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LM3S8933-IQC50-A2

Texas Instruments

LM3S8933-IQC50-A2 by Texas Instruments

Texas Instruments LM3S8933-IQC50-A2 microcontroller features 32-bit CPU, 262144 ROM words, and 65536 RAM bytes. Ideal for industrial applications with CAN, Ethernet, I2C connectivity options. Operates at -40 to 85°C temperature range with low power mode and integrated cache for efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,142 parts In-Stock

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Digiode

USA . 3,727 parts In-Stock

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3,727

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Distributors (Availability)

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AZTECH Wire

Italy . 189 parts In-Stock

1+ parts

$13.831

100+ parts

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189

$13.831

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One Stop Electronics

USA . 1,179 parts In-Stock

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$35.000

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1,179

$35.000

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Parana Technologies

USA . 2,126 parts In-Stock

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$50.773

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$50.773

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ChromeModa Solutions

Germany . 5,401 parts In-Stock

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$57.048

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$46.779

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5,401

$57.048

$46.779

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IDEA Electronic Components Group

UK . 859 parts In-Stock

1+ parts

$57.048

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$54.196

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$51.343

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859

$57.048

$54.196

$51.343

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Microchip USA

USA . 2,751 parts In-Stock

1+ parts

$82.820

100+ parts

$81.380

1k+ parts

$80.660

10k+ parts

$79.940

2,751

$82.820

$81.380

$80.660

$79.940

DigiPath Technology Company

USA . 305 parts In-Stock

1+ parts

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$51.434

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Corphita

USA . 281 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S8933-IQC50-A2 by Texas Instruments, a high-quality microcontroller designed to meet your diverse application needs. With a reputable manufacturer like Texas Instruments, you can trust in the reliability and innovation of this product. Whether you're working on IoT devices, automation systems, or industrial controls, this microcontroller offers exceptional value, performance, and efficiency. Upgrade your projects today with the LM3S8933-IQC50-A2 and experience the superior benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the microcontroller, making it suitable for various environments and applications.

Integrated Cache: YES

Integrated cache helps in improving the performance and efficiency of the microcontroller by reducing access time to frequently used data.

Surface Mount: YES

Surface mount capability makes it easy to integrate the microcontroller onto circuit boards, saving space and improving assembly efficiency.

Maximum Supply Voltage: 2.75 V

Operates efficiently within a safe voltage range of up to 2.75 V, providing stability and reliability to the system.

On Chip Data RAM Width: 8

8-bit data RAM width allows for efficient data processing and storage within the microcontroller, enhancing its performance capabilities.

Package Shape: SQUARE

Square package shape offers a compact form factor, making it easier to design and integrate the microcontroller into various applications.

Bit Size: 32

32-bit architecture enables the microcontroller to handle complex computations and data processing tasks with high precision and efficiency.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages (2.5V and 3.3V) provides flexibility in powering the microcontroller according to specific requirements and application needs.

No. of Terminals: 100

Having a larger number of terminals allows for more connectivity options and I/O capabilities, enabling versatile functionality for the microcontroller.

Package Style (Meter): FLATPACK

Flatpack package style offers easy handling and installation of the microcontroller, contributing to overall usability and convenience in system design.

Minimum Supply Voltage: 2.25 V

Ensures reliable operation even at low supply voltages, providing stability and performance in various power conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the microcontroller can withstand elevated temperatures, making it suitable for industrial applications.

CPU Family: CORTEX-M3

Belonging to the CORTEX-M3 CPU family signifies high performance, low power consumption, and advanced features, making it an excellent choice for demanding applications.

Minimum Operating Temperature: -40 °C

Capable of operating at extremely low temperatures down to -40°C, ensuring reliable performance in harsh environmental conditions.

Terminal Finish: MATTE TIN

MATTE TIN terminal finish provides corrosion resistance and reliable soldering connections, enhancing the durability and longevity of the microcontroller.

ADC Channels: YES

Analog-to-digital converter (ADC) channels enable the microcontroller to read and convert analog signals into digital data, expanding its sensing and control capabilities.

Terminal Position: QUAD

QUAD terminal position offers easy pin configuration and layout, simplifying PCB design and assembly for the microcontroller.

ROM Words: 262144

With a large ROM capacity of 262144 words, the microcontroller can store and access a significant amount of program data, supporting complex applications and functionalities.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6 mm allows for compact device designs and slim form factors, enabling the microcontroller to be used in space-constrained applications.

Width: 14 mm

Compact width dimension of 14 mm facilitates easy integration and mounting of the microcontroller on PCBs, optimizing space utilization in the system.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the microcontroller during production, improving quality control and reliability of the final product.

Peripherals: TIMER(4), WDT

Availability of peripherals like timers and watchdog timers enhances the microcontroller's functionality for time-sensitive operations and system monitoring, enhancing overall performance.

Maximum Clock Frequency: 8.192 MHz

High maximum clock frequency of 8.192 MHz enables fast processing and execution of instructions, making the microcontroller suitable for high-speed applications.

Maximum Time At Peak Reflow Temperature (s): 30

Capable of withstanding a peak reflow temperature for up to 30 seconds, ensuring proper soldering and assembly of the microcontroller in manufacturing processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C meets industry standards for soldering processes, ensuring reliable and durable connections for the microcontroller.

Length: 14 mm

Compact length dimension of 14 mm facilitates space-efficient PCB designs, allowing for the microcontroller to be integrated into various small form factor devices.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, the microcontroller offers reliability, durability, and performance under harsh operating conditions in industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with Reduced Instruction Set Computing (RISC) architecture enhances efficiency, speed, and power consumption, making it ideal for embedded control applications.

No. of Timers: 4

Having 4 timers provides versatile timing and control capabilities for time-critical operations, facilitating precise synchronization and event management in the system.

RAM Bytes: 65536

With a RAM capacity of 65536 bytes, the microcontroller can efficiently buffer and process data, enabling smooth multitasking and data handling in complex applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and robust performance, enhancing the efficiency and reliability of the microcontroller.

Terminal Form: GULL WING

GULL WING terminal form provides secure soldering and reliable electrical connections, ensuring stable operation and longevity of the microcontroller in various applications.

Analog To Digital Convertors: 4-Ch 10-Bit

4 channels with 10-bit resolution ADCs enable precise analog signal conversion, allowing the microcontroller to interface with a variety of sensors and input devices.

Nominal Supply Voltage: 2.5 V

Supported nominal supply voltage of 2.5 V ensures optimal performance and stability of the microcontroller, meeting standard voltage requirements for reliable operation.

No. of Serial I/Os: 6

6 serial I/O interfaces provide versatile connectivity options for external communication, enabling the microcontroller to interact with a wide range of peripheral devices and systems.

PWM Channels: YES

Pulse-width modulation (PWM) channels offer precise control over motor speed, light intensity, and other applications requiring variable output signals, enhancing the microcontroller's versatility.

Connectivity: CAN, ETHERNET, I2C, SSI, UART(2)

Versatile connectivity options like CAN, Ethernet, I2C, SSI, and UART(2) enable seamless communication with external devices and networks, expanding the microcontroller's compatibility and integration capabilities.

ROM Programmability: FLASH

Flash programmability allows for easy and fast reprogramming of the microcontroller's memory, facilitating firmware updates and customization without requiring external programming devices.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm simplifies PCB layout and routing, enabling compact designs and efficient signal transmission for the microcontroller.

Format: FIXED POINT

Utilizing fixed-point format improves numerical accuracy and computational efficiency in the microcontroller, making it suitable for real-time processing and control applications.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the microcontroller's resistance to moisture during storage and handling, ensuring reliability and performance in various environmental conditions.

Technical Specifications

Microcontrollers LM3S8933-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

36

No. of Serial I/Os:

6

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, ETHERNET, I2C, SSI, UART(2)

Peripherals:

TIMER(4), WDT

Analog To Digital Convertors:

4-Ch 10-Bit

Trade Compliance

LM3S8933-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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