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LM3S8538-IBZ50-A2T

Texas Instruments

LM3S8538-IBZ50-A2T by Texas Instruments

LM3S8538-IBZ50-A2T by Texas Instruments is a 32-bit microcontroller with 108 terminals, operating at a max frequency of 0.032 MHz. It features 65536 bytes of RAM and 98304 ROM words, suitable for industrial applications requiring PWM channels and ADC functionality.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 8,541 parts In-Stock

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Digiode

USA . 3,709 parts In-Stock

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AZTECH Wire

Italy . 573 parts In-Stock

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$6.900

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One Stop Electronics

USA . 1,598 parts In-Stock

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Ampacity Inc.

Singapore . 1,406 parts In-Stock

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Parana Technologies

USA . 2,194 parts In-Stock

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ChromeModa Solutions

Germany . 2,962 parts In-Stock

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$64.718

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$53.069

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IDEA Electronic Components Group

UK . 269 parts In-Stock

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$64.718

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$61.482

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$58.246

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Corphita

USA . 3,527 parts In-Stock

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DigiPath Technology Company

USA . 2,004 parts In-Stock

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Microchip USA

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Overview

Elevate your projects with the LM3S8538-IBZ50-A2T microcontroller by Texas Instruments. Designed with precision and innovation, this powerful device offers unparalleled performance and reliability for a wide range of applications. With cutting-edge technology and top-notch quality, Texas Instruments sets the standard in the industry. Unlock endless possibilities and streamline your projects with the LM3S8538-IBZ50-A2T, delivering exceptional value, efficiency, and versatility to customers seeking top-tier microcontroller solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and efficient installation on printed circuit boards, saving time and effort during production.

Maximum Supply Voltage: 2.75 V

Optimal voltage level for efficient performance without risking damage to the microcontroller.

Bit Size: 32

Provides sufficient processing power and capability to handle complex tasks and calculations.

Power Supplies (V): 2.5,3.3

Offers flexibility in power options to accommodate different system requirements and environments.

No. of Terminals: 108

Provides a sufficient number of connections for interfacing with other components and peripherals in a system.

Package Style (Meter): GRID ARRAY

Grid array package style offers enhanced thermal performance and reliability for the microcontroller.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, making it suitable for a wide range of environments and applications.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling the microcontroller to interact with analog sensors and signals.

ROM Words: 98304

Ample read-only memory capacity for storing program instructions and data, offering flexibility for software development.

Maximum Clock Frequency: 0.032 MHz

High clock frequency enables fast and efficient processing of instructions, improving overall system performance.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient execution of instructions, making the microcontroller suitable for real-time applications.

RAM Bytes: 65536

Sufficient random access memory for temporary data storage, enabling smooth operation and multitasking capabilities.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the microcontroller, enabling flexibility for software updates and modifications.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates the microcontroller can withstand moderate exposure to moisture during storage and operation.

Technical Specifications

Microcontrollers LM3S8538-IBZ50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

36

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S8538-IBZ50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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