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LM3S8738-IBZ50-A2

Texas Instruments

LM3S8738-IBZ50-A2 by Texas Instruments

LM3S8738-IBZ50-A2 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring up to 38 I/O lines and PWM channels. With a package style of GRID ARRAY and terminal finish of TIN SILVER COPPER, it offers versatile performance in various electronic systems.

Median Price

$19.150

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 115 parts In-Stock

1+ parts

-

100+ parts

$15.320

1k+ parts

$13.710

10k+ parts

$12.900

115

-

$15.320

$13.710

$12.900

DigiKey

USA . 115 parts In-Stock

1+ parts

-

100+ parts

$20.160

1k+ parts

-

10k+ parts

-

115

-

$20.160

-

-

Verical

USA . 115 parts In-Stock

1+ parts

-

100+ parts

$19.150

1k+ parts

$17.137

10k+ parts

$16.125

115

-

$19.150

$17.137

$16.125

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,514 parts In-Stock

1+ parts

$16.178

100+ parts

-

1k+ parts

-

10k+ parts

-

1,514

$16.178

-

-

-

Vyrian

USA . 8,111 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,111

-

-

-

-

DigiKey Marketplace

USA . 115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

115

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,040 parts In-Stock

1+ parts

$15.327

100+ parts

-

1k+ parts

-

10k+ parts

-

2,040

$15.327

-

-

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$42.933

100+ parts

$39.069

1k+ parts

$35.205

10k+ parts

-

3,000

$42.933

$39.069

$35.205

-

Parana Technologies

USA . 1,052 parts In-Stock

1+ parts

$75.801

100+ parts

-

1k+ parts

-

10k+ parts

-

1,052

$75.801

-

-

-

ChromeModa Solutions

Germany . 5,254 parts In-Stock

1+ parts

$85.170

100+ parts

$69.839

1k+ parts

-

10k+ parts

-

5,254

$85.170

$69.839

-

-

IDEA Electronic Components Group

UK . 958 parts In-Stock

1+ parts

$85.170

100+ parts

$80.912

1k+ parts

$76.653

10k+ parts

-

958

$85.170

$80.912

$76.653

-

Microchip USA

USA . 461 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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461

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-

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DigiPath Technology Company

USA . 123 parts In-Stock

1+ parts

-

100+ parts

$76.789

1k+ parts

-

10k+ parts

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123

-

$76.789

-

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Kepictronics

USA . 115 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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115

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Overview

Experience the next level of innovation with the LM3S8738-IBZ50-A2 microcontroller by Texas Instruments. Designed with precision and quality in mind, this advanced device offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this microcontroller provides seamless integration and efficient operation, ensuring your projects run smoothly and effectively. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations and unlocks endless possibilities for your designs. Elevate your creations with the LM3S8738-IBZ50-A2 microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy package body material provides durability and protection to the microcontroller, making it ideal for various applications.

Surface Mount: YES

Surface mount capability allows for easy installation and saves space on the PCB, making it convenient for compact designs.

Maximum Supply Voltage: 2.75 V

Low maximum supply voltage ensures safe operation and power efficiency of the microcontroller.

Package Shape: SQUARE

Square package shape allows for easier handling and placement on the PCB, enhancing the overall design aesthetics.

Bit Size: 32

32-bit architecture provides enhanced processing power and capabilities for the microcontroller, suitable for complex applications.

Power Supplies (V): 2.5,3.3

Multiple power supply options provide flexibility in voltage selection, catering to different power requirements.

No. of Terminals: 108

High number of terminals allows for versatile connectivity options and integration with various peripherals.

Package Style (Meter): GRID ARRAY

Grid array package style offers increased thermal performance and reliability for the microcontroller.

Minimum Supply Voltage: 2.25 V

Low minimum supply voltage ensures stable operation and power efficiency of the microcontroller.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range allows for reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range ensures functionality in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

Terminal finish of Tin Silver Copper provides excellent conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Built-in ADC channels enable analog signal conversion, expanding the microcontroller's functionality for diverse applications.

Terminal Position: BOTTOM

Bottom terminal position allows for easier PCB layout and routing of connections, simplifying the design process.

ROM Words: 131072

Large ROM capacity of 131072 words ensures ample memory storage for program and data storage.

Maximum Seated Height: 1.5 mm

Low maximum seated height minimizes the space requirements on the PCB, suitable for compact designs.

Width: 10 mm

Narrow width of 10mm facilitates space-saving layout on the PCB, ideal for applications with size constraints.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 0.032 MHz enables fast processing speed and real-time operations.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds maximum time at peak reflow temperature ensures safe and effective soldering during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C guarantees proper soldering and component mounting for reliable operation.

Length: 10 mm

Compact length of 10mm allows for space-efficient PCB layout and integration, suitable for miniaturized designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in rugged industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture microcontroller offers high-performance computing capabilities and efficient power consumption for optimal operation.

RAM Bytes: 65536

Large RAM capacity of 65536 bytes provides ample memory for data storage and processing, enhancing the microcontroller's performance.

Technology: CMOS

CMOS technology offers low power consumption and high integration density, making the microcontroller energy-efficient and compact.

Terminal Form: BALL

Ball terminal form facilitates reliable solder joint connections for secure PCB mounting.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage of 2.5V ensures consistent and reliable power delivery to the microcontroller.

PWM Channels: YES

PWM channels enable precise control of voltage levels, essential for applications requiring motor control or LED dimming.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible and easy firmware updates, enhancing the microcontroller's versatility.

Terminal Pitch: 0.8 mm

Narrow terminal pitch of 0.8mm enables high-density mounting and space-saving design for compact applications.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture, requiring proper handling and storage to prevent damage.

Speed: 50 rpm

Speed rating of 50 rpm ensures efficient processing and response times for applications requiring real-time operations.

No. of I/O Lines: 38

38 I/O lines provide versatile input and output options for interfacing with external devices, enhancing the microcontroller's connectivity.

Technical Specifications

Microcontrollers LM3S8738-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

38

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S8738-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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