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LM3S801-IQN50-C2T

Texas Instruments

LM3S801-IQN50-C2T by Texas Instruments

LM3S801-IQN50-C2T by Texas Instruments is a 32-bit microcontroller with 36 I/O lines, 8192 bytes of RAM, and 65536 ROM words. It operates at a max clock frequency of 0.032 MHz and is suitable for industrial applications requiring a RISC-based microcontroller with PWM channels and ADC capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,444 parts In-Stock

1+ parts

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8,444

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Digiode

USA . 4,860 parts In-Stock

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4,860

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 208 parts In-Stock

1+ parts

$10.448

100+ parts

-

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208

$10.448

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One Stop Electronics

USA . 927 parts In-Stock

1+ parts

$14.000

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-

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927

$14.000

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Microchip USA

USA . 3,676 parts In-Stock

1+ parts

$26.030

100+ parts

$25.870

1k+ parts

$25.790

10k+ parts

$25.710

3,676

$26.030

$25.870

$25.790

$25.710

Parana Technologies

USA . 1,527 parts In-Stock

1+ parts

$27.006

100+ parts

-

1k+ parts

$31.131

10k+ parts

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1,527

$27.006

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$31.131

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ChromeModa Solutions

Germany . 5,722 parts In-Stock

1+ parts

$30.344

100+ parts

$24.882

1k+ parts

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5,722

$30.344

$24.882

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IDEA Electronic Components Group

UK . 2,177 parts In-Stock

1+ parts

$30.344

100+ parts

$28.827

1k+ parts

$27.310

10k+ parts

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2,177

$30.344

$28.827

$27.310

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Corphita

USA . 4,523 parts In-Stock

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4,523

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DigiPath Technology Company

USA . 725 parts In-Stock

1+ parts

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100+ parts

$27.358

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725

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$27.358

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Overview

Unleash the power of innovation with the LM3S801-IQN50-C2T by Texas Instruments, a cutting-edge microcontroller designed to elevate your projects to new heights. Crafted with precision and expertise, Texas Instruments delivers unparalleled quality, reliability, and performance. Ideal for a diverse range of applications, this microcontroller boasts superior functionality, efficiency, and versatility. Experience seamless integration, optimal performance, and endless possibilities with the LM3S801-IQN50-C2T. Elevate your creations and bring your ideas to life with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durable and lightweight construction for the microcontroller.

Surface Mount: YES

Facilitates easy and compact PCB assembly.

Maximum Supply Voltage: 3.6 V

Allows for a higher voltage input range for versatile applications.

Package Shape: SQUARE

Optimizes space utilization on the PCB.

Bit Size: 32

Offers a higher processing capability and data handling capacity.

Power Supplies (V): 3.3

Operates efficiently within a standard voltage range.

No. of Terminals: 48

Provides ample connection options for peripheral devices.

Package Style (Meter): FLATPACK

Enhances thermal performance and ease of soldering.

Minimum Supply Voltage: 3 V

Ensures reliable operation even at lower input voltages.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with higher temperature ranges.

Minimum Operating Temperature: -40 °C

Maintains functionality in extreme cold conditions.

Terminal Finish: TIN

Provides corrosion resistance and excellent electrical conductivity.

ADC Channels: YES

Enables analog-to-digital conversion for sensor interfacing.

Terminal Position: QUAD

Facilitates easy PCB layout and routing of signals.

ROM Words: 65536

Offers ample memory capacity for program storage.

Maximum Seated Height: 1.6 mm

Allows for compact designs and slim profile applications.

Width: 7 mm

Contributes to the overall compact form factor of the microcontroller.

Maximum Clock Frequency: 0.032 MHz

Supports high-speed processing and real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable solder joints during PCB assembly.

Peak Reflow Temperature °C: 260

Suits lead-free soldering processes for environmental compliance.

Length: 7 mm

Contributes to the form factor and footprint of the microcontroller.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes Reduced Instruction Set Computing architecture for efficient processing.

RAM Bytes: 8192

Provides sufficient random access memory for data storage and processing.

Technology: CMOS

Employs Complementary Metal-Oxide-Semiconductor technology for low power consumption.

Terminal Form: GULL WING

Facilitates easy soldering and robust mechanical connection.

Maximum Supply Current: 110 mA

Operates within a low power consumption range for energy efficiency.

Nominal Supply Voltage: 3.3 V

Maintains stable operation at a standard supply voltage level.

PWM Channels: YES

Supports Pulse-Width Modulation for precise control of output signals.

ROM Programmability: FLASH

Allows for flexible and fast reprogramming of the read-only memory.

Terminal Pitch: 0.5 mm

Enables fine-pitch connections for space-saving PCB layout.

Moisture Sensitivity Level (MSL): 3

Indicates moderate sensitivity to moisture during storage and handling.

Speed: 50 rpm

Supports processing tasks at a moderate speed for diverse applications.

No. of I/O Lines: 36

Provides versatile input/output interfaces for peripheral device connectivity.

Technical Specifications

Microcontrollers LM3S801-IQN50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

36

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S801-IQN50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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