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LM3S8971-IBZ50-A2

Texas Instruments

LM3S8971-IBZ50-A2 by Texas Instruments

LM3S8971-IBZ50-A2 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring high-speed processing and multiple PWM channels. With a package style of GRID ARRAY and terminal finish of TIN SILVER COPPER, it offers versatile connectivity options for various electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,653 parts In-Stock

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6,653

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Digiode

USA . 3,568 parts In-Stock

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3,568

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Distributors (Availability)

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AZTECH Wire

Italy . 270 parts In-Stock

1+ parts

$13.714

100+ parts

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270

$13.714

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One Stop Electronics

USA . 289 parts In-Stock

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$24.000

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289

$24.000

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Parana Technologies

USA . 1,877 parts In-Stock

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$38.387

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1,877

$38.387

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DigiPath Technology Company

USA . 2,001 parts In-Stock

1+ parts

$42.269

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$38.888

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2,001

$42.269

$38.888

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IDEA Electronic Components Group

UK . 2,343 parts In-Stock

1+ parts

$43.132

100+ parts

$40.975

1k+ parts

$38.819

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-

2,343

$43.132

$40.975

$38.819

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ChromeModa Solutions

Germany . 64 parts In-Stock

1+ parts

$43.132

100+ parts

$35.368

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64

$43.132

$35.368

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Authorized Procurement Solutions

USA . 259,000 parts In-Stock

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259,000

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A-Z Elektronik GmbH

Germany . 5,520 parts In-Stock

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5,520

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Kepictronics

USA . 3,680 parts In-Stock

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3,680

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Corphita

USA . 1,638 parts In-Stock

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Microchip USA

USA . 356 parts In-Stock

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356

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Overview

Unlock the potential of your innovative projects with the LM3S8971-IBZ50-A2 microcontroller by Texas Instruments. Renowned for their high-quality products, Texas Instruments delivers cutting-edge technology that empowers you to bring your ideas to life. Whether you're working on industrial automation, consumer electronics, or IoT devices, this versatile microcontroller offers unmatched performance and reliability. Trust in Texas Instruments to provide the tools you need to succeed. Elevate your designs with the LM3S8971-IBZ50-A2 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Easy to install and reduces the overall size of the circuit board, saving space in the electronic device.

Maximum Supply Voltage: 2.75 V

Suitable for low power applications and ensures the safety of the microcontroller.

Package Shape: SQUARE

Square shape allows for efficient placement on the circuit board and simplifies the overall design.

Bit Size: 32

Higher bit size allows for more complex processing tasks and improved performance.

Power Supplies (V): 2.5,3.3

Versatile power supply options cater to different voltage requirements in multiple applications.

No. of Terminals: 108

Sufficient number of terminals for connecting various components and peripherals to the microcontroller.

Package Style (Meter): GRID ARRAY

Grid array package style offers reliable solder joints and good thermal conductivity for efficient operation.

Minimum Supply Voltage: 2.25 V

Wide voltage range allows for flexibility in powering the microcontroller in different scenarios.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments and harsh conditions.

Minimum Operating Temperature: -40 °C

Operational in extreme cold temperatures, ensuring reliability in diverse environmental conditions.

Terminal Finish: TIN SILVER COPPER

High-quality terminal finish ensures good conductivity and long-term reliability of the connections.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and ensures proper alignment on the circuit board.

ROM Words: 262144

Large ROM capacity allows for storing a significant amount of program data and instructions.

Maximum Seated Height: 1.5 mm

Low profile design saves space and allows for compact integration in electronic devices.

Width: 10 mm

Compact width dimensions contribute to the overall small form factor of the microcontroller.

Maximum Clock Frequency: 0.032 MHz

High clock frequency enables fast data processing and real-time operation of the microcontroller.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient reflow time for proper soldering during assembly, ensuring reliable connections.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during soldering process without damage.

Length: 10 mm

Compact length dimensions contribute to the overall small form factor of the microcontroller.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with wide temperature range and high reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient data processing and low power consumption for optimal performance.

RAM Bytes: 65536

Large RAM capacity for temporary data storage and efficient multitasking capabilities.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Ball terminal form facilitates reliable connections and easy soldering during assembly.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance and safe operation of the microcontroller.

PWM Channels: YES

Pulse-width modulation channels enable precise control of output signals and motor speed regulation.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of data and firmware updates for flexibility in application development.

Terminal Pitch: 0.8 mm

Optimal terminal pitch for easy soldering and reliable connections on the circuit board.

Moisture Sensitivity Level (MSL): 3

MSL 3 level indicates moderate sensitivity to moisture, requiring standard handling precautions during assembly.

Speed: 50 rpm

Efficient processing speed for various control applications and data manipulation tasks.

No. of I/O Lines: 38

Sufficient number of I/O lines for interfacing with external devices, sensors, and communication interfaces.

Technical Specifications

Microcontrollers LM3S8971-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

38

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S8971-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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