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LM3S8530-IQC50-A2

Texas Instruments

LM3S8530-IQC50-A2 by Texas Instruments

LM3S8530-IQC50-A2 by Texas Instruments is a 32-bit microcontroller with Cortex-M3 CPU family, featuring 65536 bytes of RAM and 98304 ROM words. It operates at a max clock frequency of 50 MHz, has CAN(3), Ethernet, I2C connectivity, and offers low power mode for industrial applications.

Median Price

$29.900

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 260 parts In-Stock

1+ parts

-

100+ parts

$25.880

1k+ parts

$23.150

10k+ parts

$21.790

260

-

$25.880

$23.150

$21.790

DigiKey

USA . 180 parts In-Stock

1+ parts

-

100+ parts

$29.900

1k+ parts

-

10k+ parts

-

180

-

$29.900

-

-

Verical

USA . 180 parts In-Stock

1+ parts

-

100+ parts

$32.350

1k+ parts

$28.938

10k+ parts

$27.238

180

-

$32.350

$28.938

$27.238

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 159 parts In-Stock

1+ parts

$27.312

100+ parts

-

1k+ parts

-

10k+ parts

-

159

$27.312

-

-

-

Vyrian

USA . 2,101 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,101

-

-

-

-

DigiKey Marketplace

USA . 260 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

260

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,460 parts In-Stock

1+ parts

$25.875

100+ parts

-

1k+ parts

-

10k+ parts

-

4,460

$25.875

-

-

-

Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$34.524

100+ parts

$31.417

1k+ parts

$28.310

10k+ parts

-

50

$34.524

$31.417

$28.310

-

Parana Technologies

USA . 891 parts In-Stock

1+ parts

$54.060

100+ parts

-

1k+ parts

-

10k+ parts

-

891

$54.060

-

-

-

DigiPath Technology Company

USA . 1,966 parts In-Stock

1+ parts

$59.527

100+ parts

$54.765

1k+ parts

-

10k+ parts

-

1,966

$59.527

$54.765

-

-

ChromeModa Solutions

Germany . 3,408 parts In-Stock

1+ parts

$60.742

100+ parts

$49.808

1k+ parts

-

10k+ parts

-

3,408

$60.742

$49.808

-

-

IDEA Electronic Components Group

UK . 1,914 parts In-Stock

1+ parts

$60.742

100+ parts

$57.705

1k+ parts

$54.668

10k+ parts

-

1,914

$60.742

$57.705

$54.668

-

Microchip USA

USA . 478 parts In-Stock

1+ parts

$72.470

100+ parts

$71.210

1k+ parts

$70.580

10k+ parts

$69.950

478

$72.470

$71.210

$70.580

$69.950

Overview

Unlock new possibilities with the LM3S8530-IQC50-A2 microcontroller from Texas Instruments. Crafted with precision and quality, this device offers unmatched performance in various applications. With integrated cache and low power mode, this product ensures efficiency while providing connectivity through CAN, Ethernet, I2C, SSI, and UART interfaces. Ideal for industrial use, this Cortex-M3 CPU family microcontroller boasts a maximum clock frequency of 50 MHz and features 4 timers and PWM channels. Experience innovation like never before with the LM3S8530-IQC50-A2 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various environments.

Integrated Cache: YES

The integrated cache helps improve the processing speed and efficiency of the microcontroller.

Maximum Supply Voltage: 2.75 V

Operating within this voltage range ensures stable performance and prevents damage to the microcontroller.

CPU Family: CORTEX-M3

Being a part of the CORTEX-M3 family indicates that this microcontroller offers high performance and energy efficiency.

ROM Programmability: FLASH

Using FLASH for ROM programmability allows for faster and easier updates to the microcontroller's firmware.

Technical Specifications

Microcontrollers LM3S8530-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

8

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

35

No. of Serial I/Os:

8

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), ETHERNET, I2C, SSI(2), UART

Peripherals:

TIMER(4), WDT

Trade Compliance

LM3S8530-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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