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LM3S8938-IQC50-A2

Texas Instruments

LM3S8938-IQC50-A2 by Texas Instruments

Texas Instruments LM3S8938-IQC50-A2 microcontroller features 32-bit Cortex-M3 CPU, 262144 ROM words, and 65536 RAM bytes. Ideal for industrial applications requiring CAN, Ethernet, I2C(2), SSI, UART(3) connectivity and low power mode with 50 rpm speed.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,566 parts In-Stock

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Digiode

USA . 2,586 parts In-Stock

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Sensible Micro Corp

USA . 1,200 parts In-Stock

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Inventory MP

USA . 17 parts In-Stock

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Bristol Electronics

USA . 17 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 358 parts In-Stock

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$17.115

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358

$17.115

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Parana Technologies

USA . 1,110 parts In-Stock

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$26.380

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$26.974

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$26.380

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$26.974

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DigiPath Technology Company

USA . 646 parts In-Stock

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$29.048

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646

$29.048

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ChromeModa Solutions

Germany . 5,691 parts In-Stock

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$29.641

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$24.306

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$29.641

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IDEA Electronic Components Group

UK . 263 parts In-Stock

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$29.641

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$28.159

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$26.677

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263

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$26.677

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One Stop Electronics

USA . 1,022 parts In-Stock

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$32.000

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$32.000

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Microchip USA

USA . 2,663 parts In-Stock

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$87.060

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$85.540

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$84.790

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$84.030

2,663

$87.060

$85.540

$84.790

$84.030

Component Stockers USA

USA . 771 parts In-Stock

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$99.990

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 2,913 parts In-Stock

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Lixinc

USA . 467 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the LM3S8938-IQC50-A2 microcontroller by Texas Instruments. Designed with precision and expertise, this device offers unparalleled performance and reliability in various applications. From industrial automation to consumer electronics, this microcontroller provides seamless connectivity, advanced peripherals, and low power consumption. Experience the value of innovation with the LM3S8938-IQC50-A2, where quality meets efficiency for all your project needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective, lightweight, and durable, making the product suitable for various applications.

Integrated Cache: YES

Having an integrated cache helps improve the speed and efficiency of the microcontroller, enhancing overall performance.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V allows for efficient power consumption and operation within a safe voltage range.

On Chip Data RAM Width: 8

The wide On Chip Data RAM Width of 8 allows for faster data processing and multitasking capabilities.

Bit Size: 32

The 32-bit architecture provides enhanced performance and processing capabilities compared to lower bit sizes.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family is known for its high performance, low power consumption, and efficient operation, making it a reliable choice for various applications.

ADC Channels: YES

Having ADC Channels allows for analog to digital conversion, enabling the microcontroller to interface with analog sensors and devices.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with various peripherals, it offers efficient operation, reduced power consumption, and versatile connectivity options.

Connectivity: CAN, ETHERNET, I2C(2), SSI, UART(3)

The multiple connectivity options including CAN, Ethernet, I2C, SSI, and UART make the product versatile and suitable for a wide range of applications and communication protocols.

RAM Bytes: 65536

With a large RAM size of 65536 bytes, the microcontroller can efficiently handle data storage and processing requirements of complex applications.

Technical Specifications

Microcontrollers LM3S8938-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

38

No. of Serial I/Os:

8

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, ETHERNET, I2C(2), SSI, UART(3)

Peripherals:

TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LM3S8938-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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