Parana Technologies

USA . 1,421 parts In-Stock

1+ parts

$24.261

100+ parts

-

1k+ parts

$24.916

10k+ parts

-

1,421

$24.261

-

$24.916

-

ChromeModa Solutions

Germany . 2,663 parts In-Stock

1+ parts

$27.259

100+ parts

$22.352

1k+ parts

-

10k+ parts

-

2,663

$27.259

$22.352

-

-

IDEA Electronic Components Group

UK . 427 parts In-Stock

1+ parts

$27.259

100+ parts

$25.896

1k+ parts

$24.533

10k+ parts

-

427

$27.259

$25.896

$24.533

-

DigiPath Technology Company

USA . 2,070 parts In-Stock

1+ parts

-

100+ parts

$24.577

1k+ parts

-

10k+ parts

-

2,070

-

$24.577

-

-

Microchip USA

USA . 277 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

277

-

-

-

-

Overview

Elevate your projects with the LM3S9790-IBZ80-C1 by Texas Instruments, a top-of-the-line microcontroller that offers unparalleled performance and reliability. With a powerful 32-bit architecture and a wide range of features including ADC and DMA channels, this innovative device is perfect for a variety of applications in industrial settings. Trust in Texas Instruments' reputation for excellence and experience the value and benefits of this cutting-edge technology firsthand. Take your projects to the next level with the LM3S9790-IBZ80-C1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the microcontroller, ensuring longevity of the product.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into various electronic devices.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages for versatile applications.

Package Shape: SQUARE

Square shape helps in efficient space utilization on circuit boards.

Bit Size: 32

32-bit architecture provides enhanced performance and processing capabilities.

Power Supplies (V): 1.2,3.3

Supports multiple power supply voltages for flexibility in design and application.

No. of Terminals: 108

Higher number of terminals allow for connectivity to various external components and peripherals.

Package Style (Meter): GRID ARRAY

Grid array package style offers ease of soldering and mounting on PCBs.

Minimum Supply Voltage: 3 V

Can operate efficiently even at lower supply voltages.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can withstand very low temperatures, ideal for harsh environments.

ADC Channels: YES

Built-in ADC channels for analog signal processing.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB layout and routing.

ROM Words: 131072

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.5 mm

Low profile design for space-constrained applications.

Width: 10 mm

Compact width for fitting in tight spaces.

Maximum Clock Frequency: 16 MHz

High clock frequency for fast processing and real-time applications.

Length: 10 mm

Short length for compact and efficient PCB design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in challenging environments.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for microcontroller applications, providing dedicated processing capabilities.

RAM Bytes: 65536

Generous RAM capacity for storing and manipulating data during operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form for secure and reliable connections.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for consistent performance.

PWM Channels: YES

Supports Pulse Width Modulation for precise control of analog signals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating of firmware and software.

Terminal Pitch: 0.8 mm

Fine terminal pitch for high-density PCB layouts and space optimization.

Speed: 80 rpm

Operates at a speed of 80 rotations per minute for efficient processing.

No. of I/O Lines: 60

Plenty of I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S9790-IBZ80-C1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

Length:

10 mm

No. of I/O Lines:

60

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S9790-IBZ80-C1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20