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LM3S818-EGZ50-C2T

Texas Instruments

LM3S818-EGZ50-C2T by Texas Instruments

LM3S818-EGZ50-C2T by Texas Instruments is a 32-bit microcontroller with 48 terminals, 8192 bytes of RAM, and 65536 ROM words. It operates at a max clock frequency of 8 MHz and has PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,582 parts In-Stock

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Digiode

USA . 2,900 parts In-Stock

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2,900

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 265 parts In-Stock

1+ parts

$16.038

100+ parts

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265

$16.038

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One Stop Electronics

USA . 579 parts In-Stock

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$28.000

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579

$28.000

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Parana Technologies

USA . 1,619 parts In-Stock

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$62.720

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1,619

$62.720

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DigiPath Technology Company

USA . 730 parts In-Stock

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$69.063

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730

$69.063

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ChromeModa Solutions

Germany . 4,814 parts In-Stock

1+ parts

$70.472

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$57.787

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4,814

$70.472

$57.787

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IDEA Electronic Components Group

UK . 1,328 parts In-Stock

1+ parts

$70.472

100+ parts

$66.948

1k+ parts

$63.425

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1,328

$70.472

$66.948

$63.425

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Microchip USA

USA . 2,554 parts In-Stock

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Corphita

USA . 1,716 parts In-Stock

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1,716

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Overview

Unlock endless possibilities with the LM3S818-EGZ50-C2T by Texas Instruments. As a leading manufacturer in microcontrollers, Texas Instruments delivers unparalleled quality and reliability. Ideal for a wide range of applications, this powerful 32-bit microcontroller offers customers exceptional value and benefits. From industrial automation to consumer electronics, the LM3S818-EGZ50-C2T provides the performance and features you need to bring your innovative ideas to life. Experience the advantage of superior technology with Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation and reduces the overall size of the product, making it ideal for compact applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, providing flexibility in different operating environments.

Package Shape: SQUARE

The square package shape simplifies PCB layout and space utilization, enhancing the overall design efficiency.

Bit Size: 32

With a 32-bit architecture, this microcontroller offers enhanced processing power and performance for demanding applications.

Power Supplies (V): 3.3

The 3.3V power supply ensures efficient power consumption and compatibility with various voltage requirements.

No. of Terminals: 48

With 48 terminals, this microcontroller provides ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers improved thermal performance and protection, ensuring reliability in harsh operating conditions.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V ensures reliable operation even under low voltage conditions, increasing the product's versatility.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, this microcontroller can withstand elevated temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the microcontroller's functionality across a wide range of temperature conditions.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, making this microcontroller suitable for applications requiring precise measurement and monitoring.

Terminal Position: QUAD

The quad terminal position facilitates easy connectivity and soldering, simplifying the assembly process and enhancing product reliability.

ROM Words: 65536

With a ROM capacity of 65536 words, this microcontroller offers ample storage for program code and data, accommodating complex algorithms and applications.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm allows for compact and slim device designs, enabling integration into space-constrained applications.

Width: 6.875 mm

The narrow width of 6.875mm facilitates PCB integration and space efficiency, making it suitable for compact electronic devices.

Maximum Clock Frequency: 8 MHz

The high maximum clock frequency of 8MHz allows for fast processing speeds and real-time operation, enhancing the microcontroller's performance capabilities.

Length: 6.875 mm

The compact length of 6.875mm contributes to overall space savings and design flexibility, particularly in size-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in rugged environments and extended temperature ranges, making this microcontroller suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Featuring a RISC-based microcontroller design, this product offers enhanced performance, energy efficiency, and faster execution of instructions, making it suitable for high-speed applications.

RAM Bytes: 8192

With a RAM capacity of 8192 bytes, this microcontroller provides sufficient memory for data storage, buffering, and temporary storage of program variables.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high noise immunity, and reliable operation, making this microcontroller energy-efficient and durable.

Terminal Form: NO LEAD

The no lead terminal form simplifies the soldering process, reduces assembly time, and improves overall reliability by minimizing potential solder joint failures.

Maximum Supply Current: 110 mA

With a maximum supply current of 110mA, this microcontroller offers efficient power consumption and thermal management, ensuring stable operation under varying load conditions.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V provides a stable and reliable power source for the microcontroller's operation, ensuring consistent performance across different operating conditions.

PWM Channels: YES

The presence of PWM channels allows for precise control of analog output signals, making this microcontroller suitable for applications requiring motor control, lighting control, and power management.

ROM Programmability: FLASH

Featuring flash ROM programmability, this microcontroller allows for easy and fast programming and reprogramming of firmware, enabling quick prototyping and development cycles.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm enables high-density mounting and compact PCB designs, making it ideal for miniaturized electronic devices and space-constrained applications.

Speed: 50 rpm

The speed capability of 50 rpm enables quick and responsive operation, making this microcontroller suitable for applications requiring rapid data processing and real-time control.

No. of I/O Lines: 30

With 30 I/O lines, this microcontroller offers versatile connectivity options for interfacing with peripheral devices, sensors, and external components, enhancing the overall functionality of the product.

Technical Specifications

Microcontrollers LM3S818-EGZ50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

30

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S818-EGZ50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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