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LM3S8971-EQC50-A2

Texas Instruments

LM3S8971-EQC50-A2 by Texas Instruments

Texas Instruments' LM3S8971-EQC50-A2 microcontroller features 32-bit architecture, 262144 ROM words, and 65536 RAM bytes. Ideal for industrial applications, it operates b/w -40 to 105°C with a clock frequency of 0.032 MHz. With PWM channels and ADC support, this CMOS technology-based device offers versatile control capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,752 parts In-Stock

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7,752

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Digiode

USA . 2,147 parts In-Stock

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2,147

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Distributors (Availability)

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One Stop Electronics

USA . 445 parts In-Stock

1+ parts

$11.000

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445

$11.000

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AZTECH Wire

Italy . 473 parts In-Stock

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$17.071

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473

$17.071

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Parana Technologies

USA . 2,309 parts In-Stock

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$60.406

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2,309

$60.406

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DigiPath Technology Company

USA . 2,124 parts In-Stock

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$66.515

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2,124

$66.515

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ChromeModa Solutions

Germany . 4,225 parts In-Stock

1+ parts

$67.872

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$55.655

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4,225

$67.872

$55.655

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IDEA Electronic Components Group

UK . 252 parts In-Stock

1+ parts

$67.872

100+ parts

$64.478

1k+ parts

$61.085

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252

$67.872

$64.478

$61.085

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Component Stockers USA

USA . 375 parts In-Stock

1+ parts

$99.990

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375

$99.990

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Corphita

USA . 3,461 parts In-Stock

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Microchip USA

USA . 176 parts In-Stock

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Overview

Elevate your project with the LM3S8971-EQC50-A2 by Texas Instruments, a top-of-the-line microcontroller designed for optimal performance and reliability. As a trusted manufacturer in the industry, Texas Instruments delivers cutting-edge technology in a compact package, making it perfect for a wide range of applications. With its high-quality design and advanced features, this microcontroller offers unmatched value, efficiency, and flexibility to meet all your project needs. Upgrade to the LM3S8971-EQC50-A2 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY body material provides durability and protects the internal components of the microcontroller.

Maximum Supply Voltage: 2.75 V

Operating at a maximum supply voltage of 2.75 V ensures efficient power consumption and prevents damage from higher voltages.

Bit Size: 32

A 32-bit microcontroller offers improved performance and computational capabilities compared to lower bit size controllers.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this microcontroller can function reliably in harsh environments or extreme cold conditions.

ROM Programmability: FLASH

Flash programmability allows for easy and quick updates to the microcontroller's firmware, enhancing flexibility and adaptability.

Technical Specifications

Microcontrollers LM3S8971-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

38

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S8971-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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