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LM3S8630-IQC50-A2

Texas Instruments

LM3S8630-IQC50-A2 by Texas Instruments

LM3S8630-IQC50-A2 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 8.192 MHz, making it ideal for industrial applications requiring high-speed processing and control capabilities. With a temperature range from -40 to 85°C, this microcontroller is suitable for various embedded systems that demand reliable performance in harsh environments.

Median Price

$15.620

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 58 parts In-Stock

1+ parts

-

100+ parts

$13.510

1k+ parts

$12.090

10k+ parts

$11.380

58

-

$13.510

$12.090

$11.380

DigiKey

USA . 57 parts In-Stock

1+ parts

-

100+ parts

$15.620

1k+ parts

-

10k+ parts

-

57

-

$15.620

-

-

Verical

USA . 47 parts In-Stock

1+ parts

-

100+ parts

$16.887

1k+ parts

$15.113

10k+ parts

$14.225

47

-

$16.887

$15.113

$14.225

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,862 parts In-Stock

1+ parts

$14.269

100+ parts

-

1k+ parts

-

10k+ parts

-

3,862

$14.269

-

-

-

Vyrian

USA . 4,635 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,635

-

-

-

-

DigiKey Marketplace

USA . 57 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

57

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 489 parts In-Stock

1+ parts

$13.518

100+ parts

-

1k+ parts

-

10k+ parts

-

489

$13.518

-

-

-

Microchip USA

USA . 425 parts In-Stock

1+ parts

$40.350

100+ parts

$39.770

1k+ parts

$39.480

10k+ parts

$39.200

425

$40.350

$39.770

$39.480

$39.200

Parana Technologies

USA . 1,681 parts In-Stock

1+ parts

$68.749

100+ parts

-

1k+ parts

-

10k+ parts

-

1,681

$68.749

-

-

-

ChromeModa Solutions

Germany . 2,459 parts In-Stock

1+ parts

$77.246

100+ parts

$63.342

1k+ parts

-

10k+ parts

-

2,459

$77.246

$63.342

-

-

IDEA Electronic Components Group

UK . 561 parts In-Stock

1+ parts

$77.246

100+ parts

$73.384

1k+ parts

$69.521

10k+ parts

-

561

$77.246

$73.384

$69.521

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

DigiPath Technology Company

USA . 349 parts In-Stock

1+ parts

-

100+ parts

$69.645

1k+ parts

-

10k+ parts

-

349

-

$69.645

-

-

Overview

Experience the power of innovation with the LM3S8630-IQC50-A2 microcontroller by Texas Instruments. Designed with precision and reliability in mind, this cutting-edge device offers unparalleled performance for a wide range of applications. From automation to consumer electronics, this versatile microcontroller delivers exceptional value, efficiency, and functionality to meet your unique needs. Trust in Texas Instruments to provide you with the quality and advantage you deserve. Elevate your projects to new heights with the LM3S8630-IQC50-A2 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the microcontroller, making it suitable for various applications in different environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 2.75 V

With a maximum supply voltage of 2.75 V, this microcontroller can operate efficiently without the risk of overloading or damage.

Package Shape: SQUARE

Square package shape ensures easy handling and placement on the PCB, optimizing space utilization in the design.

Bit Size: 32

With a 32-bit architecture, this microcontroller offers high processing power and performance, suitable for complex applications and tasks.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages (2.5V and 3.3V) allows flexibility in design and compatibility with different components in the system.

No. of Terminals: 100

Having 100 terminals provides ample connection options for interfacing with other components, peripherals, and sensors in the system.

Package Style (Meter): FLATPACK

Flatpack package style offers a low-profile design, making it suitable for compact and space-constrained applications.

Minimum Supply Voltage: 2.25 V

With a minimum supply voltage of 2.25 V, the microcontroller can operate within a wide voltage range, ensuring stability and performance.

Maximum Operating Temperature: 85 °C

Wide operating temperature range up to 85°C allows the microcontroller to function reliably in harsh environmental conditions or industrial settings.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes this microcontroller suitable for use in extreme cold environments or outdoor applications.

Terminal Finish: TIN

TIN terminal finish provides good conductivity and solderability, ensuring secure and stable connections on the PCB.

ADC Channels: YES

Integrated ADC channels allow for analog signal processing and conversion, expanding the microcontroller's capability for sensor interfacing and data acquisition.

Terminal Position: QUAD

Quad terminal position offers improved stability and mechanical strength, enhancing the reliability of the microcontroller's connections on the PCB.

ROM Words: 131072

Large ROM capacity of 131072 words allows for storing program instructions and data, enabling complex functionality and applications to be implemented on the microcontroller.

Maximum Seated Height: 1.6 mm

Low seated height of 1.6 mm ensures a compact profile and minimal space usage, ideal for applications where size and height constraints are critical.

Width: 14 mm

A width of 14 mm provides a compact form factor, making the microcontroller suitable for small-scale applications or designs with limited space.

Maximum Clock Frequency: 8.192 MHz

High maximum clock frequency of 8.192 MHz enables fast and efficient processing of instructions, improving overall performance and responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the microcontroller can undergo solder reflow processes without compromising its reliability or functionality.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for secure and reliable soldering of the microcontroller on the PCB during assembly.

Length: 14 mm

A length of 14 mm contributes to the microcontroller's compact design and space-saving features, making it suitable for applications with limited board real estate.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures the microcontroller's reliability and performance in demanding industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers high processing speed, efficient code execution, and reduced power consumption, making it ideal for embedded systems and IoT applications.

RAM Bytes: 32768

Generous RAM capacity of 32768 bytes allows for temporary data storage and efficient multitasking, enhancing the microcontroller's performance in handling complex tasks and computations.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and reliable operation, making the microcontroller energy-efficient and suitable for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and stability, ensuring secure attachment to the PCB and reliable electrical connections.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage of 2.5 V ensures consistent and reliable operation of the microcontroller, preventing voltage fluctuations that could impact performance.

PWM Channels: YES

Integrated PWM channels allow for precise control of pulse-width modulation signals, enabling the microcontroller to drive motors, LEDs, and other peripherals with accuracy and efficiency.

ROM Programmability: FLASH

Flash ROM programmability provides the flexibility to reprogram or update the microcontroller's firmware and code, facilitating rapid prototyping and debugging during development.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables high-density mounting and precise soldering, making it suitable for applications that require compact and space-efficient PCB designs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates the microcontroller's resistance to moisture and humidity, ensuring reliable performance in humid environments or during reflow soldering processes.

Speed: 50 rpm

Operational speed of 50 rpm allows for fast signal processing and execution of instructions, improving the microcontroller's overall performance and responsiveness.

No. of I/O Lines: 31

With 31 I/O lines, the microcontroller offers ample connectivity options for interfacing with external devices, sensors, and peripherals, enhancing its versatility in different applications.

Technical Specifications

Microcontrollers LM3S8630-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

31

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S8630-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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