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LM3S8933-EQC50-A2

Texas Instruments

LM3S8933-EQC50-A2 by Texas Instruments

LM3S8933-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 8.192 MHz, suitable for industrial applications requiring PWM channels and ADC channels. The package style is flatpack with a square shape, making it ideal for compact designs with limited space constraints.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,319 parts In-Stock

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5,319

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Digiode

USA . 898 parts In-Stock

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898

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Distributors (Availability)

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AZTECH Wire

Italy . 738 parts In-Stock

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$11.895

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738

$11.895

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One Stop Electronics

USA . 1,201 parts In-Stock

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$19.000

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$19.000

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Parana Technologies

USA . 141 parts In-Stock

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$47.552

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141

$47.552

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ChromeModa Solutions

Germany . 1,370 parts In-Stock

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$53.429

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$43.812

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1,370

$53.429

$43.812

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IDEA Electronic Components Group

UK . 832 parts In-Stock

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$53.429

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$50.758

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$48.086

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832

$53.429

$50.758

$48.086

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Corphita

USA . 3,781 parts In-Stock

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3,781

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DigiPath Technology Company

USA . 385 parts In-Stock

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$48.172

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385

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Microchip USA

USA . 349 parts In-Stock

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Overview

Experience the next level of performance with the LM3S8933-EQC50-A2 microcontroller by Texas Instruments. Designed with precision and innovation, this device offers unmatched reliability and efficiency for a wide range of applications. Whether you're working on automotive electronics, industrial automation, or consumer electronics, this microcontroller provides the power and versatility you need to bring your projects to life. Trust in Texas Instruments' legacy of excellence and unlock the full potential of your designs with the LM3S8933-EQC50-A2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy packaging provides good protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Surface mount design allows for easy integration onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 2.75 V

Low maximum supply voltage helps in reducing power consumption and heat dissipation.

Package Shape: SQUARE

Square package shape simplifies layout and mounting on circuit boards.

Bit Size: 32

32-bit architecture provides high performance and processing capabilities for the microcontroller.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages allows flexibility in designing and optimizing power consumption.

No. of Terminals: 100

Having a large number of terminals enables connectivity to a wide range of peripherals and components.

Package Style (Meter): FLATPACK

Flatpack package style offers easy handling and soldering during assembly.

Maximum Operating Temperature: 105 °C

High maximum operating temperature makes this microcontroller suitable for industrial applications where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliable performance even in cold environments.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and inputs.

Terminal Position: QUAD

Quad terminal position simplifies board layout and increases mechanical stability.

ROM Words: 262144

Large ROM capacity allows for storing a significant amount of program code and data.

Maximum Seated Height: 1.6 mm

Low seated height makes this microcontroller suitable for compact and slim devices.

Width: 14 mm

Compact width enables space-efficient integration into electronic products.

Maximum Clock Frequency: 8.192 MHz

High clock frequency provides fast processing speed for the microcontroller.

Length: 14 mm

Short length allows for compact placement on circuit boards.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient and high-performance computing capabilities for the microcontroller.

RAM Bytes: 65536

Large RAM capacity enables running complex programs and handling multiple tasks simultaneously.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for the microcontroller.

Terminal Form: GULL WING

Gull wing terminal form provides easy soldering and robust mechanical connections.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance of the microcontroller.

PWM Channels: YES

Pulse-width modulation channels enable precise control of voltage levels and motor speed.

ROM Programmability: FLASH

Flash ROM programmability allows for easy reprogramming and updating of firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density integration on circuit boards.

Speed: 50 rpm

50 rpm speed rating indicates the capability of the microcontroller to handle time-critical tasks.

No. of I/O Lines: 36

Having 36 I/O lines provides flexibility in connecting to various external devices and peripherals.

Technical Specifications

Microcontrollers LM3S8933-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

36

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S8933-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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