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LM3S8970-IQC50-A2

Texas Instruments

LM3S8970-IQC50-A2 by Texas Instruments

Texas Instruments LM3S8970-IQC50-A2 microcontroller features 32-bit Cortex-M3 CPU, 262144 ROM words, and 65536 RAM bytes. Ideal for industrial applications requiring CAN, Ethernet, I2C connectivity with low power mode and 4 timers.

Median Price

$58.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 104 parts In-Stock

1+ parts

$58.000

100+ parts

$43.060

1k+ parts

-

10k+ parts

-

104

$58.000

$43.060

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$35.762

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$35.762

-

-

-

Digiode

USA . 482 parts In-Stock

1+ parts

$46.218

100+ parts

-

1k+ parts

-

10k+ parts

-

482

$46.218

-

-

-

Vyrian

USA . 5,211 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

5,211

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 476 parts In-Stock

1+ parts

$14.758

100+ parts

-

1k+ parts

-

10k+ parts

-

476

$14.758

-

-

-

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$35.046

100+ parts

-

1k+ parts

$33.644

10k+ parts

-

2,000

$35.046

-

$33.644

-

Ampacity Inc.

Singapore . 213 parts In-Stock

1+ parts

$41.350

100+ parts

-

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213

$41.350

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-

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Corphita

USA . 4,918 parts In-Stock

1+ parts

$43.785

100+ parts

-

1k+ parts

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10k+ parts

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4,918

$43.785

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-

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Parana Technologies

USA . 1,143 parts In-Stock

1+ parts

$67.560

100+ parts

-

1k+ parts

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10k+ parts

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1,143

$67.560

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ChromeModa Solutions

Germany . 2,556 parts In-Stock

1+ parts

$75.910

100+ parts

$62.246

1k+ parts

-

10k+ parts

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2,556

$75.910

$62.246

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IDEA Electronic Components Group

UK . 415 parts In-Stock

1+ parts

$75.910

100+ parts

$72.114

1k+ parts

$68.319

10k+ parts

-

415

$75.910

$72.114

$68.319

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Microchip USA

USA . 2,492 parts In-Stock

1+ parts

$82.880

100+ parts

$81.430

1k+ parts

$80.710

10k+ parts

$79.990

2,492

$82.880

$81.430

$80.710

$79.990

DigiPath Technology Company

USA . 2,317 parts In-Stock

1+ parts

-

100+ parts

$68.440

1k+ parts

-

10k+ parts

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2,317

-

$68.440

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,000

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Overview

Unlock the power of cutting-edge technology with the LM3S8970-IQC50-A2 microcontroller from Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that excel in performance and reliability. This versatile microcontroller is packed with features perfect for a wide range of applications, offering customers unmatched value and benefits. From industrial automation to consumer electronics, this microcontroller is sure to exceed your expectations. Elevate your projects with the LM3S8970-IQC50-A2 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Integrated Cache: YES

Improves processing speed by storing frequently accessed data for quick retrieval, enhancing overall performance.

Maximum Supply Voltage: 2.75 V

Allows for a stable operating voltage range, reducing the risk of overloading the microcontroller.

On Chip Data RAM Width: 8

Offers sufficient space for temporary data storage, enhancing the microcontroller's ability to process information efficiently.

Bit Size: 32

Provides a high level of data processing capability, allowing the microcontroller to handle complex tasks and calculations effectively.

Power Supplies (V): 2.5,3.3

Supports multiple power supply options, providing flexibility in designing power-efficient systems.

No. of Terminals: 100

Offers a wide range of connectivity options, enabling the microcontroller to interface with various external devices and components.

Package Style (Meter): FLATPACK

Ensures compact and space-saving design, making the microcontroller suitable for applications where size constraints are a consideration.

CPU Family: CORTEX-M3

Belongs to a proven and reliable family of processors, ensuring compatibility with existing software libraries and development tools.

Maximum Operating Temperature: 85 °C

Can operate reliably in high-temperature environments, making it suitable for industrial applications where heat generation is a concern.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, expanding the range of applications where the microcontroller can be used.

ADC Channels: YES

Enables analog-to-digital conversion, allowing the microcontroller to interface with analog sensors and signals for data processing.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing architecture for efficient instruction execution, maximizing performance and power efficiency.

Technical Specifications

Microcontrollers LM3S8970-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

38

No. of Serial I/Os:

9

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), ETHERNET, I2C, SSI, UART(2)

Peripherals:

TIMER(4), WDT

Trade Compliance

LM3S8970-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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