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LM3S801-IGZ50-C2T

Texas Instruments

LM3S801-IGZ50-C2T by Texas Instruments

LM3S801-IGZ50-C2T by Texas Instruments is a 32-bit microcontroller with 36 I/O lines, 8192 bytes of RAM, and 65536 ROM words. It operates at a max clock frequency of 0.032 MHz and has PWM channels for industrial applications requiring precise control and data processing within the temperature range of -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,795 parts In-Stock

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4,795

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Digiode

USA . 1,474 parts In-Stock

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1,474

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Distributors (Availability)

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AZTECH Wire

Italy . 411 parts In-Stock

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$17.929

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411

$17.929

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One Stop Electronics

USA . 171 parts In-Stock

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$28.000

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$28.000

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Parana Technologies

USA . 759 parts In-Stock

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$76.125

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759

$76.125

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DigiPath Technology Company

USA . 21 parts In-Stock

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$83.823

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21

$83.823

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ChromeModa Solutions

Germany . 6,381 parts In-Stock

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$85.534

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$70.138

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6,381

$85.534

$70.138

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IDEA Electronic Components Group

UK . 1,311 parts In-Stock

1+ parts

$85.534

100+ parts

$81.257

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$76.981

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1,311

$85.534

$81.257

$76.981

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Corphita

USA . 1,405 parts In-Stock

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Microchip USA

USA . 1,300 parts In-Stock

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Overview

Experience the cutting-edge technology of Texas Instruments with the LM3S801-IGZ50-C2T microcontroller. Perfect for a wide range of applications, this high-quality chip offers unmatched reliability and performance. With a 32-bit architecture and a variety of features including PWM channels and ADC channels, this microcontroller provides exceptional value to customers looking for a versatile and efficient solution. Trust in Texas Instruments for innovation and excellence in microcontrollers.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB design, making the microcontroller suitable for small and portable devices.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller is compatible with a wide range of power sources and can operate reliably within this limit.

Package Shape: SQUARE

The square package shape offers easy handling and placement on the PCB, optimizing space utilization and enhancing manufacturability.

Bit Size: 32

The 32-bit architecture provides enhanced processing capability, allowing for complex computations and faster execution of tasks.

Power Supplies (V): 3.3

Operating at a nominal supply voltage of 3.3 V, this microcontroller is energy-efficient and suitable for battery-powered applications.

No. of Terminals: 48

The high number of terminals provides ample I/O options, enabling versatile connectivity and functionality in diverse electronic systems.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers robust protection and ease of integration, ensuring reliable performance and durability in various environments.

Minimum Supply Voltage: 3 V

With a minimum supply voltage of 3 V, this microcontroller can still operate effectively under lower power conditions, enhancing its flexibility.

Maximum Operating Temperature: 85 °C

Capable of operating at temperatures up to 85°C, this microcontroller is suitable for industrial applications where high temperature ranges may be encountered.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures reliable performance even in harsh environmental conditions or cold climates.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, making the microcontroller suitable for interfacing with sensors and other analog components.

Terminal Position: QUAD

The quad terminal position offers efficient and organized pinout arrangements, facilitating easier PCB layout and reducing signal interference.

ROM Words: 65536

With a ROM capacity of 65536 words, the microcontroller can store a large amount of program code, allowing for complex algorithms and applications to be implemented.

Maximum Seated Height: 1 mm

The low seated height of 1 mm makes this microcontroller suitable for compact and slim device designs, saving space and allowing for sleek product form factors.

Width: 6.875 mm

The narrow width of 6.875 mm enables efficient board layout and integration, especially in space-constrained electronic devices or applications.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency of 0.032 MHz ensures rapid data processing and real-time responsiveness, making the microcontroller suitable for demanding tasks and applications.

Length: 6.875 mm

The compact length of 6.875 mm further contributes to the microcontroller's space-saving design and suitability for small form factor products.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this microcontroller offers robust performance and reliability in challenging operating conditions typically found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller's peripheral IC type enhances processing efficiency, speed, and power consumption, making it ideal for high-performance applications.

RAM Bytes: 8192

With 8192 bytes of RAM, the microcontroller can efficiently store and manipulate data during program execution, enabling smooth operation and multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making this microcontroller energy-efficient and reliable in various applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process, reduces soldering complexity, and enhances the mechanical reliability of the microcontroller in different operating conditions.

Maximum Supply Current: 110 mA

With a maximum supply current of 110 mA, this microcontroller's power consumption is kept within manageable limits, ensuring efficiency in energy usage and minimal heat generation.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V, the microcontroller provides stable and efficient performance, making it suitable for a wide range of electronic applications.

PWM Channels: YES

The availability of PWM channels enables precise control of analog components such as motors, LEDs, and audio devices, adding versatility and functionality to the microcontroller.

ROM Programmability: FLASH

The flash programmability of the ROM allows for easy and quick updates to the microcontroller's firmware, facilitating product enhancements and customization without needing to replace the hardware.

Terminal Pitch: 0.5 mm

The narrow terminal pitch of 0.5 mm enables high-density mounting of the microcontroller, providing more I/O lines in a limited space and enhancing overall system integration.

Speed: 50 rpm

With a speed rating of 50 rpm, this microcontroller offers efficient data processing and computational performance, suitable for a wide range of applications requiring rapid responsiveness and throughput.

No. of I/O Lines: 36

The ample number of I/O lines allows for versatile connectivity and interfacing with external devices, enhancing the microcontroller's functionality and flexibility in diverse electronic systems.

Technical Specifications

Microcontrollers LM3S801-IGZ50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

36

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S801-IGZ50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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