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LM3S8538-EQC50-A2

Texas Instruments

LM3S8538-EQC50-A2 by Texas Instruments

LM3S8538-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 36 I/O lines, 65536 RAM bytes, and 98304 ROM words. It operates in industrial temperatures (-40 to 105 °C) and features PWM channels for various applications. This compact device has a max clock frequency of 0.032 MHz and is suitable for embedded systems requiring high-speed processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,503 parts In-Stock

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Digiode

USA . 1,362 parts In-Stock

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One Stop Electronics

USA . 1,403 parts In-Stock

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$19.000

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$19.000

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AZTECH Wire

Italy . 775 parts In-Stock

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$19.038

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Parana Technologies

USA . 1,531 parts In-Stock

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$47.475

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DigiPath Technology Company

USA . 620 parts In-Stock

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$52.276

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ChromeModa Solutions

Germany . 5,853 parts In-Stock

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$53.343

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$43.741

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IDEA Electronic Components Group

UK . 761 parts In-Stock

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$53.343

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$50.676

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$48.009

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Corphita

USA . 810 parts In-Stock

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Microchip USA

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Overview

Experience the cutting-edge technology of the LM3S8538-EQC50-A2 by Texas Instruments, a top-tier microcontroller designed with precision and quality in mind. With its versatile applications in various industries, this microcontroller offers unparalleled performance and reliability. Benefit from its advanced features and innovative design, all while enjoying the value and advantages it brings to your projects. Upgrade your development process with the LM3S8538-EQC50-A2 and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for package body, ensuring longevity and affordability.

Surface Mount: YES

Easy to integrate into circuit boards, simplifying the assembly process.

Maximum Supply Voltage: 2.75 V

Suitable for low power applications, making it energy efficient.

Package Shape: SQUARE

Efficient use of space and easy to mount in compact designs.

Bit Size: 32

High-performance processing capabilities for complex tasks.

Power Supplies (V): 2.5,3.3

Versatile voltage options for compatibility with different systems.

No. of Terminals: 100

Sufficient number of terminals for versatile connectivity options.

Package Style (Meter): FLATPACK

Space-saving design for compact applications.

Minimum Supply Voltage: 2.25 V

Ensures reliable operation even at lower power levels.

Maximum Operating Temperature: 105 °C

Suitable for industrial environments with high temperature conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range for versatility in various environments.

ADC Channels: YES

Integrated Analog-to-Digital converters for efficient signal processing.

Terminal Position: QUAD

Quad terminal configuration for easy and secure connections.

ROM Words: 98304

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low-profile design for slim devices and space-constrained applications.

Width: 14 mm

Compact width for easy integration into narrow spaces.

Maximum Clock Frequency: 0.032 MHz

High clock frequency for fast and efficient processing.

Length: 14 mm

Compact length for space-saving installations.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial applications with demanding temperature requirements.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient and streamlined processing.

RAM Bytes: 65536

Large RAM capacity for data storage and manipulation.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal design for secure and reliable connections.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage for consistent performance.

PWM Channels: YES

Integrated Pulse Width Modulation channels for precise control of output signals.

ROM Programmability: FLASH

Flash programmable ROM for easy and efficient programming of the device.

Terminal Pitch: 0.5 mm

Small terminal pitch for fine-pitch mounting and compact designs.

Speed: 50 rpm

Rotational speed for specific applications requiring controlled movement.

No. of I/O Lines: 36

Sufficient number of Input/Output lines for versatile connectivity and communication.

Technical Specifications

Microcontrollers LM3S8538-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

36

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S8538-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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