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LM3S8630-EQC50-A2T

Texas Instruments

LM3S8630-EQC50-A2T by Texas Instruments

Texas Instruments LM3S8630-EQC50-A2T is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. Operating at up to 8.192 MHz, it features 31 I/O lines and PWM channels for industrial applications requiring high-speed processing in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,752 parts In-Stock

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4,752

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Vyrian

USA . 4,584 parts In-Stock

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4,584

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Distributors (Availability)

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One Stop Electronics

USA . 183 parts In-Stock

1+ parts

$10.000

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-

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183

$10.000

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AZTECH Wire

Italy . 737 parts In-Stock

1+ parts

$15.981

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737

$15.981

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Parana Technologies

USA . 66 parts In-Stock

1+ parts

$54.350

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66

$54.350

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DigiPath Technology Company

USA . 2,087 parts In-Stock

1+ parts

$59.846

100+ parts

$55.058

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2,087

$59.846

$55.058

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ChromeModa Solutions

Germany . 5,094 parts In-Stock

1+ parts

$61.067

100+ parts

$50.075

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5,094

$61.067

$50.075

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IDEA Electronic Components Group

UK . 1,973 parts In-Stock

1+ parts

$61.067

100+ parts

$58.014

1k+ parts

$54.960

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1,973

$61.067

$58.014

$54.960

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Corphita

USA . 2,428 parts In-Stock

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2,428

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Microchip USA

USA . 201 parts In-Stock

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201

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Overview

Experience the next level of innovation with the LM3S8630-EQC50-A2T by Texas Instruments. As a leader in microcontrollers, Texas Instruments delivers unmatched quality and reliability. This powerful microcontroller boasts a 32-bit architecture with an array of features perfect for a wide range of applications. From industrial automation to consumer electronics, this product offers exceptional value, benefits, and advantages to customers looking for cutting-edge technology. Upgrade your projects today with the LM3S8630-EQC50-A2T and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resistant to damage, ensuring the product's longevity.

Surface Mount: YES

Makes it easy to mount the microcontroller on a PCB, saving space and simplifying the manufacturing process.

Bit Size: 32

A larger bit size allows for more complex operations and calculations to be performed by the microcontroller.

Maximum Operating Temperature: 105 °C

This high operating temperature range makes the microcontroller suitable for industrial applications where temperature fluctuations are common.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to convert analog signals to digital, making it versatile for a variety of sensor applications.

RAM Bytes: 32768

With a large RAM capacity, the microcontroller can efficiently store and manipulate data for complex tasks.

Speed: 50 rpm

The speed of 50 rpm indicates the microcontroller's processing capability, making it suitable for real-time applications that require quick responses.

Technical Specifications

Microcontrollers LM3S8630-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

31

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S8630-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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