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LM3S815-EQN50-C2

Texas Instruments

LM3S815-EQN50-C2 by Texas Instruments

LM3S815-EQN50-C2 by Texas Instruments is a 32-bit microcontroller with 65536 ROM words and 8192 RAM bytes. Operating at a max clock frequency of 8 MHz, it is ideal for industrial applications requiring up to 34 I/O lines and PWM channels. With a temperature range from -40°C to 105°C, this CMOS technology-based microcontroller offers high performance in various environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 8,342 parts In-Stock

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Digiode

USA . 193 parts In-Stock

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AZTECH Wire

Italy . 317 parts In-Stock

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$10.513

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One Stop Electronics

USA . 411 parts In-Stock

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$34.000

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Parana Technologies

USA . 956 parts In-Stock

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$39.517

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DigiPath Technology Company

USA . 1,439 parts In-Stock

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$43.513

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$40.032

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$40.032

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ChromeModa Solutions

Germany . 1,718 parts In-Stock

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$44.401

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$36.409

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IDEA Electronic Components Group

UK . 90 parts In-Stock

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$44.401

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$42.181

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$39.961

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90

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Corphita

USA . 1,400 parts In-Stock

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Microchip USA

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Overview

Unlock the power of innovation with the LM3S815-EQN50-C2 microcontroller by Texas Instruments. Crafted with precision and expertise, this device offers unparalleled performance in a compact package. Ideal for a wide range of applications, from robotics to industrial automation, this microcontroller boasts a 32-bit architecture, advanced ADC channels, and PWM capabilities. Experience the seamless integration of cutting-edge technology and reliability, all at your fingertips. Join the future of electronics with Texas Instruments and elevate your projects to new heights with the LM3S815-EQN50-C2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Can operate efficiently within a safe voltage range, ensuring reliable performance.

Package Shape: SQUARE

Square shape allows for easy placement and alignment on a PCB, enhancing the overall design.

Bit Size: 32

Offers a high level of processing power and capability for handling complex tasks efficiently.

Power Supplies (V): 3.3

Operates on a standard power supply voltage, making it compatible with many existing systems.

No. of Terminals: 48

Provides ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK

Flatpack design enhances heat dissipation and ease of mounting, improving overall performance.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, making it suitable for diverse environments.

ADC Channels: YES

Integrated analog-to-digital converters enable the microcontroller to read and process analog signals.

ROM Words: 65536

Large ROM capacity allows for storing extensive program code and data, enhancing versatility.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables efficient processing and execution of instructions, improving overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring energy efficiency and reliability.

Maximum Clock Frequency: 8 MHz

High clock frequency allows for fast data processing and response times, enhancing overall system speed.

RAM Bytes: 8192

Ample RAM capacity for temporary data storage and quick access, enabling multitasking and efficient operation.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updating of firmware, enhancing flexibility and future-proofing.

Technical Specifications

Microcontrollers LM3S815-EQN50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

34

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S815-EQN50-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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