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LM3S8733-EQC50-A2T

Texas Instruments

LM3S8733-EQC50-A2T by Texas Instruments

LM3S8733-EQC50-A2T by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 8.192 MHz, suitable for industrial applications requiring high-speed processing and ADC channels for analog signal conversion. With a compact flatpack package style and gull wing terminal form, it offers versatile integration options in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,068 parts In-Stock

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Digiode

USA . 2,035 parts In-Stock

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2,035

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Distributors (Availability)

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One Stop Electronics

USA . 667 parts In-Stock

1+ parts

$3.000

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667

$3.000

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AZTECH Wire

Italy . 865 parts In-Stock

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$8.090

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865

$8.090

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Parana Technologies

USA . 12 parts In-Stock

1+ parts

$65.098

100+ parts

$6,045.352

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$58.588

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12

$65.098

$6,045.352

$58.588

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DigiPath Technology Company

USA . 2,179 parts In-Stock

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$71.681

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2,179

$71.681

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IDEA Electronic Components Group

UK . 1,523 parts In-Stock

1+ parts

$73.144

100+ parts

$69.487

1k+ parts

$65.830

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1,523

$73.144

$69.487

$65.830

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ChromeModa Solutions

Germany . 856 parts In-Stock

1+ parts

$73.144

100+ parts

$59.978

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856

$73.144

$59.978

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Corphita

USA . 2,895 parts In-Stock

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Microchip USA

USA . 206 parts In-Stock

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Overview

Unleash the power of innovation with the LM3S8733-EQC50-A2T microcontroller by Texas Instruments. Built with precision and quality, this versatile device offers unmatched performance and reliability for a wide range of applications. From automotive to industrial automation, this product is designed to exceed expectations and deliver exceptional value to customers. Experience seamless operation, advanced features, and cutting-edge technology with the LM3S8733-EQC50-A2T - your key to unlocking endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body, ensuring the safety of the internal components.

Surface Mount: YES

Convenient for automated assembly processes, reducing production time and costs.

Maximum Supply Voltage: 2.75 V

Allows for safe operation within a specific voltage range, protecting the microcontroller from potential damage.

Package Shape: SQUARE

Space-efficient design for compact electronic devices.

Bit Size: 32

High processing capability for complex calculations and tasks.

Power Supplies (V): 2.5,3.3

Compatible with commonly used power supplies, making integration easier.

No. of Terminals: 100

Sufficient number of terminals for connecting external components and peripherals.

Package Style (Meter): FLATPACK

Slim profile for space-constrained applications.

Minimum Supply Voltage: 2.25 V

Allows for safe operation even at lower voltages, providing flexibility in power supply options.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Can operate in extremely low temperatures, making it versatile for various environments.

ADC Channels: YES

Ability to convert analog signals into digital data for processing.

Terminal Position: QUAD

Organized terminal layout for ease of connection and debugging.

ROM Words: 131072

Large storage capacity for program memory, allowing for complex algorithms and applications.

Maximum Seated Height: 1.6 mm

Low profile for slim device designs.

Width: 14 mm

Compact size for space-saving integration.

Maximum Clock Frequency: 8.192 MHz

High clock speed for fast processing of instructions.

Length: 14 mm

Compact size for space-saving integration.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient instruction execution and reduced power consumption.

RAM Bytes: 65536

Sufficient random access memory for data storage and manipulation.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals for secure and reliable connections.

Nominal Supply Voltage: 2.5 V

Optimal voltage for stable and efficient operation.

PWM Channels: YES

Capability to generate Pulse Width Modulation signals for precise control of output devices.

ROM Programmability: FLASH

Flash memory for convenient and fast reprogramming of the ROM.

Terminal Pitch: 0.5 mm

Fine pitch terminals for compact and reliable connections.

Speed: 50 rpm

Support for rotary motion control applications at a reasonable speed.

No. of I/O Lines: 35

Sufficient input-output lines for connecting external devices and sensors.

Technical Specifications

Microcontrollers LM3S8733-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

35

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S8733-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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