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LM3S8730-EQC50-A2

Texas Instruments

LM3S8730-EQC50-A2 by Texas Instruments

LM3S8730-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 8.192 MHz, suitable for industrial applications requiring high-speed processing and ADC channels for analog signal conversion. With a temperature range from -40 to 105 °C, it offers versatile performance in various environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,511 parts In-Stock

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7,511

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Digiode

USA . 110 parts In-Stock

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110

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One Stop Electronics

USA . 431 parts In-Stock

1+ parts

$8.000

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431

$8.000

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AZTECH Wire

Italy . 418 parts In-Stock

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$9.997

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418

$9.997

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Parana Technologies

USA . 1,807 parts In-Stock

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$69.254

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1,807

$69.254

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ChromeModa Solutions

Germany . 4,647 parts In-Stock

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$77.814

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$63.807

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4,647

$77.814

$63.807

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IDEA Electronic Components Group

UK . 2,057 parts In-Stock

1+ parts

$77.814

100+ parts

$73.923

1k+ parts

$70.033

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2,057

$77.814

$73.923

$70.033

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Corphita

USA . 2,167 parts In-Stock

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2,167

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DigiPath Technology Company

USA . 1,308 parts In-Stock

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$70.157

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Microchip USA

USA . 320 parts In-Stock

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Overview

Elevate your projects with the LM3S8730-EQC50-A2 microcontroller from Texas Instruments. Crafted with precision and expertise, this powerful device offers unmatched performance and reliability for a wide range of applications. Whether you're designing smart home systems, industrial automation, or wearable technology, this microcontroller delivers seamless integration and efficiency. Trust in Texas Instruments to provide cutting-edge technology that surpasses expectations. Experience the innovation and value of the LM3S8730-EQC50-A2 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body ensures durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient assembly onto circuit boards, streamlining the production process.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75V allows for efficient power management and operation within safe voltage limits.

Package Shape: SQUARE

The square package shape provides a compact form factor, optimizing space utilization in electronic designs.

Bit Size: 32

With a 32-bit architecture, this microcontroller offers high processing capabilities for complex tasks and computations.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages (2.5V and 3.3V) provides flexibility in voltage selection based on application requirements.

No. of Terminals: 100

Having 100 terminals allows for versatile connectivity options and interfaces with other components or peripherals.

Package Style (Meter): FLATPACK

The flatpack package style offers easy integration into electronic systems and enhances thermal management for improved reliability.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25V ensures operational stability even at lower voltage levels, enhancing the microcontroller's reliability.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, this microcontroller can withstand high temperature environments and industrial applications.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures functionality even in extreme cold conditions, making it suitable for diverse environments.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, allowing the microcontroller to interface with analog sensors and signals.

Terminal Position: QUAD

The quad terminal position facilitates easy handling and connection of the microcontroller to external components, enhancing usability.

ROM Words: 131072

With 131072 ROM words, this microcontroller offers ample memory for storing program instructions and data, catering to sophisticated applications.

Maximum Seated Height: 1.6 mm

The maximum seated height of 1.6mm ensures a low-profile design, suitable for compact electronic devices and space-constrained applications.

Width: 14 mm

The 14mm width provides a balance between space efficiency and component density, allowing for easy integration into PCB layouts.

Maximum Clock Frequency: 8.192 MHz

Support for a maximum clock frequency of 8.192MHz enables high-speed processing and efficient execution of instructions, enhancing overall performance.

Length: 14 mm

With a length of 14mm, this microcontroller maintains a compact form factor, ideal for applications where size constraints are a consideration.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation across a wide temperature range, making it suitable for demanding industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Featuring a microcontroller architecture with Reduced Instruction Set Computing (RISC), this product offers efficient instruction execution and high performance.

RAM Bytes: 65536

With 65536 bytes of RAM, this microcontroller provides sufficient memory for data storage and processing, supporting complex computational tasks.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high noise immunity, and reliable operation, enhancing the overall efficiency of the microcontroller.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering process and provides secure connections, facilitating reliable electrical contacts during assembly.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V serves as a standard operating voltage for consistent performance and compatibility with various power sources.

PWM Channels: YES

Support for PWM channels allows for precise control of digital signals, enabling efficient motor control, power management, and signal modulation.

ROM Programmability: FLASH

The flash ROM programmability offers reprogrammable memory capabilities, allowing for firmware updates and customization based on application requirements.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this microcontroller enables high-density mounting, making it suitable for compact designs and miniaturized electronic devices.

Speed: 50 rpm

The speed of 50 revolutions per minute (rpm) is indicative of the processing capabilities and execution speed of the microcontroller, supporting real-time applications.

No. of I/O Lines: 32

Having 32 input/output (I/O) lines enables versatile interfacing with external devices, sensors, and peripherals, enhancing connectivity and functionality.

Technical Specifications

Microcontrollers LM3S8730-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

32

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S8730-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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