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LM3S817-IQN50-C2T

Texas Instruments

LM3S817-IQN50-C2T by Texas Instruments

LM3S817-IQN50-C2T by Texas Instruments is a 32-bit microcontroller with Cortex-M3 CPU family, featuring 8192 bytes of RAM and 65536 ROM words. It offers 6-channel 10-bit ADC, PWM with 6 channels, and connectivity through SSI and UART(2). Ideal for industrial applications requiring low power mode operation at temperatures ranging from -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,720 parts In-Stock

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2,720

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Digiode

USA . 2,054 parts In-Stock

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2,054

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Distributors (Availability)

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AZTECH Wire

Italy . 852 parts In-Stock

1+ parts

$7.330

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852

$7.330

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One Stop Electronics

USA . 797 parts In-Stock

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$10.000

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797

$10.000

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Microchip USA

USA . 4,551 parts In-Stock

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$19.820

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$19.540

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$19.390

10k+ parts

$19.250

4,551

$19.820

$19.540

$19.390

$19.250

Parana Technologies

USA . 617 parts In-Stock

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$24.342

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$25.012

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617

$24.342

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$25.012

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DigiPath Technology Company

USA . 1,573 parts In-Stock

1+ parts

$26.803

100+ parts

$24.659

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1,573

$26.803

$24.659

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ChromeModa Solutions

Germany . 3,930 parts In-Stock

1+ parts

$27.350

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$22.427

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3,930

$27.350

$22.427

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IDEA Electronic Components Group

UK . 1,305 parts In-Stock

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$27.350

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$25.982

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$24.615

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1,305

$27.350

$25.982

$24.615

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Corphita

USA . 4,833 parts In-Stock

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4,833

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Overview

Unleash the power of innovation with the LM3S817-IQN50-C2T by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality microcontrollers that are versatile and reliable. Ideal for a wide range of applications, this microcontroller offers unparalleled value with its integrated cache, low power mode, and multiple peripherals. Whether you're looking to enhance your IoT devices or streamline your industrial processes, the LM3S817-IQN50-C2T provides the performance and efficiency you need to stay ahead of the competition. Elevate your projects with Texas Instruments' cutting-edge technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the microcontroller lightweight and durable, suitable for various applications.

Integrated Cache: YES

Having an integrated cache helps in improving the performance and efficiency of the microcontroller by reducing data access time.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can operate efficiently within a wide voltage range.

CPU Family: CORTEX-M3

Being part of the CORTEX-M3 family ensures that this microcontroller offers high performance, low power consumption, and advanced features for various applications.

ADC Channels: YES

The availability of ADC channels allows the microcontroller to convert analog signals into digital data, making it suitable for sensor interfacing and measurement applications.

ROM Programmability: FLASH

The ROM programmability through FLASH technology offers flexibility and ease of reprogramming the microcontroller for different application requirements.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, this microcontroller has moderate sensitivity to moisture, ensuring reliability in various environmental conditions.

Technical Specifications

Microcontrollers LM3S817-IQN50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

30

No. of Serial I/Os:

3

No. of Terminals:

48

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SSI, UART(2)

Peripherals:

PWM(6), TIMER(3), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

LM3S817-IQN50-C2T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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