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LM3S8930-EQC50-A2

Texas Instruments

LM3S8930-EQC50-A2 by Texas Instruments

LM3S8930-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. Operating at a max clock frequency of 0.032 MHz, it features 34 I/O lines and PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,573 parts In-Stock

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4,573

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Vyrian

USA . 3,015 parts In-Stock

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3,015

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Distributors (Availability)

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One Stop Electronics

USA . 1,370 parts In-Stock

1+ parts

$8.000

100+ parts

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1,370

$8.000

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AZTECH Wire

Italy . 677 parts In-Stock

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$12.986

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677

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Parana Technologies

USA . 1,371 parts In-Stock

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$30.967

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$70.137

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1,371

$30.967

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$70.137

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DigiPath Technology Company

USA . 2,147 parts In-Stock

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$34.098

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$31.370

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2,147

$34.098

$31.370

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IDEA Electronic Components Group

UK . 1,972 parts In-Stock

1+ parts

$34.794

100+ parts

$33.054

1k+ parts

$31.315

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1,972

$34.794

$33.054

$31.315

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ChromeModa Solutions

Germany . 1,373 parts In-Stock

1+ parts

$34.794

100+ parts

$28.531

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1,373

$34.794

$28.531

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QUARKTWIN TECHNOLOGY LTD

USA . 20,001 parts In-Stock

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Corphita

USA . 4,769 parts In-Stock

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Microchip USA

USA . 308 parts In-Stock

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Overview

Experience the cutting-edge technology of the LM3S8930-EQC50-A2 microcontroller by Texas Instruments, known for their high-quality products and innovative solutions. This versatile device is perfect for a wide range of applications, offering unparalleled performance and reliability. With advanced features and a compact design, this microcontroller provides exceptional value and benefits to customers looking to optimize their projects. Trust Texas Instruments for superior quality and efficiency in all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy makes the product lightweight and durable, ideal for portable applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto PCBs, saving time and space.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75V ensures safe operation and protects the components from overvoltage.

Bit Size: 32

The 32-bit architecture provides high performance and processing capabilities for complex tasks and applications.

Power Supplies (V): 2.5,3.3

Having multiple power supply options (2.5V and 3.3V) increases flexibility in designing and integrating the product into various systems.

No. of Terminals: 100

With 100 terminals, there is ample connectivity for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK

The flatpack package style offers better thermal performance and space utilization, making it suitable for compact designs.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25V ensures reliable operation even under low power conditions, extending the product's usability.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, the product can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables the product to function in cold environments without any issues.

ADC Channels: YES

Having ADC channels allows the product to convert analog signals to digital, enhancing its ability to interface with sensors and other analog devices.

Terminal Position: QUAD

The quad terminal position provides a secure and stable connection with the PCB, ensuring reliable operation under different conditions.

ROM Words: 262144

With a ROM size of 262144 words, the product can store a large amount of program data, enabling complex applications to be run smoothly.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6mm allows for a compact and slim design, suitable for space-constrained applications.

Width: 14 mm

The 14mm width provides a balance between compactness and accessibility, making the product easy to integrate into various systems.

Maximum Clock Frequency: 0.032 MHz

With a maximum clock frequency of 0.032MHz, the product offers high-speed processing capabilities for demanding tasks and applications.

Length: 14 mm

The 14mm length ensures a compact form factor, making the product suitable for applications where space is limited.

Temperature Grade: INDUSTRIAL

Being industrial-grade means the product is designed to withstand harsh conditions and operate reliably in industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Featuring a RISC-based microcontroller design, the product offers efficient processing power and low power consumption for optimized performance.

RAM Bytes: 65536

With a RAM size of 65536 bytes, the product can efficiently handle data processing and storage requirements for various applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making the product reliable and energy-efficient.

Terminal Form: GULL WING

The gull wing terminal form provides a robust and secure connection with the PCB, enhancing the product's reliability and durability.

Nominal Supply Voltage: 2.5 V

Having a nominal supply voltage of 2.5V simplifies power supply requirements and ensures compatibility with a wide range of systems.

PWM Channels: YES

The presence of PWM channels allows the product to generate precise analog output signals, making it suitable for motor control and other applications.

ROM Programmability: FLASH

Featuring flash ROM programmability enables easy and quick updates to the program code, enhancing the product's flexibility and adaptability.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch offers fine pitch connections, allowing for dense integration and space-saving on the PCB.

Speed: 50 rpm

With a speed of 50rpm, the product can process instructions and data efficiently, ensuring responsive performance in real-time applications.

No. of I/O Lines: 34

Having 34 I/O lines provides ample interfacing options for connecting to external devices and peripherals, enhancing the product's versatility.

Technical Specifications

Microcontrollers LM3S8930-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

34

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S8930-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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