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LM3S8930-EQC50-A2T

Texas Instruments

LM3S8930-EQC50-A2T by Texas Instruments

Texas Instruments LM3S8930-EQC50-A2T is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. Operating at up to 0.032 MHz, it features 34 I/O lines, PWM channels, and ADC channels. Ideal for industrial applications requiring a wide temperature range from -40 to 105 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,196 parts In-Stock

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Digiode

USA . 3,632 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 504 parts In-Stock

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$7.573

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$7.573

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One Stop Electronics

USA . 1,415 parts In-Stock

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$23.000

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Parana Technologies

USA . 1,391 parts In-Stock

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$67.228

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DigiPath Technology Company

USA . 1,713 parts In-Stock

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$74.026

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1,713

$74.026

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ChromeModa Solutions

Germany . 2,109 parts In-Stock

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$75.537

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$61.940

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$75.537

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IDEA Electronic Components Group

UK . 1,953 parts In-Stock

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$75.537

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$71.760

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$67.983

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$75.537

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$67.983

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Corphita

USA . 4,558 parts In-Stock

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Microchip USA

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Overview

Experience the exceptional quality and reliability of Texas Instruments with the LM3S8930-EQC50-A2T microcontroller. This versatile device offers a wide range of applications in various industries, providing customers with unmatched value and benefits. From its compact package body material to its impressive 32-bit size, this microcontroller delivers top-notch performance and efficiency. Trust Texas Instruments for cutting-edge technology and innovation that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 2.75 V

The limited maximum supply voltage helps in preventing overloading and protects the microcontroller from potential damage.

Package Shape: SQUARE

The square shape design allows for easier placement on the circuit board and efficient use of space.

Bit Size: 32

The 32-bit architecture provides enhanced processing power and performance for the microcontroller, making it suitable for complex applications.

Power Supplies (V): 2.5,3.3

Having multiple power supply options gives flexibility in designing and operating the microcontroller in various voltage environments.

No. of Terminals: 100

With a higher number of terminals, this microcontroller can support a wide range of input and output connections, enhancing its versatility.

Package Style (Meter): FLATPACK

The flatpack design allows for efficient heat dissipation and compact size, making it ideal for space-constrained applications.

Minimum Supply Voltage: 2.25 V

The low minimum supply voltage ensures compatibility with various power sources and efficient energy usage.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range allows the microcontroller to function reliably in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures the microcontroller can perform in extreme cold conditions, making it suitable for outdoor or harsh environments.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals into digital data, expanding its capabilities in sensor interfacing and data acquisition.

Terminal Position: QUAD

The quad terminal position provides a secure and stable connection, minimizing the risk of signal interference or loss.

ROM Words: 262144

With a large ROM capacity, the microcontroller can store a significant amount of program instructions and data, supporting complex applications and firmware.

Maximum Seated Height: 1.6 mm

The low seated height of the microcontroller allows for compact designs and space-saving installation in electronic devices.

Width: 14 mm

The compact width of the microcontroller makes it suitable for applications where space is limited, such as portable electronics or IoT devices.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency enables fast execution of instructions and efficient processing of data in real-time applications.

Length: 14 mm

The small length of the microcontroller complements its compact design, making it suitable for integration into space-constrained electronic products.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures the microcontroller can withstand harsh environmental conditions and operate reliably in demanding industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller provides efficient processing power and optimized performance, making it suitable for high-speed data processing applications.

RAM Bytes: 65536

With a large RAM capacity, the microcontroller can efficiently manage and process data, improving its multitasking capabilities and overall performance.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliable operation, making the microcontroller energy-efficient and suitable for battery-operated devices.

Terminal Form: GULL WING

The gull-wing terminal form provides a secure and reliable connection, ensuring stable signal transmission and reducing the risk of connectivity issues.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage offers a standard operating range for the microcontroller, ensuring compatibility with common power sources and stable performance.

PWM Channels: YES

The presence of PWM channels allows the microcontroller to generate precise analog output signals, enabling efficient control of motors, actuators, and other devices.

ROM Programmability: FLASH

The flash ROM programmability feature enables quick and easy updates to the microcontroller's firmware and allows for flexible customization of applications.

Terminal Pitch: 0.5 mm

The small terminal pitch ensures a compact layout on the circuit board and facilitates high-density mounting, ideal for miniaturized electronic devices.

Speed: 50 rpm

The speed parameter indicates the processing capability of the microcontroller, with 50 rpm representing a moderate operating speed suitable for various applications.

No. of I/O Lines: 34

With 34 I/O lines, the microcontroller can efficiently interface with external devices and sensors, enabling versatile connectivity and data exchange.

Technical Specifications

Microcontrollers LM3S8930-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

34

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S8930-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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