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LM3S8738-IQC50-A2

Texas Instruments

LM3S8738-IQC50-A2 by Texas Instruments

Texas Instruments LM3S8738-IQC50-A2 microcontroller features 32-bit Cortex-M3 CPU, 131072 ROM words, and 65536 RAM bytes. Ideal for industrial applications with CAN, Ethernet, I2C connectivity options and low power mode support. Operating temperature range from -40 to 85°C makes it suitable for various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,391 parts In-Stock

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Digiode

USA . 4,187 parts In-Stock

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4,187

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Distributors (Availability)

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AZTECH Wire

Italy . 505 parts In-Stock

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$13.526

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505

$13.526

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Parana Technologies

USA . 1,917 parts In-Stock

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$21.947

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$22.462

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1,917

$21.947

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$22.462

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ChromeModa Solutions

Germany . 4,944 parts In-Stock

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$24.659

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$20.220

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4,944

$24.659

$20.220

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IDEA Electronic Components Group

UK . 1,138 parts In-Stock

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$24.659

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$23.426

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$22.193

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1,138

$24.659

$23.426

$22.193

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Ampacity Inc.

Singapore . 1,234 parts In-Stock

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$29.000

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$29.000

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One Stop Electronics

USA . 374 parts In-Stock

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$29.000

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374

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Corphita

USA . 1,739 parts In-Stock

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A-Z Elektronik GmbH

Germany . 464 parts In-Stock

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DigiPath Technology Company

USA . 318 parts In-Stock

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$22.233

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Microchip USA

USA . 302 parts In-Stock

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Overview

Unlock the endless possibilities with the LM3S8738-IQC50-A2 microcontroller by Texas Instruments. Crafted with precision and expertise, this device offers unparalleled quality and reliability for a wide range of applications. With integrated cache and low power mode capabilities, this microcontroller delivers exceptional performance while conserving energy. Perfect for projects requiring connectivity, it features CAN, Ethernet, I2C, SSI, and UART interfaces, making it versatile and adaptable to various scenarios. Experience the seamless integration of cutting-edge technology and innovation in a compact package that sets new standards for efficiency and functionality. Elevate your designs with the LM3S8738-IQC50-A2 and unleash your creativity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good durability and protection for the microcontroller, ensuring long-lasting performance.

Integrated Cache: YES

Having an integrated cache helps in improving the speed and efficiency of the microcontroller by reducing memory access times.

Maximum Supply Voltage: 2.75 V

This allows for safe and reliable operation within the specified voltage range, preventing potential damage to the microcontroller.

Package Shape: SQUARE

The square shape of the package makes it easier to handle and mount onto circuit boards, enhancing overall convenience during the assembly process.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 family indicates a high level of performance, efficiency, and compatibility with a wide range of applications, making it a versatile choice for various projects.

Analog To Digital Convertors: 8-Ch 10-Bit

With 8 channels and 10-bit resolution, this microcontroller can accurately process analog signals, making it suitable for applications requiring precise analog-to-digital conversions.

Connectivity: CAN, ETHERNET, I2C, SSI(2), UART(3)

The multiple connectivity options allow for seamless integration with other devices and systems, making it a versatile solution for networking and communication applications.

Technical Specifications

Microcontrollers LM3S8738-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

38

No. of Serial I/Os:

8

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, ETHERNET, I2C, SSI(2), UART(3)

Peripherals:

TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LM3S8738-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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