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LM3S811-EGZ50-C2

Texas Instruments

LM3S811-EGZ50-C2 by Texas Instruments

LM3S811-EGZ50-C2 by Texas Instruments is a 32-bit microcontroller with 48 terminals and 8192 bytes of RAM. Operating at a max clock frequency of 0.032 MHz, it is suitable for industrial applications requiring ADC channels, PWM channels, and ROM programmability via FLASH technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,836 parts In-Stock

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Digiode

USA . 4,627 parts In-Stock

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4,627

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Distributors (Availability)

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AZTECH Wire

Italy . 741 parts In-Stock

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$15.677

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$15.677

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One Stop Electronics

USA . 849 parts In-Stock

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$25.000

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849

$25.000

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Parana Technologies

USA . 1,104 parts In-Stock

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$51.989

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$51.989

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DigiPath Technology Company

USA . 1,537 parts In-Stock

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$57.247

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$52.667

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$57.247

$52.667

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ChromeModa Solutions

Germany . 2,398 parts In-Stock

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$58.415

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$47.900

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$58.415

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IDEA Electronic Components Group

UK . 2,058 parts In-Stock

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$58.415

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$55.494

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$52.574

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2,058

$58.415

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$52.574

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Corphita

USA . 4,285 parts In-Stock

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Microchip USA

USA . 1,423 parts In-Stock

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Overview

Unlock the power of innovation with the LM3S811-EGZ50-C2 microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in all their products. This microcontroller is versatile and perfect for a wide range of applications, providing customers with endless possibilities. With 32-bit processing power and advanced features like ADC channels and PWM channels, this microcontroller offers unmatched value and performance. Trust Texas Instruments to deliver cutting-edge technology that pushes your projects to new heights.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easier and more compact integration onto circuit boards, saving space and potentially reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages, providing flexibility in power supply options and allowing for compatibility with various components in a system.

Package Shape: SQUARE

Square package shape helps with efficient use of space on a PCB layout, making it easier to design compact and sleek devices.

Bit Size: 32

32-bit architecture provides higher computational capabilities and better performance for running complex algorithms and tasks.

Power Supplies (V): 3.3

Stable power supply at 3.3 volts ensures reliable operation and compatibility with a wide range of peripherals and sensors.

No. of Terminals: 48

Ample number of terminals allow for connectivity to various external components, enabling versatile functionality and customization.

Package Style (Meter): CHIP CARRIER

Chip carrier packages offer good thermal performance and electrical connectivity, making them suitable for high-density applications.

Minimum Supply Voltage: 3 V

Can operate at lower supply voltages, providing energy efficiency and compatibility with battery-powered devices.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliable performance in harsh environments and industrial applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in extreme temperature conditions, making it suitable for outdoor and automotive applications.

ADC Channels: YES

Built-in Analog-to-Digital Converter (ADC) channels enable the microcontroller to interface with analog sensors and signals, expanding its capabilities.

Terminal Position: QUAD

Quad terminal position offers ease of soldering and secure connections, ensuring reliable performance in demanding operating conditions.

ROM Words: 65536

Large ROM capacity allows for storing a significant amount of program data and instructions, enabling complex software applications to run efficiently.

Maximum Seated Height: 1 mm

Low seated height is beneficial for compact device designs and slim form factors, offering flexibility in PCB layout and integration.

Width: 6.875 mm

Small width size facilitates space-saving PCB layouts and efficient use of board real estate, ideal for compact and portable devices.

Maximum Clock Frequency: 0.032 MHz

High clock frequency enables faster processing speeds and improved performance for time-critical applications and real-time processing tasks.

Length: 6.875 mm

Compact length size contributes to overall space efficiency in device design, aiding in creating sleek and streamlined product aesthetics.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh industrial environments with fluctuating temperatures and challenging conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides fast and efficient processing, enhancing the microcontroller's performance and responsiveness in running software algorithms.

RAM Bytes: 8192

Sufficient RAM capacity allows for efficient data storage and manipulation, supporting multitasking and complex computing tasks with ease.

Technology: CMOS

CMOS technology ensures low power consumption, high speed, and compatibility with various digital systems, making the microcontroller energy-efficient and versatile.

Terminal Form: NO LEAD

No-lead terminal form offers improved electrical performance, thermal management, and reliability, ensuring secure connections and long-term stability.

Maximum Supply Current: 110 mA

Low maximum supply current consumption contributes to energy efficiency and extended battery life for portable and battery-operated devices.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage at 3.3 volts ensures consistent performance and compatibility with a wide range of electronic components and peripherals.

PWM Channels: YES

Built-in Pulse Width Modulation (PWM) channels enable the microcontroller to control and regulate power output, making it suitable for motor control and lighting applications.

ROM Programmability: FLASH

Flash-based ROM programmability allows for easy and quick reprogramming of firmware, enabling efficient development and debugging of software applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch facilitates high-density PCB designs and precise soldering, ensuring reliable electrical connections and signal integrity.

Speed: 50 rpm

Operating speed of 50 revolutions per minute (rpm) indicates good performance for rotational motion control and sensor interfacing applications.

No. of I/O Lines: 32

Ample number of input/output (I/O) lines offer flexibility in interfacing with external devices and components, enabling versatile functionality and connectivity.

Technical Specifications

Microcontrollers LM3S811-EGZ50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

32

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S811-EGZ50-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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