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LM3S8970-IBZ50-A2T

Texas Instruments

LM3S8970-IBZ50-A2T by Texas Instruments

LM3S8970-IBZ50-A2T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 8.192 MHz, suitable for industrial applications requiring high-speed processing and control capabilities. With 46 I/O lines and PWM channels, it offers versatile connectivity options in a compact square package ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,705 parts In-Stock

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7,705

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Digiode

USA . 4,305 parts In-Stock

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4,305

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Distributors (Availability)

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AZTECH Wire

Italy . 464 parts In-Stock

1+ parts

$10.565

100+ parts

-

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464

$10.565

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One Stop Electronics

USA . 1,333 parts In-Stock

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$27.000

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1,333

$27.000

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Parana Technologies

USA . 352 parts In-Stock

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$52.298

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352

$52.298

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DigiPath Technology Company

USA . 1,638 parts In-Stock

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$57.587

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1,638

$57.587

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ChromeModa Solutions

Germany . 3,896 parts In-Stock

1+ parts

$58.762

100+ parts

$48.185

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3,896

$58.762

$48.185

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IDEA Electronic Components Group

UK . 1,364 parts In-Stock

1+ parts

$58.762

100+ parts

$55.824

1k+ parts

$52.886

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1,364

$58.762

$55.824

$52.886

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Component Stockers USA

USA . 233 parts In-Stock

1+ parts

$99.990

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233

$99.990

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Corphita

USA . 476 parts In-Stock

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476

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Microchip USA

USA . 369 parts In-Stock

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369

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Overview

Unlock the power of innovation with the LM3S8970-IBZ50-A2T microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that exceed expectations. This microcontroller is perfect for a wide range of applications, offering unparalleled value and performance. With its advanced features and reliable design, customers can trust in the LM3S8970-IBZ50-A2T to take their projects to the next level. Experience the benefits of cutting-edge technology and seamless functionality with this exceptional microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important.

Surface Mount: YES

The surface mount feature enables easy and efficient PCB assembly, making it suitable for high volume production.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V ensures safe operation and protection of the microcontroller.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the PCB, especially in applications where board real estate is limited.

Bit Size: 32

The 32-bit architecture provides enhanced processing power and performance for complex applications that require high computational capabilities.

Power Supplies (V): 2.5,3.3

The availability of multiple power supply options (2.5V and 3.3V) offers flexibility in designing and powering different types of electronic systems.

No. of Terminals: 108

The large number of terminals allow for versatile connections and I/O capabilities, making it suitable for a wide range of applications.

Package Style (Meter): GRID ARRAY

The grid array package style offers high-density packaging and efficient thermal management, making it ideal for applications requiring compact size and heat dissipation.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25V ensures reliable operation even under low power conditions, making it suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the microcontroller can withstand elevated temperatures in harsh operating environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the microcontroller to operate in cold environments without compromising performance.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin-silver-copper provides reliable electrical connections and corrosion resistance for long-term durability.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to interface with analog sensors and signals, making it suitable for a wide range of sensing applications.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and routing, reducing signal interference and improving signal integrity.

ROM Words: 262144

The large ROM capacity of 262144 words provides ample storage for program instructions and data, allowing for complex software applications to be implemented.

Maximum Seated Height: 1.5 mm

The low maximum seated height of 1.5mm enables compact and slim designs, making it suitable for space-constrained applications.

Width: 10 mm

The narrow width of 10mm allows for efficient use of PCB space and enables compact designs, ideal for applications with size restrictions.

Maximum Clock Frequency: 8.192 MHz

The high maximum clock frequency of 8.192 MHz enables fast data processing and real-time operation for time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliability during the assembly process.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient and consistent soldering during the assembly process, ensuring reliable connections.

Length: 10 mm

The short length of 10mm contributes to a compact form factor and efficient use of space on the PCB, ideal for miniaturized designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments with wide temperature variations.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC-based microcontroller architecture offers high performance, low power consumption, and simplified instruction set, making it ideal for embedded systems.

RAM Bytes: 65536

The large RAM capacity of 65536 bytes allows for data storage and manipulation during program execution, enabling efficient multitasking and data processing.

Technology: CMOS

The CMOS technology offers low power consumption, high speed operation, and compatibility with a wide range of electronic systems, making it versatile and cost-effective.

Terminal Form: BALL

The ball terminal form simplifies soldering and ensures reliable electrical connections, making it suitable for high-density and high-reliability applications.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V provides stable and efficient power delivery to the microcontroller, ensuring reliable operation under normal operating conditions.

PWM Channels: YES

The presence of PWM channels allows for precise control of analog signals and motor drivers, making it suitable for applications requiring accurate speed and position control.

ROM Programmability: FLASH

The flash programmable ROM allows for easy and quick reprogrammability of firmware and software, enabling flexibility and scalability in product development.

Terminal Pitch: 0.8 mm

The 0.8mm terminal pitch offers high-density packaging and efficient signal routing, allowing for compact designs and reduced PCB footprint.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the microcontroller is sensitive to moisture exposure during storage or assembly, requiring proper handling and storage precautions.

Speed: 50 rpm

The speed rating of 50rpm indicates the rotational speed of certain integrated peripherals or timers, allowing for precise timing and control in motor control applications.

No. of I/O Lines: 46

The 46 I/O lines provide versatile connectivity options for interfacing with external devices and peripherals, enabling flexible and customized system configurations.

Technical Specifications

Microcontrollers LM3S8970-IBZ50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S8970-IBZ50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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