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LM3S8630-IQC50-A2T

Texas Instruments

LM3S8630-IQC50-A2T by Texas Instruments

LM3S8630-IQC50-A2T by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 8.192 MHz, suitable for industrial applications requiring high-speed processing and control capabilities. With features like PWM channels and ADC support, it offers versatile functionality in compact FLATPACK package style for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,448 parts In-Stock

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Digiode

USA . 4,983 parts In-Stock

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4,983

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Distributors (Availability)

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AZTECH Wire

Italy . 868 parts In-Stock

1+ parts

$14.276

100+ parts

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868

$14.276

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One Stop Electronics

USA . 542 parts In-Stock

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$26.000

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542

$26.000

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Parana Technologies

USA . 337 parts In-Stock

1+ parts

$74.157

100+ parts

$6,886.563

1k+ parts

$66.741

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337

$74.157

$6,886.563

$66.741

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DigiPath Technology Company

USA . 445 parts In-Stock

1+ parts

$81.656

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445

$81.656

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ChromeModa Solutions

Germany . 3,096 parts In-Stock

1+ parts

$83.322

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$68.324

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3,096

$83.322

$68.324

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IDEA Electronic Components Group

UK . 795 parts In-Stock

1+ parts

$83.322

100+ parts

$79.156

1k+ parts

$74.990

10k+ parts

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795

$83.322

$79.156

$74.990

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Corphita

USA . 3,537 parts In-Stock

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Microchip USA

USA . 284 parts In-Stock

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Overview

Experience the power of innovation with the LM3S8630-IQC50-A2T by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality microcontrollers that are versatile and reliable. Whether you're looking to enhance your industrial automation system or develop cutting-edge IoT devices, this microcontroller is the perfect choice. With its advanced technology and impressive features, including a high clock frequency and ample I/O lines, the LM3S8630-IQC50-A2T offers unmatched value and performance. Trust Texas Instruments to bring your projects to life with precision and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability for the microcontroller package.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 2.75 V

Operates efficiently within a maximum supply voltage of 2.75V.

Package Shape: SQUARE

Square package shape enables easier integration into circuit designs.

Bit Size: 32

Larger bit size of 32 allows for more complex data processing and calculations.

Power Supplies (V): 2.5,3.3

Supports multiple power supply voltages for flexibility in different applications.

No. of Terminals: 100

Ample number of terminals for connecting to various peripherals and components.

Package Style (Meter): FLATPACK

Flatpack package style saves space on the circuit board and improves airflow.

Minimum Supply Voltage: 2.25 V

Works reliably even at low minimum supply voltage of 2.25V.

Maximum Operating Temperature: 85 °C

Operates efficiently in high-temperature environments up to 85°C.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold temperatures as low as -40°C.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and corrosion resistance.

ADC Channels: YES

Supports analog-to-digital conversion for interfacing with sensors and other analog devices.

Terminal Position: QUAD

Quad terminal position allows for secure and stable connections on the circuit board.

ROM Words: 131072

Large ROM capacity of 131072 words for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low seated height of 1.6mm facilitates compact and slim designs.

Width: 14 mm

Compact width of 14mm for fitting into tight spaces on the circuit board.

Maximum Clock Frequency: 8.192 MHz

High maximum clock frequency of 8.192 MHz for fast processing speed.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for up to 30 seconds, ensuring soldering reliability.

Peak Reflow Temperature °C: 260

Capable of withstanding high peak reflow temperature of 260°C during assembly.

Length: 14 mm

Compact length of 14mm for efficient use of space on the circuit board.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC microcontroller design provides efficient and fast processing capabilities.

RAM Bytes: 32768

Ample RAM capacity of 32768 bytes for storing and accessing data during operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for secure and reliable solder connections.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage of 2.5V for consistent performance.

PWM Channels: YES

Supports Pulse Width Modulation (PWM) channels for precise control of outputs.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates of firmware and software.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm for precise and compact connections.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, suitable for standard assembly processes.

Speed: 50 rpm

Operating speed of 50 rpm for efficient data processing and communication.

No. of I/O Lines: 31

Sufficient number of I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S8630-IQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

31

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S8630-IQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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